JPH0282035U - - Google Patents
Info
- Publication number
- JPH0282035U JPH0282035U JP1988161424U JP16142488U JPH0282035U JP H0282035 U JPH0282035 U JP H0282035U JP 1988161424 U JP1988161424 U JP 1988161424U JP 16142488 U JP16142488 U JP 16142488U JP H0282035 U JPH0282035 U JP H0282035U
- Authority
- JP
- Japan
- Prior art keywords
- conductor film
- thick
- semiconductor chip
- circuit board
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Die Bonding (AREA)
Description
第１図は本考案の一実施例の縦断面図、第２図
は従来構造の縦断面図、第３図は従来の不具合を
説明するための第２図の一部の拡大断面図である
。 １……絶縁基板（アルミナ基板）、２……導体
膜、３……抵抗膜、４……ガラス保護膜、５……
ダイオード（半導体チツプ）、６……厚い導体膜
、７……高温ロー材。
は従来構造の縦断面図、第３図は従来の不具合を
説明するための第２図の一部の拡大断面図である
。 １……絶縁基板（アルミナ基板）、２……導体
膜、３……抵抗膜、４……ガラス保護膜、５……
ダイオード（半導体チツプ）、６……厚い導体膜
、７……高温ロー材。
Claims (1)
- 絶縁基板上に形成した薄い導体膜上にシリコン
を含むロー材で半導体チツプを搭載する厚膜回路
基板において、前記半導体チツプを搭載する箇所
の前記導体膜上に厚い導体膜を選択的に形成した
ことを特徴とする厚膜回路基板。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988161424U JPH0282035U (ja) | 1988-12-13 | 1988-12-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988161424U JPH0282035U (ja) | 1988-12-13 | 1988-12-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0282035U true JPH0282035U (ja) | 1990-06-25 |
Family
ID=31444347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988161424U Pending JPH0282035U (ja) | 1988-12-13 | 1988-12-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0282035U (ja) |
-
1988
- 1988-12-13 JP JP1988161424U patent/JPH0282035U/ja active Pending