JPS6420727U - - Google Patents

Info

Publication number
JPS6420727U
JPS6420727U JP1987114866U JP11486687U JPS6420727U JP S6420727 U JPS6420727 U JP S6420727U JP 1987114866 U JP1987114866 U JP 1987114866U JP 11486687 U JP11486687 U JP 11486687U JP S6420727 U JPS6420727 U JP S6420727U
Authority
JP
Japan
Prior art keywords
semiconductor chip
ceramic package
metal pedestal
cavity
storing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987114866U
Other languages
English (en)
Other versions
JPH0621237Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987114866U priority Critical patent/JPH0621237Y2/ja
Publication of JPS6420727U publication Critical patent/JPS6420727U/ja
Application granted granted Critical
Publication of JPH0621237Y2 publication Critical patent/JPH0621237Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案のセラミツクパツケージを説明
する断面図、第２図は本考案の実施例に係るセラ
ミツクパツケージを説明する図、第３図は本考案
の別の実施例に係るメタル台座を説明する図、第
４図は従来例に係るセラミツクパツケージを説明
する図である。 （符号の説明）、１，８…セラミツク基体、２
…半導体チツプ、３…ボンデイングワイヤ、４…
Ａｕペースト又はＡｕメツキ、５…Ａｕ又はＡｕ
Ｓｉ、６…メタル台座、７，１５…空洞部、９…
メタライズ層（Ｗ）、１０，１２…Ｎｉメツキ、
１１…コバール材、１３…ロー材（Ａｇ，Ｃｕ）
、１４…Ａｕメツキ。

Claims (1)

  1. 【実用新案登録請求の範囲】 半導体チツプを格納するセラミツクパツケージ
    において、 半導体チツプを固着するための空洞部を備える
    メタル台座を有するセラミツクパツケージ。
JP1987114866U 1987-07-27 1987-07-27 セラミツクパツケ−ジ Expired - Lifetime JPH0621237Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987114866U JPH0621237Y2 (ja) 1987-07-27 1987-07-27 セラミツクパツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987114866U JPH0621237Y2 (ja) 1987-07-27 1987-07-27 セラミツクパツケ−ジ

Publications (2)

Publication Number Publication Date
JPS6420727U true JPS6420727U (ja) 1989-02-01
JPH0621237Y2 JPH0621237Y2 (ja) 1994-06-01

Family

ID=31356000

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987114866U Expired - Lifetime JPH0621237Y2 (ja) 1987-07-27 1987-07-27 セラミツクパツケ−ジ

Country Status (1)

Country Link
JP (1) JPH0621237Y2 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57111050A (en) * 1980-12-26 1982-07-10 Fujitsu Ltd Semiconductor device
JPS5833860A (ja) * 1981-08-10 1983-02-28 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 熱的ブリッジ素子
JPS6183041U (ja) * 1984-11-07 1986-06-02

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57111050A (en) * 1980-12-26 1982-07-10 Fujitsu Ltd Semiconductor device
JPS5833860A (ja) * 1981-08-10 1983-02-28 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 熱的ブリッジ素子
JPS6183041U (ja) * 1984-11-07 1986-06-02

Also Published As

Publication number Publication date
JPH0621237Y2 (ja) 1994-06-01

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