JPS625645U - - Google Patents

Info

Publication number
JPS625645U
JPS625645U JP1985096765U JP9676585U JPS625645U JP S625645 U JPS625645 U JP S625645U JP 1985096765 U JP1985096765 U JP 1985096765U JP 9676585 U JP9676585 U JP 9676585U JP S625645 U JPS625645 U JP S625645U
Authority
JP
Japan
Prior art keywords
circuit board
heat sink
peripheral edge
along
hybrid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985096765U
Other languages
English (en)
Other versions
JPH046209Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985096765U priority Critical patent/JPH046209Y2/ja
Publication of JPS625645U publication Critical patent/JPS625645U/ja
Application granted granted Critical
Publication of JPH046209Y2 publication Critical patent/JPH046209Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案によるハイブリツドＩＣの斜視
図で、その一部は破断面で表示されている。第２
図は、第１図のＩ―Ｉ線に沿つた断面図である。
第３図は、従来のハイブリツドＩＣの一部を示す
断面図である。 １……回路基板、１ａ〜１ｄ……回路基板の周
縁部、２，３，４，５……電子部品、７……接着
剤、８……放熱板、８ａ〜８ｄ……放熱板の周縁
部、８ｅ〜８ｆ……放熱板の脚部、９……保護樹
脂、１０……封止樹脂、１１……外部リード、１
２，１２ａ〜１２ｈ……段差部。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 複数の電子部品が固着・形成された回路面
    を有し、かつ外部リードの一端部が固着されてい
    る回路基板と、該回路基板の前記回路面とは反対
    側の主面に固着された放熱板と、該放熱板及び前
    記回路基板とを被覆する封止樹脂とを有するハイ
    ブリツトＩＣにおいて、 前記封止樹脂が粉体塗装で形成され、かつ前記
    回路基板と前記放熱板のうちいずれか一方の周縁
    が他方の周縁に対して突出することにより前記回
    路基板と前記放熱板の全周縁部に沿つて段差部が
    形成されていることを特徴とする粉体塗装で樹脂
    封止されたハイブリツドＩＣ。 (2) 前記回路基板の平面形状が四角形で、前記
    回路基板の一辺に沿つて前記外部リードが複数本
    並列配置され、前記外部リードの一端部が２又状
    に形成されて前記回路基板の端部を狭持するよう
    に固着されており、前記外部リードが並列配置さ
    れている前記回路基板の一辺に沿つて、前記回路
    基板の周縁が前記放熱板の周縁よりも突出するこ
    とによつて前記段差部が形成され、前記回路基板
    の一辺を除く他の３辺に沿つて、前記放熱板の周
    縁が前記回路基板の周縁よりも突出することによ
    つて前記段差部が形成されている実用新案登録請
    求の範囲第(1)項記載の粉体塗装で樹脂封止され
    たハイブリツドＩＣ。
JP1985096765U 1985-06-27 1985-06-27 Expired JPH046209Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985096765U JPH046209Y2 (ja) 1985-06-27 1985-06-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985096765U JPH046209Y2 (ja) 1985-06-27 1985-06-27

Publications (2)

Publication Number Publication Date
JPS625645U true JPS625645U (ja) 1987-01-14
JPH046209Y2 JPH046209Y2 (ja) 1992-02-20

Family

ID=30962893

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985096765U Expired JPH046209Y2 (ja) 1985-06-27 1985-06-27

Country Status (1)

Country Link
JP (1) JPH046209Y2 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56174859U (ja) * 1980-05-26 1981-12-23
JPS5839018A (ja) * 1981-09-02 1983-03-07 Mitsubishi Electric Corp 混成集積回路の組立方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56174859U (ja) * 1980-05-26 1981-12-23
JPS5839018A (ja) * 1981-09-02 1983-03-07 Mitsubishi Electric Corp 混成集積回路の組立方法

Also Published As

Publication number Publication date
JPH046209Y2 (ja) 1992-02-20

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