JPS628021B2 - - Google Patents

Info

Publication number
JPS628021B2
JPS628021B2 JP56135280A JP13528081A JPS628021B2 JP S628021 B2 JPS628021 B2 JP S628021B2 JP 56135280 A JP56135280 A JP 56135280A JP 13528081 A JP13528081 A JP 13528081A JP S628021 B2 JPS628021 B2 JP S628021B2
Authority
JP
Japan
Prior art keywords
wire
bonding
feed length
spark
wire feed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56135280A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5834938A (ja
Inventor
Kazuya Noguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP56135280A priority Critical patent/JPS5834938A/ja
Publication of JPS5834938A publication Critical patent/JPS5834938A/ja
Publication of JPS628021B2 publication Critical patent/JPS628021B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning

Landscapes

  • Wire Bonding (AREA)
JP56135280A 1981-08-27 1981-08-27 ボンデイング装置 Granted JPS5834938A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56135280A JPS5834938A (ja) 1981-08-27 1981-08-27 ボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56135280A JPS5834938A (ja) 1981-08-27 1981-08-27 ボンデイング装置

Publications (2)

Publication Number Publication Date
JPS5834938A JPS5834938A (ja) 1983-03-01
JPS628021B2 true JPS628021B2 (mo) 1987-02-20

Family

ID=15148010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56135280A Granted JPS5834938A (ja) 1981-08-27 1981-08-27 ボンデイング装置

Country Status (1)

Country Link
JP (1) JPS5834938A (mo)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4530984B2 (ja) * 2005-12-28 2010-08-25 株式会社新川 ワイヤボンディング装置、ボンディング制御プログラム及びボンディング方法
JP5426000B2 (ja) * 2012-11-16 2014-02-26 株式会社新川 ワイヤボンディング装置及びワイヤボンディング方法

Also Published As

Publication number Publication date
JPS5834938A (ja) 1983-03-01

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