JPH0178032U - - Google Patents

Info

Publication number
JPH0178032U
JPH0178032U JP1987173904U JP17390487U JPH0178032U JP H0178032 U JPH0178032 U JP H0178032U JP 1987173904 U JP1987173904 U JP 1987173904U JP 17390487 U JP17390487 U JP 17390487U JP H0178032 U JPH0178032 U JP H0178032U
Authority
JP
Japan
Prior art keywords
bonding pad
pad portion
semiconductor device
protective film
surface protective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987173904U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987173904U priority Critical patent/JPH0178032U/ja
Publication of JPH0178032U publication Critical patent/JPH0178032U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Local Oxidation Of Silicon (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の半導体装置の部分
断面図、第２図はその平面図、第３図は従来の半
導体装置の部分断面図である。 １……シリコン基板、２……絶縁膜、３……ボ
ンデイングパツド部、４……表面保護膜、５……
動作領域部、６……金属細線、７……周辺金属層
。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体基板の表面に形成した表面保護膜を開口
    してボンデイングパツド部を形成し、かつ全体を
    樹脂でパツケージ封止してなる半導体装置におい
    て、前記ボンデイングパツド部の周囲の表面保護
    膜上に周辺金属層を形成したことを特徴とする半
    導体装置。
JP1987173904U 1987-11-16 1987-11-16 Pending JPH0178032U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987173904U JPH0178032U (ja) 1987-11-16 1987-11-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987173904U JPH0178032U (ja) 1987-11-16 1987-11-16

Publications (1)

Publication Number Publication Date
JPH0178032U true JPH0178032U (ja) 1989-05-25

Family

ID=31465789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987173904U Pending JPH0178032U (ja) 1987-11-16 1987-11-16

Country Status (1)

Country Link
JP (1) JPH0178032U (ja)

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