JPS6413127U - - Google Patents

Info

Publication number
JPS6413127U
JPS6413127U JP1987106625U JP10662587U JPS6413127U JP S6413127 U JPS6413127 U JP S6413127U JP 1987106625 U JP1987106625 U JP 1987106625U JP 10662587 U JP10662587 U JP 10662587U JP S6413127 U JPS6413127 U JP S6413127U
Authority
JP
Japan
Prior art keywords
film
protective film
thermosetting
lead
insulating coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987106625U
Other languages
English (en)
Other versions
JPH0442922Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987106625U priority Critical patent/JPH0442922Y2/ja
Publication of JPS6413127U publication Critical patent/JPS6413127U/ja
Application granted granted Critical
Publication of JPH0442922Y2 publication Critical patent/JPH0442922Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図はこの考案に係るフイルムキヤリアを適
用した半導体装置の要部断面図、第２図、第３図
はそれぞれ従来の半導体装置用フイルムキヤリア
の平面図、要部断面図である。 １……フイルム基板、２……リード、７……保
護膜、８……熱収縮吸収膜（熱硬化性絶縁塗布膜
）。

Claims (1)

  1. 【実用新案登録請求の範囲】 フイルム基板上にリードを形成するとともに、
    半導体チツプをボンディングする前記リードの先
    端部周辺に熱硬化性保護膜を塗布形成したフイル
    ムキヤリアにおいて、 前記保護膜と略同程度に熱収縮する熱硬化性絶縁
    塗布膜を前記保護膜の形成面裏面に形成したこと
    を特徴とするフイルムキヤリア。
JP1987106625U 1987-07-10 1987-07-10 Expired JPH0442922Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987106625U JPH0442922Y2 (ja) 1987-07-10 1987-07-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987106625U JPH0442922Y2 (ja) 1987-07-10 1987-07-10

Publications (2)

Publication Number Publication Date
JPS6413127U true JPS6413127U (ja) 1989-01-24
JPH0442922Y2 JPH0442922Y2 (ja) 1992-10-12

Family

ID=31340304

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987106625U Expired JPH0442922Y2 (ja) 1987-07-10 1987-07-10

Country Status (1)

Country Link
JP (1) JPH0442922Y2 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02185051A (ja) * 1989-01-12 1990-07-19 Hitachi Cable Ltd 両面保護コート型ｔａｂ用テープキャリア
JPH0382047A (ja) * 1989-08-24 1991-04-08 Nec Corp フィルムキャリヤ半導体装置
US7408242B2 (en) 2001-05-15 2008-08-05 Oki Electric Industry Co., Ltd. Carrier with reinforced leads that are to be connected to a chip

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02185051A (ja) * 1989-01-12 1990-07-19 Hitachi Cable Ltd 両面保護コート型ｔａｂ用テープキャリア
JPH0382047A (ja) * 1989-08-24 1991-04-08 Nec Corp フィルムキャリヤ半導体装置
US7408242B2 (en) 2001-05-15 2008-08-05 Oki Electric Industry Co., Ltd. Carrier with reinforced leads that are to be connected to a chip

Also Published As

Publication number Publication date
JPH0442922Y2 (ja) 1992-10-12

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