JPS6443370A - Spin coating device and spin coating method - Google Patents

Spin coating device and spin coating method

Info

Publication number
JPS6443370A
JPS6443370A JP62196822A JP19682287A JPS6443370A JP S6443370 A JPS6443370 A JP S6443370A JP 62196822 A JP62196822 A JP 62196822A JP 19682287 A JP19682287 A JP 19682287A JP S6443370 A JPS6443370 A JP S6443370A
Authority
JP
Japan
Prior art keywords
coated
materials
spin coating
mounts
recessed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62196822A
Other languages
Japanese (ja)
Inventor
Masahiko Ikeno
Hideo Saeki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62196822A priority Critical patent/JPS6443370A/en
Publication of JPS6443370A publication Critical patent/JPS6443370A/en
Pending legal-status Critical Current

Links

Landscapes

  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

PURPOSE:To reduce bad effect of coating unevenness generated by recessed and projected patterns on a base to a large extent by revolving a mount mounting materials to be coated and dispersing liquid dropped on the materials to be coated in a given direction. CONSTITUTION:Liquid dropped on materials 1a and 1b to be coated is applied to the materials to be coated by moving the materials to be coated by utilizing centrifugal power generated in the liquid. The materials to be coated are mounted on mounts 2a and 2b, while the mounts are revolved around the axis 51 passing through a point away from the materials to be coated mounted on the mounts. As a result, bad effect of coating unevenness generated from recessed and projected patterns on a base can be reduced to a large extent, and one device can treat a plurality of bases.
JP62196822A 1987-08-05 1987-08-05 Spin coating device and spin coating method Pending JPS6443370A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62196822A JPS6443370A (en) 1987-08-05 1987-08-05 Spin coating device and spin coating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62196822A JPS6443370A (en) 1987-08-05 1987-08-05 Spin coating device and spin coating method

Publications (1)

Publication Number Publication Date
JPS6443370A true JPS6443370A (en) 1989-02-15

Family

ID=16364240

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62196822A Pending JPS6443370A (en) 1987-08-05 1987-08-05 Spin coating device and spin coating method

Country Status (1)

Country Link
JP (1) JPS6443370A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007069313A1 (en) * 2005-12-14 2007-06-21 Fujitsu Limited Resist application method
JP2007201048A (en) * 2006-01-25 2007-08-09 Seiko Epson Corp Semiconductor substrate processing apparatus and semiconductor device manufacturing method
CN108212688A (en) * 2018-03-22 2018-06-29 王磊 A kind of surface applying liquid device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007069313A1 (en) * 2005-12-14 2007-06-21 Fujitsu Limited Resist application method
JP2007201048A (en) * 2006-01-25 2007-08-09 Seiko Epson Corp Semiconductor substrate processing apparatus and semiconductor device manufacturing method
CN108212688A (en) * 2018-03-22 2018-06-29 王磊 A kind of surface applying liquid device

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