JPS6320445U - - Google Patents

Info

Publication number
JPS6320445U
JPS6320445U JP1986113731U JP11373186U JPS6320445U JP S6320445 U JPS6320445 U JP S6320445U JP 1986113731 U JP1986113731 U JP 1986113731U JP 11373186 U JP11373186 U JP 11373186U JP S6320445 U JPS6320445 U JP S6320445U
Authority
JP
Japan
Prior art keywords
semiconductor device
resin
encapsulating resin
external lead
bent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986113731U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986113731U priority Critical patent/JPS6320445U/ja
Publication of JPS6320445U publication Critical patent/JPS6320445U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示し、ａは断面図
、ｂは上面図、第２図は本考案のもう一つの実施
例でａは断面図、ｂは上面図、第３図は第１図の
半導体装置を重ねた状態の断面図、第４図は従来
の半導体装置を示し、ａは断面図、ｂは上面図で
ある。 １ａ……素子搭載部、１ｂ……内部リード、１
ｃ……外部リード、２……半導体素子、３……金
属細線、４……封入樹脂、４ａ……凸部、４ｂ…
…くぼみ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 封入樹脂の側面から導出された外部リードが下
    面内側に曲げ込まれた形状を有する樹脂封止型半
    導体装置において、前記半導体装置を積み重ねた
    時に上にくる半導体装置の前記曲げ込まれた外部
    リードが下にくる半導体装置の封入樹脂上面に当
    たらないように、封入樹脂上面の周囲を切り欠い
    たことを特徴とする樹脂封止型半導体装置。
JP1986113731U 1986-07-23 1986-07-23 Pending JPS6320445U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986113731U JPS6320445U (ja) 1986-07-23 1986-07-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986113731U JPS6320445U (ja) 1986-07-23 1986-07-23

Publications (1)

Publication Number Publication Date
JPS6320445U true JPS6320445U (ja) 1988-02-10

Family

ID=30995815

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986113731U Pending JPS6320445U (ja) 1986-07-23 1986-07-23

Country Status (1)

Country Link
JP (1) JPS6320445U (ja)

Similar Documents

Publication Publication Date Title
JPS6320445U (ja)
JPS6236550U (ja)
JPH0245651U (ja)
JPS6183046U (ja)
JPS6240842U (ja)
JPH0233442U (ja)
JPS63174453U (ja)
JPH0298649U (ja)
JPS64341U (ja)
JPS63180929U (ja)
JPS6181141U (ja)
JPH01112044U (ja)
JPH03101524U (ja)
JPS63174449U (ja)
JPH0284329U (ja)
JPS6371546U (ja)
JPH0252443U (ja)
JPS62180942U (ja)
JPS5856446U (ja) 樹脂封止半導体装置
JPS61114842U (ja)
JPS60106338U (ja) 樹脂封止型半導体装置
JPH0436238U (ja)
JPS6172857U (ja)
JPH0279046U (ja)
JPS61149347U (ja)