JPS6437038U - - Google Patents

Info

Publication number
JPS6437038U
JPS6437038U JP1987131198U JP13119887U JPS6437038U JP S6437038 U JPS6437038 U JP S6437038U JP 1987131198 U JP1987131198 U JP 1987131198U JP 13119887 U JP13119887 U JP 13119887U JP S6437038 U JPS6437038 U JP S6437038U
Authority
JP
Japan
Prior art keywords
semiconductor chip
metal layer
electrode metal
bumps
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987131198U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987131198U priority Critical patent/JPS6437038U/ja
Publication of JPS6437038U publication Critical patent/JPS6437038U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図ａないし第１図ｄは、この考案の半導体
チツプを製作するための工程図、第２図ａ，ｂは
、従来の半導体チツプの構造および問題点を示す
説明図である。 １０……シリコンウエハ基板、１１……Ｐ−Ｎ
接合部、１２……表面保護膜、１３……電極金属
層、１４……バンプ、１５……ソルダクリーム、
１５ａ，１６……ソルダ、１７……内部リード。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体チツプの一主面に電極金属層が形成され
    、この電極金属層上に多数個のメツキによるバン
    プが形成され、隣接するバンプ間にソルダが充填
    された構造の半導体チツプ。
JP1987131198U 1987-08-28 1987-08-28 Pending JPS6437038U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987131198U JPS6437038U (ja) 1987-08-28 1987-08-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987131198U JPS6437038U (ja) 1987-08-28 1987-08-28

Publications (1)

Publication Number Publication Date
JPS6437038U true JPS6437038U (ja) 1989-03-06

Family

ID=31387040

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987131198U Pending JPS6437038U (ja) 1987-08-28 1987-08-28

Country Status (1)

Country Link
JP (1) JPS6437038U (ja)

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