JPS6353955A - プリント配線基板の封止枠の形成方法 - Google Patents

プリント配線基板の封止枠の形成方法

Info

Publication number: JPS6353955A
Authority: JP; Japan
Prior art keywords: printed wiring; wiring board; substrate; sealing frame; screen printing
Prior art date: 1986-08-25
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP19704986A

Other languages

English (en)

Japanese (ja)

Other versions

JPH0418703B2 (de

Inventor

Mitsumasa Shinoda

篠田　光政

Masanori Sato

正則佐藤

Koichi Yoshida

浩一吉田

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

ASAKA DENSHI KK

Original Assignee

ASAKA DENSHI KK

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1986-08-25

Filing date

1986-08-25

Publication date

1988-03-08

1986-08-25 Application filed by ASAKA DENSHI KK filed Critical ASAKA DENSHI KK

1986-08-25 Priority to JP19704986A priority Critical patent/JPS6353955A/ja

1988-03-08 Publication of JPS6353955A publication Critical patent/JPS6353955A/ja

1992-03-27 Publication of JPH0418703B2 publication Critical patent/JPH0418703B2/ja

Status Granted legal-status Critical Current

Links

238000007789 sealing Methods 0.000 title claims abstract description 42
230000015572 biosynthetic process Effects 0.000 title abstract description 4
238000000034 method Methods 0.000 claims abstract description 10
238000007650 screen-printing Methods 0.000 claims description 29
229920005989 resin Polymers 0.000 claims description 24
239000011347 resin Substances 0.000 claims description 24
239000004065 semiconductor Substances 0.000 claims description 19
229910000679 solder Inorganic materials 0.000 claims description 11
229920001187 thermosetting polymer Polymers 0.000 claims description 7
239000004020 conductor Substances 0.000 claims description 6
238000007639 printing Methods 0.000 abstract description 9
239000000758 substrate Substances 0.000 abstract description 9
239000003822 epoxy resin Substances 0.000 abstract description 8
229920000647 polyepoxide Polymers 0.000 abstract description 8
238000013007 heat curing Methods 0.000 abstract 1
239000011248 coating agent Substances 0.000 description 3
238000000576 coating method Methods 0.000 description 3
239000004033 plastic Substances 0.000 description 3
239000000853 adhesive Substances 0.000 description 2
230000001070 adhesive effect Effects 0.000 description 2
239000000839 emulsion Substances 0.000 description 2
238000005530 etching Methods 0.000 description 2
238000003825 pressing Methods 0.000 description 2
238000004026 adhesive bonding Methods 0.000 description 1
238000007796 conventional method Methods 0.000 description 1
230000007797 corrosion Effects 0.000 description 1
238000005260 corrosion Methods 0.000 description 1
238000010586 diagram Methods 0.000 description 1
230000000694 effects Effects 0.000 description 1
239000004744 fabric Substances 0.000 description 1
238000010438 heat treatment Methods 0.000 description 1
239000007788 liquid Substances 0.000 description 1
239000000463 material Substances 0.000 description 1
239000008188 pellet Substances 0.000 description 1
230000035939 shock Effects 0.000 description 1
229910052710 silicon Inorganic materials 0.000 description 1
239000010703 silicon Substances 0.000 description 1
BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1

Landscapes

Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Non-Metallic Protective Coatings For Printed Circuits (AREA)

JP19704986A 1986-08-25 1986-08-25 プリント配線基板の封止枠の形成方法 Granted JPS6353955A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP19704986A JPS6353955A (ja)	1986-08-25	1986-08-25	プリント配線基板の封止枠の形成方法

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP19704986A JPS6353955A (ja)	1986-08-25	1986-08-25	プリント配線基板の封止枠の形成方法

Publications (2)

Publication Number	Publication Date
JPS6353955A true JPS6353955A (ja)	1988-03-08
JPH0418703B2 JPH0418703B2 (de)	1992-03-27

Family

ID=16367861

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP19704986A Granted JPS6353955A (ja)	1986-08-25	1986-08-25	プリント配線基板の封止枠の形成方法

Country Status (1)

Country	Link
JP (1)	JPS6353955A (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE3135952A1 (de)	1981-09-10	1983-04-21	Siemens AG, 1000 Berlin und 8000 München	Gegentakt-ausgangsschaltung fuer ein verknuepfungsglied in stromschaltertechnik.
WO1997033304A3 (en) *	1996-02-23	1997-10-16	Mpm Corp	Applying encapsulating material to substrates

Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS57106058A (en) *	1980-12-23	1982-07-01	Nitto Electric Ind Co Ltd	Manufacture of frame body

1986
- 1986-08-25 JP JP19704986A patent/JPS6353955A/ja active Granted

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS57106058A (en) *	1980-12-23	1982-07-01	Nitto Electric Ind Co Ltd	Manufacture of frame body

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE3135952A1 (de)	1981-09-10	1983-04-21	Siemens AG, 1000 Berlin und 8000 München	Gegentakt-ausgangsschaltung fuer ein verknuepfungsglied in stromschaltertechnik.
DE3135952C2 (de)	1981-09-10	1983-11-17	Siemens AG, 1000 Berlin und 8000 München	Gegentakt-Ausgangsschaltung für ein Verknüpfungsglied in Stromschaltertechnik.
WO1997033304A3 (en) *	1996-02-23	1997-10-16	Mpm Corp	Applying encapsulating material to substrates
US6067709A (en) *	1996-02-23	2000-05-30	Mpm Corporation	Applying encapsulating material to substrates

Also Published As

Publication number	Publication date
JPH0418703B2 (de)	1992-03-27

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Legal Events

Date	Code	Title	Description
2004-03-02	R250	Receipt of annual fees	Free format text: JAPANESE INTERMEDIATE CODE: R250
2005-03-01	R250	Receipt of annual fees	Free format text: JAPANESE INTERMEDIATE CODE: R250
2006-02-28	R250	Receipt of annual fees	Free format text: JAPANESE INTERMEDIATE CODE: R250
2006-08-25	EXPY	Cancellation because of completion of term