JPS63167726U - - Google Patents
Info
- Publication number
- JPS63167726U JPS63167726U JP6127087U JP6127087U JPS63167726U JP S63167726 U JPS63167726 U JP S63167726U JP 6127087 U JP6127087 U JP 6127087U JP 6127087 U JP6127087 U JP 6127087U JP S63167726 U JPS63167726 U JP S63167726U
- Authority
- JP
- Japan
- Prior art keywords
- boat
- grooves
- semiconductor wafer
- semiconductor wafers
- impurities
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000012535 impurity Substances 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 claims 4
- 238000009792 diffusion process Methods 0.000 claims 1
- 239000003779 heat-resistant material Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
第１図は本考案の一実施例の半導体ウエハー不
純物拡散用ボートの縦断面図、第２図は本考案の
一実施例のダミーの正面図である。 １……ボート、２……溝、３……ダミー。
純物拡散用ボートの縦断面図、第２図は本考案の
一実施例のダミーの正面図である。 １……ボート、２……溝、３……ダミー。
Claims (1)
- 半導体ウエハーを起立支持する溝を多数個配設
された不純物の拡散しない耐熱材からなる長尺の
半導体ウエハー不純物拡散用ボートにおいて、該
ボートの両端の適当数の前記溝に該ボートと同一
材料で前記半導体ウエハーと同じ形状のダミーを
固着したことを特徴とする半導体ウエハー不純物
拡散用ボート。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6127087U JPS63167726U (ja) | 1987-04-22 | 1987-04-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6127087U JPS63167726U (ja) | 1987-04-22 | 1987-04-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63167726U true JPS63167726U (ja) | 1988-11-01 |
Family
ID=30894451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6127087U Pending JPS63167726U (ja) | 1987-04-22 | 1987-04-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63167726U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996035232A1 (en) * | 1995-05-01 | 1996-11-07 | Tokyo Electron Limited | Method and device for treatment |
-
1987
- 1987-04-22 JP JP6127087U patent/JPS63167726U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996035232A1 (en) * | 1995-05-01 | 1996-11-07 | Tokyo Electron Limited | Method and device for treatment |