JPS6260034U - - Google Patents

Info

Publication number
JPS6260034U
JPS6260034U JP1985151573U JP15157385U JPS6260034U JP S6260034 U JPS6260034 U JP S6260034U JP 1985151573 U JP1985151573 U JP 1985151573U JP 15157385 U JP15157385 U JP 15157385U JP S6260034 U JPS6260034 U JP S6260034U
Authority
JP
Japan
Prior art keywords
circuit board
electronic component
lead
melting point
mounting structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985151573U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985151573U priority Critical patent/JPS6260034U/ja
Publication of JPS6260034U publication Critical patent/JPS6260034U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図はこの考案に係る電子部品の実装構造を
第１実施例を示す正面図、第２図はこの考案の第
２実施例を示す斜視図及び断面図、第３図は同じ
く平面図、第４図はこの考案の第３実施例を示す
斜視図及び断面図、第５図は同じく平面図、第６
図は通常の電子部品の回路基板を実装する概略構
成図を示す斜視図である。 １：回路基板、２：パターン電極、３：取出し
電極、４：ハンダバンプ、５：ＩＣチツプ、６：
サーモペイント、７：クリームハンダ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 回路基板１上に形成されたパターン電極２に、
    表面に取出し電極３を有しかつ該取出し電極３上
    にハンダバンプ４が形成された電子部品５を、フ
    エースダウンボンデイングにより実装してなる電
    子部品の実装構造において、前記電子部品５の前
    記回路基板１に対向する表面以外の表面、又は前
    記回路基板１の前記電子部品５実装面の少なくと
    もいずれか一方に、前記ハンダバンプ４の融点又
    はそれより少し高い温度で変色するボンデイング
    モニタ手段６，７を設けたことを特徴とする電子
    部品の実装構造。
JP1985151573U 1985-10-04 1985-10-04 Pending JPS6260034U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985151573U JPS6260034U (ja) 1985-10-04 1985-10-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985151573U JPS6260034U (ja) 1985-10-04 1985-10-04

Publications (1)

Publication Number Publication Date
JPS6260034U true JPS6260034U (ja) 1987-04-14

Family

ID=31068770

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985151573U Pending JPS6260034U (ja) 1985-10-04 1985-10-04

Country Status (1)

Country Link
JP (1) JPS6260034U (ja)

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