JPS6489364A - Manufacture of bipolar semiconductor integrated circuit device - Google Patents
Manufacture of bipolar semiconductor integrated circuit deviceInfo
- Publication number
- JPS6489364A JPS6489364A JP62244741A JP24474187A JPS6489364A JP S6489364 A JPS6489364 A JP S6489364A JP 62244741 A JP62244741 A JP 62244741A JP 24474187 A JP24474187 A JP 24474187A JP S6489364 A JPS6489364 A JP S6489364A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- type
- collector
- emitter
- oxide film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 150000004767 nitrides Chemical class 0.000 abstract 2
- 238000005530 etching Methods 0.000 abstract 1
- 238000002955 isolation Methods 0.000 abstract 1
- 230000000717 retained effect Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Landscapes
- Bipolar Transistors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE:To reduce the increasing amount of an area of an emitter electrode lead due to overetching by retaining an Si nitride film remaining on an emitter layer forming region so as to be superposed on a collector layer, and forming a collector electrode lead in the region of the film. CONSTITUTION:An N<+> type collector buried layer 2, an N-type epitaxial layer 3, a P<+> type isolation layer 4, an N<+> type collector layer 6 and an oxide film 5 are formed on a P<+> type semiconductor substrate 1. An Si nitride film 9 to be retained on a region for forming an N<+> type emitter layer 10 so remains as to be superposed on the layer 6. Then, a P<+> type external base layer 7 and a P<-> type active base layer 8 are formed. A hole for forming the layer 10 is opened by etching. An oxide film 501A on the N<+> type collector layer is reduced in thickness as compared with the oxide film 500B on the P<+> type external base layer. After the layer 10 is formed by ion implanting a CVD oxide film 11 is formed on a whole surface, and a resist 14 is patterned to form collector, emitter and base electrode leads 15A, 15, 15B.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62244741A JPH061785B2 (en) | 1987-09-29 | 1987-09-29 | Method for manufacturing bipolar semiconductor integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62244741A JPH061785B2 (en) | 1987-09-29 | 1987-09-29 | Method for manufacturing bipolar semiconductor integrated circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6489364A true JPS6489364A (en) | 1989-04-03 |
| JPH061785B2 JPH061785B2 (en) | 1994-01-05 |
Family
ID=17123201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62244741A Expired - Lifetime JPH061785B2 (en) | 1987-09-29 | 1987-09-29 | Method for manufacturing bipolar semiconductor integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH061785B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03126228A (en) * | 1989-10-12 | 1991-05-29 | Nec Corp | Method for manufacturing semiconductor integrated circuit device |
| US10080999B2 (en) | 2014-01-17 | 2018-09-25 | Ttp Labtech Ltd. | Sample vessel agitation apparatus and method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6021568A (en) * | 1983-07-15 | 1985-02-02 | Hitachi Ltd | Manufacturing method of semiconductor device |
-
1987
- 1987-09-29 JP JP62244741A patent/JPH061785B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6021568A (en) * | 1983-07-15 | 1985-02-02 | Hitachi Ltd | Manufacturing method of semiconductor device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03126228A (en) * | 1989-10-12 | 1991-05-29 | Nec Corp | Method for manufacturing semiconductor integrated circuit device |
| US10080999B2 (en) | 2014-01-17 | 2018-09-25 | Ttp Labtech Ltd. | Sample vessel agitation apparatus and method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH061785B2 (en) | 1994-01-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080105 Year of fee payment: 14 |