JPS6343433U - - Google Patents
Info
- Publication number
- JPS6343433U JPS6343433U JP13620286U JP13620286U JPS6343433U JP S6343433 U JPS6343433 U JP S6343433U JP 13620286 U JP13620286 U JP 13620286U JP 13620286 U JP13620286 U JP 13620286U JP S6343433 U JPS6343433 U JP S6343433U
- Authority
- JP
- Japan
- Prior art keywords
- insulating sheet
- area part
- terminal
- sheet
- base ribbon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Wire Bonding (AREA)
Description
第１図ａ，ｂは本考案の一実施例の模式的断面
図及び平面図、第２図は従来のハイブリツド集積
回路装置の一例の模式的断面図である。 １ａ，１ｂ……ベースリボン、２……絶縁シー
ト、３ａ，３ｂ……導体及びマウントランド及び
接続用導体、４……搭載部品（半導体チツプ）、
５ａ，５ｂ……ボンデイングワイヤ（金線）、６
……トランスフアモールドパツケージ。
図及び平面図、第２図は従来のハイブリツド集積
回路装置の一例の模式的断面図である。 １ａ，１ｂ……ベースリボン、２……絶縁シー
ト、３ａ，３ｂ……導体及びマウントランド及び
接続用導体、４……搭載部品（半導体チツプ）、
５ａ，５ｂ……ボンデイングワイヤ（金線）、６
……トランスフアモールドパツケージ。
Claims (1)
- 絶縁シートエリア部と端子エリア部よりなるベ
ースリボンと、該ベースリボンに張り付けられた
箔よりなる導体、半導体ＩＣのマウントランド及
び絶縁シートより延伸され端子と接続された接続
用の導体とを有する絶縁シートと、該絶縁シート
の所定部分に搭載されたトランスフアモールドパ
ツケージとを含むことを特徴とするハイブリツド
集積回路装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13620286U JPH054279Y2 (ja) | 1986-09-04 | 1986-09-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13620286U JPH054279Y2 (ja) | 1986-09-04 | 1986-09-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6343433U true JPS6343433U (ja) | 1988-03-23 |
| JPH054279Y2 JPH054279Y2 (ja) | 1993-02-02 |
Family
ID=31039100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13620286U Expired - Lifetime JPH054279Y2 (ja) | 1986-09-04 | 1986-09-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH054279Y2 (ja) |
-
1986
- 1986-09-04 JP JP13620286U patent/JPH054279Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH054279Y2 (ja) | 1993-02-02 |