JPS6316448U - - Google Patents
Info
- Publication number
- JPS6316448U JPS6316448U JP1986108788U JP10878886U JPS6316448U JP S6316448 U JPS6316448 U JP S6316448U JP 1986108788 U JP1986108788 U JP 1986108788U JP 10878886 U JP10878886 U JP 10878886U JP S6316448 U JPS6316448 U JP S6316448U
- Authority
- JP
- Japan
- Prior art keywords
- package
- electrical
- reflective material
- utility
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例の正面図、第２図は
リフロー状態を示す正面図である。 １…半導体装置（電気・電子部品）、２…パツ
ケージ、３…半導体素子チツプ、４…リード、５
…金属線、６…赤外線反射材、７…半田、８…加
熱炉、９…赤外線ランプ。
リフロー状態を示す正面図である。 １…半導体装置（電気・電子部品）、２…パツ
ケージ、３…半導体素子チツプ、４…リード、５
…金属線、６…赤外線反射材、７…半田、８…加
熱炉、９…赤外線ランプ。
Claims (1)
- 【実用新案登録請求の範囲】 (1) 赤外線を照射して半田等のリフローを行う
電気・電子部品において、そのパツケージ表面に
赤外線反射材を形成したことを特徴とする電気・
電子部品。 (2) パツケージの上面に赤外線反射材を一体に
貼着してなる実用新案登録請求の範囲第１項記載
の電気・電子部品。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986108788U JPS6316448U (ja) | 1986-07-17 | 1986-07-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986108788U JPS6316448U (ja) | 1986-07-17 | 1986-07-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6316448U true JPS6316448U (ja) | 1988-02-03 |
Family
ID=30986306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986108788U Pending JPS6316448U (ja) | 1986-07-17 | 1986-07-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6316448U (ja) |
-
1986
- 1986-07-17 JP JP1986108788U patent/JPS6316448U/ja active Pending