JPS6426836U - - Google Patents

Info

Publication number
JPS6426836U
JPS6426836U JP12130287U JP12130287U JPS6426836U JP S6426836 U JPS6426836 U JP S6426836U JP 12130287 U JP12130287 U JP 12130287U JP 12130287 U JP12130287 U JP 12130287U JP S6426836 U JPS6426836 U JP S6426836U
Authority
JP
Japan
Prior art keywords
semiconductor substrate
etching
etching apparatus
chemical
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12130287U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12130287U priority Critical patent/JPS6426836U/ja
Publication of JPS6426836U publication Critical patent/JPS6426836U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cleaning By Liquid Or Steam (AREA)
  • Weting (AREA)

Description

【図面の簡単な説明】
第1図は本考案の一実施例の概略断面図である
。 1……エツチング槽、2……スプレーノズル。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体基板を薬液によりエツチング処理する半
    導体基板薬液エツチング装置において、エツチン
    グ槽の内壁をスプレー洗浄するスプレーノズルが
    設けられていることを特徴とする半導体基板エツ
    チング装置。
JP12130287U 1987-08-06 1987-08-06 Pending JPS6426836U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12130287U JPS6426836U (ja) 1987-08-06 1987-08-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12130287U JPS6426836U (ja) 1987-08-06 1987-08-06

Publications (1)

Publication Number Publication Date
JPS6426836U true JPS6426836U (ja) 1989-02-15

Family

ID=31368185

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12130287U Pending JPS6426836U (ja) 1987-08-06 1987-08-06

Country Status (1)

Country Link
JP (1) JPS6426836U (ja)

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