JPS6033441U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6033441U
JPS6033441U JP1983124726U JP12472683U JPS6033441U JP S6033441 U JPS6033441 U JP S6033441U JP 1983124726 U JP1983124726 U JP 1983124726U JP 12472683 U JP12472683 U JP 12472683U JP S6033441 U JPS6033441 U JP S6033441U
Authority
JP
Japan
Prior art keywords
terminal
substrate
electrode
semiconductor substrate
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983124726U
Other languages
English (en)
Other versions
JPH0447963Y2 (ja
Inventor
仁平　一也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP1983124726U priority Critical patent/JPS6033441U/ja
Publication of JPS6033441U publication Critical patent/JPS6033441U/ja
Application granted granted Critical
Publication of JPH0447963Y2 publication Critical patent/JPH0447963Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来のパワートランジスタの一例のパッケージ
前の斜視図、第２図は本考案の一実施例のパッケージ前
の斜視図、第３図は別の実施例の基板部の側面図である
。 １・・・半導体チップ、２・・・金属基板、５・・・セ
ラミック板、４・・・ベース端子、５・・・アルミニウ
ム線、６・・・エミッタ端子、７・・・コレクタ端子、
６１，７１・・・端子立上り部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体基板の一面が導電性基板上に導電的に固着され、
    該半導体基板の上面の電極と導線によって接続される少
    なくとも二つの端子と、導電性基板に導電的に固着され
    た一つの端子とが基板面に対して垂直方向に引き出され
    るものにおいて、半導体基板の上面の電極と接続される
    第一の端子が導電性基板に固着されｈ第二の端子の上に
    絶縁物を介して積み重ねられ、半導体基板をはさんで半
    導体基板の上面の電極と接続される第三の端子と平行に
    対向して位置し、かつ第一の端子と第二の端子はそれら
    の長手方向の異なる端において引き出されたことを特徴
    とする半導体装置。
JP1983124726U 1983-08-11 1983-08-11 半導体装置 Granted JPS6033441U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983124726U JPS6033441U (ja) 1983-08-11 1983-08-11 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983124726U JPS6033441U (ja) 1983-08-11 1983-08-11 半導体装置

Publications (2)

Publication Number Publication Date
JPS6033441U true JPS6033441U (ja) 1985-03-07
JPH0447963Y2 JPH0447963Y2 (ja) 1992-11-12

Family

ID=30284217

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983124726U Granted JPS6033441U (ja) 1983-08-11 1983-08-11 半導体装置

Country Status (1)

Country Link
JP (1) JPS6033441U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001308265A (ja) * 2000-04-21 2001-11-02 Toyota Industries Corp 半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57111054A (en) * 1980-12-27 1982-07-10 Toshiba Corp Semiconductor device
JPS5893361A (ja) * 1981-11-30 1983-06-03 Mitsubishi Electric Corp 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57111054A (en) * 1980-12-27 1982-07-10 Toshiba Corp Semiconductor device
JPS5893361A (ja) * 1981-11-30 1983-06-03 Mitsubishi Electric Corp 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001308265A (ja) * 2000-04-21 2001-11-02 Toyota Industries Corp 半導体装置

Also Published As

Publication number Publication date
JPH0447963Y2 (ja) 1992-11-12

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