JPS63119247U - - Google Patents

Info

Publication number
JPS63119247U
JPS63119247U JP1163787U JP1163787U JPS63119247U JP S63119247 U JPS63119247 U JP S63119247U JP 1163787 U JP1163787 U JP 1163787U JP 1163787 U JP1163787 U JP 1163787U JP S63119247 U JPS63119247 U JP S63119247U
Authority
JP
Japan
Prior art keywords
smoothed
flattened
molded
semiconductor device
coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1163787U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1163787U priority Critical patent/JPS63119247U/ja
Publication of JPS63119247U publication Critical patent/JPS63119247U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Description

【図面の簡単な説明】
第１図及び第２図は本考案による半導体装置の
各例の要部の断面図、第３図Ａ及びＢは従来装置
の説明に供する要部の断面図である。 １は半導体基板、２は絶縁膜、３は配線パター
ン、４はパツシベーシヨンないしはオーバーコー
ト膜、７は無機物質、７ａはその表面、５はモー
ルドである。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子が、表面が平滑化あるいは平坦化さ
    れた無機物質により被覆されかつモールドされて
    なる半導体装置。
JP1163787U 1987-01-29 1987-01-29 Pending JPS63119247U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1163787U JPS63119247U (ja) 1987-01-29 1987-01-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1163787U JPS63119247U (ja) 1987-01-29 1987-01-29

Publications (1)

Publication Number Publication Date
JPS63119247U true JPS63119247U (ja) 1988-08-02

Family

ID=30799035

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1163787U Pending JPS63119247U (ja) 1987-01-29 1987-01-29

Country Status (1)

Country Link
JP (1) JPS63119247U (ja)

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