JPS63152619A - エポキシ樹脂硬化触媒 - Google Patents

エポキシ樹脂硬化触媒

Info

Publication number: JPS63152619A
Authority: JP; Japan
Prior art keywords: epoxy resin; sulfonium salt; catalyst; formula; naphthalene ring
Prior art date: 1986-12-16
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP29972386A

Other languages

English (en)

Japanese (ja)

Other versions

JPH0316374B2 (cs

Inventor

Misao Hiza

操日座

Shigeo Omote

表　重夫

Takeshi Endo

剛遠藤

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Yokohama Rubber Co Ltd

Original Assignee

Yokohama Rubber Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1986-12-16

Filing date

1986-12-16

Publication date

1988-06-25

1986-12-16 Application filed by Yokohama Rubber Co Ltd filed Critical Yokohama Rubber Co Ltd

1986-12-16 Priority to JP29972386A priority Critical patent/JPS63152619A/ja

1988-06-25 Publication of JPS63152619A publication Critical patent/JPS63152619A/ja

1991-03-05 Publication of JPH0316374B2 publication Critical patent/JPH0316374B2/ja

Status Granted legal-status Critical Current

Links

229920000647 polyepoxide Polymers 0.000 title claims abstract description 34
239000003822 epoxy resin Substances 0.000 title claims abstract description 33
239000003054 catalyst Substances 0.000 title claims abstract description 28
RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 claims abstract description 29
125000001624 naphthyl group Chemical group 0.000 claims abstract description 22
125000001424 substituent group Chemical group 0.000 claims abstract description 7
125000000217 alkyl group Chemical group 0.000 claims abstract description 4
125000000753 cycloalkyl group Chemical group 0.000 claims abstract description 4
125000000547 substituted alkyl group Chemical group 0.000 claims abstract description 4
125000001931 aliphatic group Chemical group 0.000 claims description 3
229910001507 metal halide Inorganic materials 0.000 claims description 3
150000005309 metal halides Chemical class 0.000 claims description 3
125000000962 organic group Chemical group 0.000 claims description 2
239000000126 substance Substances 0.000 claims description 2
229920005989 resin Polymers 0.000 abstract description 12
239000011347 resin Substances 0.000 abstract description 12
150000001875 compounds Chemical class 0.000 abstract description 9
LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract description 9
238000003860 storage Methods 0.000 abstract description 7
239000011248 coating agent Substances 0.000 abstract description 4
238000000576 coating method Methods 0.000 abstract description 4
-1 sealing media Substances 0.000 abstract description 4
239000000853 adhesive Substances 0.000 abstract description 3
230000001070 adhesive effect Effects 0.000 abstract description 3
239000002131 composite material Substances 0.000 abstract description 3
239000000463 material Substances 0.000 abstract description 3
239000011159 matrix material Substances 0.000 abstract description 3
UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical group C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 abstract 2
125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 abstract 1
150000004820 halides Chemical class 0.000 abstract 1
238000007789 sealing Methods 0.000 abstract 1
238000001723 curing Methods 0.000 description 17
239000000203 mixture Substances 0.000 description 16
238000006243 chemical reaction Methods 0.000 description 7
150000003839 salts Chemical class 0.000 description 6
125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 5
239000003795 chemical substances by application Substances 0.000 description 5
125000003700 epoxy group Chemical group 0.000 description 5
230000000052 comparative effect Effects 0.000 description 4
239000004593 Epoxy Substances 0.000 description 3
238000010521 absorption reaction Methods 0.000 description 3
238000000354 decomposition reaction Methods 0.000 description 3
239000012954 diazonium Substances 0.000 description 3
238000010438 heat treatment Methods 0.000 description 3
238000006116 polymerization reaction Methods 0.000 description 3
241000512259 Ascophyllum nodosum Species 0.000 description 2
IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
239000002841 Lewis acid Substances 0.000 description 2
KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 2
238000000862 absorption spectrum Methods 0.000 description 2
239000002253 acid Substances 0.000 description 2
150000007513 acids Chemical class 0.000 description 2
150000001989 diazonium salts Chemical class 0.000 description 2
230000009477 glass transition Effects 0.000 description 2
238000000655 nuclear magnetic resonance spectrum Methods 0.000 description 2
239000003566 sealing material Substances 0.000 description 2
239000002904 solvent Substances 0.000 description 2
VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
229930185605 Bisphenol Natural products 0.000 description 1
241000238557 Decapoda Species 0.000 description 1
BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
229910002651 NO3 Inorganic materials 0.000 description 1
NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
238000003848 UV Light-Curing Methods 0.000 description 1
125000002723 alicyclic group Chemical group 0.000 description 1
150000007824 aliphatic compounds Chemical class 0.000 description 1
150000001412 amines Chemical class 0.000 description 1
238000009835 boiling Methods 0.000 description 1
150000001244 carboxylic acid anhydrides Chemical class 0.000 description 1
230000003197 catalytic effect Effects 0.000 description 1
238000010538 cationic polymerization reaction Methods 0.000 description 1
XENVCRGQTABGKY-ZHACJKMWSA-N chlorohydrin Chemical compound CC#CC#CC#CC#C\C=C\C(Cl)CO XENVCRGQTABGKY-ZHACJKMWSA-N 0.000 description 1
230000007547 defect Effects 0.000 description 1
239000000539 dimer Substances 0.000 description 1
230000000694 effects Effects 0.000 description 1
JDVIRCVIXCMTPU-UHFFFAOYSA-N ethanamine;trifluoroborane Chemical compound CCN.FB(F)F JDVIRCVIXCMTPU-UHFFFAOYSA-N 0.000 description 1
239000012761 high-performance material Substances 0.000 description 1
238000011065 in-situ storage Methods 0.000 description 1
239000011968 lewis acid catalyst Substances 0.000 description 1
150000007517 lewis acids Chemical class 0.000 description 1
229920002521 macromolecule Polymers 0.000 description 1
QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
229910052753 mercury Inorganic materials 0.000 description 1
238000002156 mixing Methods 0.000 description 1
229910052757 nitrogen Inorganic materials 0.000 description 1
229920003986 novolac Polymers 0.000 description 1
229920000098 polyolefin Polymers 0.000 description 1
238000011417 postcuring Methods 0.000 description 1
238000001228 spectrum Methods 0.000 description 1
239000003381 stabilizer Substances 0.000 description 1
238000006467 substitution reaction Methods 0.000 description 1
150000005846 sugar alcohols Polymers 0.000 description 1
239000013638 trimer Substances 0.000 description 1

Landscapes

Epoxy Resins (AREA)

JP29972386A 1986-12-16 1986-12-16 エポキシ樹脂硬化触媒 Granted JPS63152619A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP29972386A JPS63152619A (ja)	1986-12-16	1986-12-16	エポキシ樹脂硬化触媒

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP29972386A JPS63152619A (ja)	1986-12-16	1986-12-16	エポキシ樹脂硬化触媒

Publications (2)

Publication Number	Publication Date
JPS63152619A true JPS63152619A (ja)	1988-06-25
JPH0316374B2 JPH0316374B2 (cs)	1991-03-05

Family

ID=17876184

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP29972386A Granted JPS63152619A (ja)	1986-12-16	1986-12-16	エポキシ樹脂硬化触媒

Country Status (1)

Country	Link
JP (1)	JPS63152619A (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5447797A (en) *	1992-08-10	1995-09-05	Siemens Aktiengesellschaft	Reaction resin mixture comprising epoxy resin, benzylthiolanium salt and sensitizer

1986
- 1986-12-16 JP JP29972386A patent/JPS63152619A/ja active Granted

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5447797A (en) *	1992-08-10	1995-09-05	Siemens Aktiengesellschaft	Reaction resin mixture comprising epoxy resin, benzylthiolanium salt and sensitizer

Also Published As

Publication number	Publication date
JPH0316374B2 (cs)	1991-03-05

Publication	Publication Date	Title
US3586616A (en)	1971-06-22	Bis(perfluoroalkylsulfonyl)methane metal salts in cationic polymerization
US4503211A (en)	1985-03-05	Epoxy resin curing agent, process and composition
JP2699188B2 (ja)	1998-01-19	カチオン重合性組成物、重合触媒および重合方法
US3907706A (en)	1975-09-23	Latent catalyst systems for cationically polymerizable materials
US4356050A (en)	1982-10-26	Method of adhesive bonding using visible light cured epoxies
US3721617A (en)	1973-03-20	Photopolymerizable epoxy systems containing cyclic amide gelation inhibitors
US4479860A (en)	1984-10-30	Photo-curable epoxy resin composition
JPH03237107A (ja)	1991-10-23	カチオン重合開始剤および重合性組成物
JP2000508001A (ja)	2000-06-27	化学発光により誘導される光重合反応
JPS6072918A (ja)	1985-04-25	光重合性エポキシ樹脂組成物
US4154872A (en)	1979-05-15	Process for preparing catalytic solutions of sulfonium salts
JPH10287643A (ja)	1998-10-27	新規オニウム塩、光重合開始剤、これを含有するエネルギー線硬化性組成物及びその硬化物
CA1082127A (en)	1980-07-22	Reinforced composites
JPS63152619A (ja)	1988-06-25	エポキシ樹脂硬化触媒
JPH0539336A (ja)	1993-02-19	新規なエネルギー線硬化型樹脂組成物
JPH06345726A (ja)	1994-12-20	新規スルホニウム塩化合物および重合開始剤
EP0331496A1 (en)	1989-09-06	Polyfluoride sulfonium compounds and polymerization initiator thereof
US3817850A (en)	1974-06-18	Photopolymerizable epoxy systems containing substituted acyclic amides or substituted ureas as gelation inhibitors
US3721616A (en)	1973-03-20	Photopolymerizable epoxy systems containing nitrile gelation inhibitors
US4362263A (en)	1982-12-07	Solderable solventless UV curable enamel
JPS63223002A (ja)	1988-09-16	重合用触媒
JPH0782283A (ja)	1995-03-28	ホスホニウム塩およびそれを含有するカチオン重合性組成物
US3816278A (en)	1974-06-11	Photopolymerizable epoxy systems containingn(itrile gelation inhibitors
JP4108094B2 (ja)	2008-06-25	エネルギー線硬化樹脂組成物
Nishikubo et al.	1997	Synthesis of photoreactive imidazole derivatives and thermal curing reaction of epoxy resins catalyzed by photo-generated imidazole

JPS63152619A - エポキシ樹脂硬化触媒 - Google Patents

Info

Links

Landscapes

Priority Applications (1)

Applications Claiming Priority (1)

Publications (2)

Family

ID=17876184

Family Applications (1)

Country Status (1)

Cited By (1)

Cited By (1)

Also Published As

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