JPS6429846U - - Google Patents

Info

Publication number
JPS6429846U
JPS6429846U JP12426687U JP12426687U JPS6429846U JP S6429846 U JPS6429846 U JP S6429846U JP 12426687 U JP12426687 U JP 12426687U JP 12426687 U JP12426687 U JP 12426687U JP S6429846 U JPS6429846 U JP S6429846U
Authority
JP
Japan
Prior art keywords
pellet
semiconductor
metal substrate
aluminum electrode
lead terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12426687U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12426687U priority Critical patent/JPS6429846U/ja
Publication of JPS6429846U publication Critical patent/JPS6429846U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例に係る半導体装置の
断面図、第２図は従来の半導体装置でａは上面図
、ｂは断面図、第３図は本考案の半導体装置に用
いられるトランジスタペレツトで、ａは上面図、
ｂは等価回路を示す。 １１……金属基板、１２……半導体ペレツト、
１５……アルミワイヤ、１６……半田、１７……
外部引出し端子板。

Claims (1)

    【実用新案登録請求の範囲】
  1. 金属基板に固着された半導体ペレツトを備え、
    このペレツトのアルミ電極から引き出されたリー
    ドワイヤが金属基板上で絶縁板を介して固着され
    る外部引出し端子板に接続されてなるものにおい
    て、前記半導体ペレツトのアルミ電極の一部に金
    属層を積層し、この積層部に外部引出し端子をろ
    う付けすることを特徴とする半導体装置。
JP12426687U 1987-08-13 1987-08-13 Pending JPS6429846U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12426687U JPS6429846U (ja) 1987-08-13 1987-08-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12426687U JPS6429846U (ja) 1987-08-13 1987-08-13

Publications (1)

Publication Number Publication Date
JPS6429846U true JPS6429846U (ja) 1989-02-22

Family

ID=31373850

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12426687U Pending JPS6429846U (ja) 1987-08-13 1987-08-13

Country Status (1)

Country Link
JP (1) JPS6429846U (ja)

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