JPS64347U - - Google Patents
Info
- Publication number
- JPS64347U JPS64347U JP1987094933U JP9493387U JPS64347U JP S64347 U JPS64347 U JP S64347U JP 1987094933 U JP1987094933 U JP 1987094933U JP 9493387 U JP9493387 U JP 9493387U JP S64347 U JPS64347 U JP S64347U
- Authority
- JP
- Japan
- Prior art keywords
- light
- receiving element
- filter glass
- translucent
- element chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Description
第１図は本考案による受光素子のパツケージ構
造の一例を示す断面図、第２図は同実施例の製造
時の様子を示す斜視図、第３図及び第４図は夫々
異なる従来例の受光素子のパツケージ構造を示す
断面図である。 １……リードフレーム、２……受光素子チツプ
、２ａ……有効受光面、３……フイルターガラス
、４……透光性・可撓性を有する樹脂、５……透
光性樹脂。
造の一例を示す断面図、第２図は同実施例の製造
時の様子を示す斜視図、第３図及び第４図は夫々
異なる従来例の受光素子のパツケージ構造を示す
断面図である。 １……リードフレーム、２……受光素子チツプ
、２ａ……有効受光面、３……フイルターガラス
、４……透光性・可撓性を有する樹脂、５……透
光性樹脂。
Claims (1)
- 受光素子チツプの有効受光面上にフイルターガ
ラスを設け、透光性・可撓性を有する樹脂により
前記フイルターガラスの周囲を覆うとともに該フ
イルターガラスと前記受光素子チツプ間を接着固
定し、さらに全体を透光性樹脂でモールドしてな
ることを特徴とする受光素子のパツケージ構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987094933U JPS64347U (ja) | 1987-06-18 | 1987-06-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987094933U JPS64347U (ja) | 1987-06-18 | 1987-06-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS64347U true JPS64347U (ja) | 1989-01-05 |
Family
ID=30958898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987094933U Pending JPS64347U (ja) | 1987-06-18 | 1987-06-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS64347U (ja) |
-
1987
- 1987-06-18 JP JP1987094933U patent/JPS64347U/ja active Pending