JPH033749U - - Google Patents

Info

Publication number
JPH033749U
JPH033749U JP1989064463U JP6446389U JPH033749U JP H033749 U JPH033749 U JP H033749U JP 1989064463 U JP1989064463 U JP 1989064463U JP 6446389 U JP6446389 U JP 6446389U JP H033749 U JPH033749 U JP H033749U
Authority
JP
Japan
Prior art keywords
integrated circuit
pedestal
heat sink
semiconductor integrated
circuit package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989064463U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989064463U priority Critical patent/JPH033749U/ja
Publication of JPH033749U publication Critical patent/JPH033749U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Description

【図面の簡単な説明】
第1図は本考案の半導体集積回路パツケージの
縦断面図、第2図は従来の半導体集積回路パツケ
ージの縦断面図である。 1……ヒートシンク、1a……強磁性体ヒート
シンク、2……半導体集積回路パツケージ、3…
…半導体チツプ、4……台座、4a……永久磁石
台座、5……ボンデイングワイヤ、6……キヤツ
プ、7……金属、8……ろう材又は接着剤。

Claims (1)

    【実用新案登録請求の範囲】
  1. 表面に半導体チツプが接着される台座の裏面を
    パツケージから露出させ、この露出面にヒートシ
    ンクを接合してなる半導体集積回路パツケージに
    おいて、前記台座を永久磁石で構成し、強磁性体
    材料からなるヒートシンクを着脱自在としたこと
    を特徴とする半導体集積回路パツケージ。
JP1989064463U 1989-05-31 1989-05-31 Pending JPH033749U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989064463U JPH033749U (ja) 1989-05-31 1989-05-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989064463U JPH033749U (ja) 1989-05-31 1989-05-31

Publications (1)

Publication Number Publication Date
JPH033749U true JPH033749U (ja) 1991-01-16

Family

ID=31595437

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989064463U Pending JPH033749U (ja) 1989-05-31 1989-05-31

Country Status (1)

Country Link
JP (1) JPH033749U (ja)

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