JPS6431426A - Resin sealing apparatus for semiconductor device - Google Patents

Resin sealing apparatus for semiconductor device

Info

Publication number
JPS6431426A
JPS6431426A JP18731887A JP18731887A JPS6431426A JP S6431426 A JPS6431426 A JP S6431426A JP 18731887 A JP18731887 A JP 18731887A JP 18731887 A JP18731887 A JP 18731887A JP S6431426 A JPS6431426 A JP S6431426A
Authority
JP
Japan
Prior art keywords
block
interval
base
plate
clamping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18731887A
Other languages
English (en)
Inventor
Koji Tsutsumi
Yutaka Morita
Hiromichi Yamada
Suekichi Tanaka
Hideaki Suezaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP18731887A priority Critical patent/JPS6431426A/ja
Priority to US07/219,483 priority patent/US4915608A/en
Publication of JPS6431426A publication Critical patent/JPS6431426A/ja
Priority to US07/447,866 priority patent/US4983111A/en
Priority to US07/447,917 priority patent/US5059379A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1742—Mounting of moulds; Mould supports
    • B29C45/1744—Mould support platens

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP18731887A 1987-07-20 1987-07-27 Resin sealing apparatus for semiconductor device Pending JPS6431426A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP18731887A JPS6431426A (en) 1987-07-27 1987-07-27 Resin sealing apparatus for semiconductor device
US07/219,483 US4915608A (en) 1987-07-20 1988-07-15 Device for resin sealing semiconductor devices
US07/447,866 US4983111A (en) 1987-07-20 1989-12-08 Device for resin sealing semiconductor devices
US07/447,917 US5059379A (en) 1987-07-20 1989-12-08 Method of resin sealing semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18731887A JPS6431426A (en) 1987-07-27 1987-07-27 Resin sealing apparatus for semiconductor device

Publications (1)

Publication Number Publication Date
JPS6431426A true JPS6431426A (en) 1989-02-01

Family

ID=16203907

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18731887A Pending JPS6431426A (en) 1987-07-20 1987-07-27 Resin sealing apparatus for semiconductor device

Country Status (1)

Country Link
JP (1) JPS6431426A (ja)

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