JPS62126837U - - Google Patents

Info

Publication number
JPS62126837U
JPS62126837U JP1986013481U JP1348186U JPS62126837U JP S62126837 U JPS62126837 U JP S62126837U JP 1986013481 U JP1986013481 U JP 1986013481U JP 1348186 U JP1348186 U JP 1348186U JP S62126837 U JPS62126837 U JP S62126837U
Authority
JP
Japan
Prior art keywords
substrate
electronic component
conductor
circuit board
board device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986013481U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986013481U priority Critical patent/JPS62126837U/ja
Publication of JPS62126837U publication Critical patent/JPS62126837U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/879—Bump connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の集積回路装置の縦
断正面図、第２図は本考案の他の実施例の液晶表
示装置の縦断正面図、第３図は従来のフエイスア
ツプボンデイングによる集積回路装置の縦断正面
図、第４図は従来のフエイスダウンボンデイング
による集積回路装置の縦断正面図である。 ９…集積回路形成基板、１０，１０…１０…パ
ツド、１１…ＩＣチツプ、１２，１２…１２…リ
ードフレーム、１３…ＩＣ搭載基板、１４，１４
…１４…バンプ、１５，１５…１５…ボンデイン
グワイヤ、１６…モールド。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 導体が形成された基板の面上にパツドが形
    成された電子部品を搭載し、前記基板の面上に形
    成された導体と前記電子部品に形成されたパツド
    とを接続してなる回路基板装置において、前記電
    子部品の両面に前記パツドを形成し、一方の面上
    に形成された前記パツドと前記基板の面上に形成
    された導体とをバンプを介して接続し、他方の面
    上に形成された前記パツドと前記基板の面上に形
    成された導体とをボンデイングワイヤで接続して
    なることを特徴とする回路基板装置。 (2) 電子部品が、ＩＣチツプである実用新案登
    録請求の範囲第１項記載の回路基板装置。
JP1986013481U 1986-01-31 1986-01-31 Pending JPS62126837U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986013481U JPS62126837U (ja) 1986-01-31 1986-01-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986013481U JPS62126837U (ja) 1986-01-31 1986-01-31

Publications (1)

Publication Number Publication Date
JPS62126837U true JPS62126837U (ja) 1987-08-12

Family

ID=30802578

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986013481U Pending JPS62126837U (ja) 1986-01-31 1986-01-31

Country Status (1)

Country Link
JP (1) JPS62126837U (ja)

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