JPH0367430U - - Google Patents

Info

Publication number
JPH0367430U
JPH0367430U JP1989128736U JP12873689U JPH0367430U JP H0367430 U JPH0367430 U JP H0367430U JP 1989128736 U JP1989128736 U JP 1989128736U JP 12873689 U JP12873689 U JP 12873689U JP H0367430 U JPH0367430 U JP H0367430U
Authority
JP
Japan
Prior art keywords
package
internal connection
connection terminal
protrusion
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989128736U
Other languages
English (en)
Other versions
JPH0719148Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989128736U priority Critical patent/JPH0719148Y2/ja
Publication of JPH0367430U publication Critical patent/JPH0367430U/ja
Application granted granted Critical
Publication of JPH0719148Y2 publication Critical patent/JPH0719148Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図Ａ，Ｂ，Ｃは本考案でのマイクロ波パツ
ケージの構造例を示す図、第２図Ａ，Ｂ，Ｃは従
来例のマイクロ波パツケージの構造例を示す図、
である。 図において、１……外部端子、３……内部接続
端子、３ａ……突出部、５……パツケージ、５ｂ
……切欠部、７……集積基板、８……ベアチツプ
、９……金ワイヤ、を示す。

Claims (1)

  1. 【実用新案登録請求の範囲】 マイクロ波信号の入出力端子なる外部端子１と
    、外部バイアスを供給する内部接続端子３と、実
    装面上にチツプ形状の半導体素子８を搭載した集
    積基板７とからなり、かつそれぞれが金ワイヤ９
    により接続されてパツケージ５に収納されたるも
    のにおいて、 一方側の突出部３ａが前記パツケージ５の底部
    ５ａより低くなるように前記内部接続端子３を設
    け、かつ該内部接続端子３の前記突出部３ａの周
    囲の前記パツケージ５の部分にワイヤボンデイン
    グを可能にする切欠部５ｂを設け、 前記内部接続端子３の上面領域を集積基板７の
    実装可能領域にしたことを特徴とするマイクロ波
    回路用パツケージ。
JP1989128736U 1989-11-01 1989-11-01 マイクロ波回路用パッケージ Expired - Lifetime JPH0719148Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989128736U JPH0719148Y2 (ja) 1989-11-01 1989-11-01 マイクロ波回路用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989128736U JPH0719148Y2 (ja) 1989-11-01 1989-11-01 マイクロ波回路用パッケージ

Publications (2)

Publication Number Publication Date
JPH0367430U true JPH0367430U (ja) 1991-07-01
JPH0719148Y2 JPH0719148Y2 (ja) 1995-05-01

Family

ID=31676422

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989128736U Expired - Lifetime JPH0719148Y2 (ja) 1989-11-01 1989-11-01 マイクロ波回路用パッケージ

Country Status (1)

Country Link
JP (1) JPH0719148Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008026568A (ja) * 2006-07-20 2008-02-07 Olympus Corp 光学顕微鏡

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008026568A (ja) * 2006-07-20 2008-02-07 Olympus Corp 光学顕微鏡

Also Published As

Publication number Publication date
JPH0719148Y2 (ja) 1995-05-01

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