JPS6444636U - - Google Patents

Info

Publication number
JPS6444636U
JPS6444636U JP1987139329U JP13932987U JPS6444636U JP S6444636 U JPS6444636 U JP S6444636U JP 1987139329 U JP1987139329 U JP 1987139329U JP 13932987 U JP13932987 U JP 13932987U JP S6444636 U JPS6444636 U JP S6444636U
Authority
JP
Japan
Prior art keywords
semiconductor chip
package structure
lead frame
input
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987139329U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987139329U priority Critical patent/JPS6444636U/ja
Publication of JPS6444636U publication Critical patent/JPS6444636U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案に係る半導体チツプのパツケー
ジ構造の第１の実施例を示す図、第２図は本考案
に係る半導体チツプのパツケージ構造の第二の実
施例を示す図、第３図は従来の半導体チツプのパ
ツケージ構造の一例を示す図である。 ２１……半導体チツプ、２３……ダイフレーム
、２４……リードフレーム、２５，２６……ワイ
ヤ線、２７，２８，２９，３０……接続部（ボン
デイング）、３１……パツケージ、３５……シリ
コンゲル、３６……フロロカーボン膜、３８……
防水膜。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体チツプの入出力端とリードフレームとを
    ワイヤ線で接続しパツケージを被覆する半導体チ
    ツプのパツケージ構造において、前記入出力端と
    リードフレームとの接続部をフツ素系樹脂で被覆
    したことを特徴とする半導体チツプのパツケージ
    構造。
JP1987139329U 1987-09-14 1987-09-14 Pending JPS6444636U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987139329U JPS6444636U (ja) 1987-09-14 1987-09-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987139329U JPS6444636U (ja) 1987-09-14 1987-09-14

Publications (1)

Publication Number Publication Date
JPS6444636U true JPS6444636U (ja) 1989-03-16

Family

ID=31402483

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987139329U Pending JPS6444636U (ja) 1987-09-14 1987-09-14

Country Status (1)

Country Link
JP (1) JPS6444636U (ja)

Similar Documents

Publication Publication Date Title
JPH0361341U (ja)
JPS633160U (ja)
JPH0176040U (ja)
JPH03116032U (ja)
JPS62122359U (ja)
JPH0474430U (ja)
JPS6382949U (ja)
JPS6192071U (ja)
JPS6373951U (ja)
JPH01130554U (ja)
JPS6329954U (ja)
JPH0245638U (ja)
JPH031543U (ja)
JPS6429843U (ja)
JPH01129851U (ja)
JPS59117166U (ja) 樹脂封止型半導体装置
JPH0474463U (ja)
JPS61174751U (ja)
JPS6422044U (ja)
JPH02146439U (ja)
JPH0178036U (ja)
JPS6341734U (ja)
JPH04759U (ja)
JPH0288247U (ja)
JPS6073249U (ja) 樹脂封止半導体装置