JPH0310532U - - Google Patents
Info
- Publication number
- JPH0310532U JPH0310532U JP1989071992U JP7199289U JPH0310532U JP H0310532 U JPH0310532 U JP H0310532U JP 1989071992 U JP1989071992 U JP 1989071992U JP 7199289 U JP7199289 U JP 7199289U JP H0310532 U JPH0310532 U JP H0310532U
- Authority
- JP
- Japan
- Prior art keywords
- electrode pad
- window opening
- insulating film
- semiconductor element
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案に係る半導体装置の一実施例を
示すその半導体素子の要部側断面図、第２図と第
３図は従来の半導体装置の一具体例を示すその半
導体素子の平面図とその要部側断面図である。 １……半導体素子、２……第１電極パツド、４
……絶縁膜、４ａ……窓開け部、６……第２電極
パツド、６ａ……周縁部。
示すその半導体素子の要部側断面図、第２図と第
３図は従来の半導体装置の一具体例を示すその半
導体素子の平面図とその要部側断面図である。 １……半導体素子、２……第１電極パツド、４
……絶縁膜、４ａ……窓開け部、６……第２電極
パツド、６ａ……周縁部。
Claims (1)
- 【実用新案登録請求の範囲】 第１電極パツドの配設面上に、窓開け部を有す
る絶縁膜を被着・形成した半導体素子からなり、 上記窓開け部に、その周縁部から絶縁膜上を被
覆する第２電極パツドを積層して形成したことを
特徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989071992U JPH0310532U (ja) | 1989-06-20 | 1989-06-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989071992U JPH0310532U (ja) | 1989-06-20 | 1989-06-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0310532U true JPH0310532U (ja) | 1991-01-31 |
Family
ID=31609525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989071992U Pending JPH0310532U (ja) | 1989-06-20 | 1989-06-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0310532U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007291561A (ja) * | 2006-04-25 | 2007-11-08 | L Rose:Kk | 内側全面にシルク生地を縫い合わせた下着 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5192171A (ja) * | 1975-02-10 | 1976-08-12 | ||
| JPS5295171A (en) * | 1976-02-06 | 1977-08-10 | Hitachi Ltd | Electrode for semi-conductor |
| JPS6338236A (ja) * | 1986-08-01 | 1988-02-18 | Fujitsu Ltd | 半導体装置 |
-
1989
- 1989-06-20 JP JP1989071992U patent/JPH0310532U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5192171A (ja) * | 1975-02-10 | 1976-08-12 | ||
| JPS5295171A (en) * | 1976-02-06 | 1977-08-10 | Hitachi Ltd | Electrode for semi-conductor |
| JPS6338236A (ja) * | 1986-08-01 | 1988-02-18 | Fujitsu Ltd | 半導体装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007291561A (ja) * | 2006-04-25 | 2007-11-08 | L Rose:Kk | 内側全面にシルク生地を縫い合わせた下着 |