JPS6413152U - - Google Patents

Info

Publication number
JPS6413152U
JPS6413152U JP10796387U JP10796387U JPS6413152U JP S6413152 U JPS6413152 U JP S6413152U JP 10796387 U JP10796387 U JP 10796387U JP 10796387 U JP10796387 U JP 10796387U JP S6413152 U JPS6413152 U JP S6413152U
Authority
JP
Japan
Prior art keywords
lead
plated
package
lsi package
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10796387U
Other languages
English (en)
Other versions
JPH0625017Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987107963U priority Critical patent/JPH0625017Y2/ja
Publication of JPS6413152U publication Critical patent/JPS6413152U/ja
Application granted granted Critical
Publication of JPH0625017Y2 publication Critical patent/JPH0625017Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例の縦断面図、第２図は
本考案品の使用状況を示す側面図、第３図は表面
実装の全体を示す斜視図、第４図は従来のリード
の縦断面図、第５図はその使用状況の側面図であ
る。 １……プリント基板、２，２′……ＬＳＩパツ
ケージ、３……パツケージ基板、４，４′……リ
ード、５……パツド、６，６′……半田、７……
素材、８……第１めつき、９，９′……第２めつ
き。

Claims (1)

    【実用新案登録請求の範囲】
  1. プリント基板上に表面実装されるＬＳＩパツケ
    ージのパツケージ基板から突出したリードの構造
    において、このリードの素材の全表面に半田付け
    性の悪い材料をめつきし、その上にリード先端部
    のみに半田付け性の良い材料をめつきしたことを
    特徴とするＬＳＩパツケージのリード構造。
JP1987107963U 1987-07-14 1987-07-14 Ｌｓｉパッケ−ジのリ−ド構造 Expired - Lifetime JPH0625017Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987107963U JPH0625017Y2 (ja) 1987-07-14 1987-07-14 Ｌｓｉパッケ−ジのリ−ド構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987107963U JPH0625017Y2 (ja) 1987-07-14 1987-07-14 Ｌｓｉパッケ−ジのリ−ド構造

Publications (2)

Publication Number Publication Date
JPS6413152U true JPS6413152U (ja) 1989-01-24
JPH0625017Y2 JPH0625017Y2 (ja) 1994-06-29

Family

ID=31342853

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987107963U Expired - Lifetime JPH0625017Y2 (ja) 1987-07-14 1987-07-14 Ｌｓｉパッケ−ジのリ−ド構造

Country Status (1)

Country Link
JP (1) JPH0625017Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0372662A (ja) * 1989-05-10 1991-03-27 Hitachi Ltd 半導体装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4709502B2 (ja) * 2004-05-14 2011-06-22 タイコエレクトロニクスジャパン合同会社 基板実装型電気コネクタ

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60154545A (ja) * 1984-01-23 1985-08-14 Nec Corp 半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60154545A (ja) * 1984-01-23 1985-08-14 Nec Corp 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0372662A (ja) * 1989-05-10 1991-03-27 Hitachi Ltd 半導体装置

Also Published As

Publication number Publication date
JPH0625017Y2 (ja) 1994-06-29

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