JPS64386U - - Google Patents
Info
- Publication number
- JPS64386U JPS64386U JP9478487U JP9478487U JPS64386U JP S64386 U JPS64386 U JP S64386U JP 9478487 U JP9478487 U JP 9478487U JP 9478487 U JP9478487 U JP 9478487U JP S64386 U JPS64386 U JP S64386U
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- wall
- partition wall
- electronic device
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 238000005192 partition Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000011888 foil Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図〜第３図は本考案の一実施例を示し、第
１図は組立前の斜視図、第２図は組立後の垂直断
面図、第３図はその要部の拡大断面図である。第
４図〜第６図は従来例を示し、第４図は組立後の
垂直断面図、第５図はその要部の拡大断面図、第
６図はハンダを補充した後の要部の拡大断面図で
ある。
１……金属ケース、２……プリント板、３……
外壁、５……仕切壁、８……導箔部、９……ハン
ダ、１１……チツプ状金属片。
Figures 1 to 3 show an embodiment of the present invention; Figure 1 is a perspective view before assembly, Figure 2 is a vertical sectional view after assembly, and Figure 3 is an enlarged sectional view of the main parts. be. Figures 4 to 6 show the conventional example, Figure 4 is a vertical sectional view after assembly, Figure 5 is an enlarged sectional view of the main part, and Figure 6 is an enlarged view of the main part after replenishing solder. FIG. 1...Metal case, 2...Printed board, 3...
Outer wall, 5... Partition wall, 8... Foil guide portion, 9... Solder, 11... Chip-shaped metal piece.
Claims (1)
ント板を前記ケースの外壁又は仕切壁にハンダ固
定するようにした電子機器に於いて、前記プリン
ト板の上記外壁又は仕切壁近傍の導箔部にハンダ
濡性良好なチツプ状金属片を配置して、この金属
片と前記外壁又は仕切壁との間にハンダ溜りを形
成するようにしたことを特徴とする電子機器のプ
リント板固定構造。 In an electronic device in which a printed board is placed inside a metal case and this printed board is fixed to the outer wall or partition wall of the case by soldering, solder is applied to the conductive foil portion of the printed board near the outer wall or partition wall. 1. A printed board fixing structure for an electronic device, characterized in that a chip-shaped metal piece with good wettability is arranged to form a solder pool between the metal piece and the outer wall or the partition wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9478487U JPS64386U (en) | 1987-06-19 | 1987-06-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9478487U JPS64386U (en) | 1987-06-19 | 1987-06-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS64386U true JPS64386U (en) | 1989-01-05 |
Family
ID=30958602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9478487U Pending JPS64386U (en) | 1987-06-19 | 1987-06-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS64386U (en) |
-
1987
- 1987-06-19 JP JP9478487U patent/JPS64386U/ja active Pending
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