KR100915519B1 - 재료 공급 장치 - Google Patents
재료 공급 장치Info
- Publication number
- KR100915519B1 KR100915519B1 KR1020040017905A KR20040017905A KR100915519B1 KR 100915519 B1 KR100915519 B1 KR 100915519B1 KR 1020040017905 A KR1020040017905 A KR 1020040017905A KR 20040017905 A KR20040017905 A KR 20040017905A KR 100915519 B1 KR100915519 B1 KR 100915519B1
- Authority
- KR
- South Korea
- Prior art keywords
- pressure
- supply line
- supply
- accumulator
- valve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1047—Apparatus or installations for supplying liquid or other fluent material comprising a buffer container or an accumulator between the supply source and the applicator
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B41/00—Circuit arrangements or apparatus for igniting or operating discharge lamps
- H05B41/14—Circuit arrangements
- H05B41/26—Circuit arrangements in which the lamp is fed by power derived from DC by means of a converter, e.g. by high-voltage DC
- H05B41/28—Circuit arrangements in which the lamp is fed by power derived from DC by means of a converter, e.g. by high-voltage DC using static converters
- H05B41/288—Circuit arrangements in which the lamp is fed by power derived from DC by means of a converter, e.g. by high-voltage DC using static converters with semiconductor devices and specially adapted for lamps without preheating electrodes, e.g. for high-intensity discharge lamps, high-pressure mercury or sodium lamps or low-pressure sodium lamps
- H05B41/2885—Static converters especially adapted therefor; Control thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/42—Circuits or arrangements for compensating for or adjusting power factor in converters or inverters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B41/00—Circuit arrangements or apparatus for igniting or operating discharge lamps
- H05B41/14—Circuit arrangements
- H05B41/26—Circuit arrangements in which the lamp is fed by power derived from DC by means of a converter, e.g. by high-voltage DC
- H05B41/28—Circuit arrangements in which the lamp is fed by power derived from DC by means of a converter, e.g. by high-voltage DC using static converters
- H05B41/288—Circuit arrangements in which the lamp is fed by power derived from DC by means of a converter, e.g. by high-voltage DC using static converters with semiconductor devices and specially adapted for lamps without preheating electrodes, e.g. for high-intensity discharge lamps, high-pressure mercury or sodium lamps or low-pressure sodium lamps
- H05B41/292—Arrangements for protecting lamps or circuits against abnormal operating conditions
- H05B41/2921—Arrangements for protecting lamps or circuits against abnormal operating conditions for protecting the circuit against abnormal operating conditions
- H05B41/2925—Arrangements for protecting lamps or circuits against abnormal operating conditions for protecting the circuit against abnormal operating conditions against abnormal lamp operating conditions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Control Of Fluid Pressure (AREA)
Abstract
Description
Claims (2)
- 수용 탱크 또는 다른 저장용기로부터 재료를 흡인하고, 상기 흡인된 재료를 공급구를 통해 고압하에서 공급하는 공급 장치와,상기 흡인된 재료를 제 1 압력하에서 공급할 수 있도록, 입구가 상기 공급 장치의 상기 공급구와 연결되는 일차측 공급 라인과,상기 흡인된 재료를 제 2 압력하에서 공급할 수 있는 이차측 공급 라인과,상기 일차측 공급 라인의 출구와 상기 이차측 공급 라인의 입구 사이에 연결되어 상기 제 2 압력을 상기 제 1 압력보다 낮게 감압시키는 감압 밸브와,작업물에 재료를 정량 공급하고, 흡입구가 상기 이차측 공급 라인의 출구에 연결되는 토출 장치와,상기 토출 장치의 흡입구 부근의 압력을 감지하고, 상기 제 2 압력을 제어하기 위한 기초로서의 압력 신호를 출력하는 압력 센서를 포함하고,상기 압력 신호에 기초하여, 상기 감압 밸브의 감압비가 제어되고, 상기 감지된 압력이 설정 상한치보다 높은 경우에는 상기 밸브는 완전히 폐쇄되며, 상기 감지된 압력이 설정 하한치보다 낮은 경우에는 상기 토출 장치의 작동시에 유동하는 재료의 전체 양보다도 많은 양의 재료가 상기 밸브를 통해 유동할 수 있는 값으로 상기 밸브의 개방도가 조절되고,상기 이차측 공급 라인에 설치되는 어큐뮬레이터를 또한 포함하고,상기 어큐뮬레이터에 재료가 충전되면 상기 어큐뮬레이터의 내압이 상승하며, 상기 어큐뮬레이터는 상기 흡입구 부근의 압력이 상기 상한치를 초과하거나 상기 하한치를 하회하는 것을 억제하는 재료 공급 장치.
- 수용 탱크 또는 다른 저장용기로부터 재료를 흡인하고, 상기 흡인된 재료를 공급구를 통해 고압하에서 공급하는 공급 장치와,입구가 상기 공급 장치의 상기 공급구와 연결되는 일차측 공급 라인과,상기 흡인된 재료를 공급 압력하에서 공급할 수 있는 이차측 공급 라인과,상기 일차측 공급 라인의 출구와 상기 이차측 공급 라인의 입구 사이에 연결되어 상기 공급 압력을 설정치로 조절하는 자동 압력 조정 밸브와,작업물에 재료를 정량 공급하고, 흡입구가 상기 이차측 공급 라인의 출구에 연결되는 토출 장치와,상기 토출 장치의 흡입구 부근의 압력을 감지하고, 상기 공급 압력을 제어하기 위한 기초로서의 압력 신호를 출력하는 압력 센서를 포함하고,상기 압력 신호에 기초하여, 상기 감지된 압력이 설정치보다 높은 경우에는 상기 공급 압력을 감소시키도록, 그리고 상기 감지된 압력이 상기 설정치보다 낮은 경우에는 상기 공급 압력을 증가시키도록, 상기 압력 조정 밸브의 개방도가 제어되며,상기 이차측 공급 라인에 설치되는 어큐뮬레이터를 또한 포함하고,상기 어큐뮬레이터에 재료가 충전되면 상기 어큐뮬레이터의 내압이 상승하며, 상기 어큐뮬레이터는 상기 흡입구 부근의 압력을 상기 설정치와 동일하게 만드는 재료 공급 장치.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003073497 | 2003-03-18 | ||
| JPJP-P-2003-00073497 | 2003-03-18 | ||
| JPJP-P-2004-00030229 | 2004-02-06 | ||
| JP2004030229A JP4512680B2 (ja) | 2003-03-18 | 2004-02-06 | 材料供給システム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20040082323A KR20040082323A (ko) | 2004-09-24 |
| KR100915519B1 true KR100915519B1 (ko) | 2009-09-04 |
Family
ID=32179166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020040017905A Expired - Fee Related KR100915519B1 (ko) | 2003-03-18 | 2004-03-17 | 재료 공급 장치 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7066352B2 (ko) |
| JP (1) | JP4512680B2 (ko) |
| KR (1) | KR100915519B1 (ko) |
| CN (1) | CN100548505C (ko) |
| DE (1) | DE102004010774B4 (ko) |
| FR (1) | FR2852532B1 (ko) |
| GB (1) | GB2399523B (ko) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006122828A (ja) * | 2004-10-29 | 2006-05-18 | Heishin Engineering & Equipment Co Ltd | 高粘度液供給システム |
| DE102005044796A1 (de) * | 2005-09-19 | 2007-03-29 | Hilger U. Kern Gmbh | Verfahren zur Steuerung einer Dosiereinrichtung für flüssige oder pasteuse Medien |
| WO2007118497A1 (de) * | 2006-04-10 | 2007-10-25 | S+P Samson Gmbh | Vorrichtung und verfahren zum auftrag von viskosen materialien |
| DE102008059557A1 (de) * | 2008-11-28 | 2010-06-02 | Hofmann Gmbh Maschinenfabrik Und Vertrieb | Verfahren zur Konstanthaltung der Markierungslinienbreite bei eine Markierungslinienfarbe auf eine zu markierende Oberfläche verspritzenden Markierungsmaschinen und Markierungsmaschine zur Durchführung des Verfahrens |
| JP5234629B2 (ja) * | 2008-12-08 | 2013-07-10 | 旭サナック株式会社 | 混合塗料の供給装置 |
| JP5419556B2 (ja) * | 2009-06-15 | 2014-02-19 | 武蔵エンジニアリング株式会社 | 高粘性材料の定量吐出装置および方法 |
| JP5994048B2 (ja) * | 2012-10-01 | 2016-09-21 | 兵神装備株式会社 | 吐出システム |
| JP6304617B2 (ja) * | 2013-09-09 | 2018-04-04 | 兵神装備株式会社 | 流体塗布システムおよび流体塗布方法 |
| JP6510765B2 (ja) * | 2014-05-02 | 2019-05-08 | 兵神装備株式会社 | 流動物吐出システム、及びアキュムレータ |
| JP5979732B2 (ja) * | 2014-06-11 | 2016-08-31 | 本田技研工業株式会社 | 塗料循環システム |
| CN108421667B (zh) * | 2018-03-19 | 2020-07-03 | 华南智能机器人创新研究院 | 一种具有保压喷涂功能的喷漆机器 |
| CN108176544B (zh) * | 2018-03-19 | 2020-07-03 | 华南智能机器人创新研究院 | 一种平面线轨迹机器人 |
| CN108421668B (zh) * | 2018-03-19 | 2020-07-03 | 华南智能机器人创新研究院 | 一种工作区域可调节的机械臂设备 |
| KR102032065B1 (ko) * | 2018-11-14 | 2019-11-08 | 주식회사 지오테크놀로지 | 정량 토출 장치 |
| JP7616647B2 (ja) * | 2020-05-08 | 2025-01-17 | 兵神装備株式会社 | 流動物吐出システム |
| JP7672130B2 (ja) * | 2020-05-08 | 2025-05-07 | 兵神装備株式会社 | 流動物吐出システム |
| CN115128695B (zh) * | 2022-06-06 | 2025-05-13 | 迈得医疗工业设备股份有限公司 | 通堵检测方法及检测装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4989756A (en) * | 1986-10-14 | 1991-02-05 | Kabushiki Kaisha Shinkawa | Dispensing apparatus |
| US6799698B2 (en) * | 2003-02-21 | 2004-10-05 | Heishin Sobi Kabushiki Kaisha | Liquid material supply system |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2710115A (en) * | 1949-07-13 | 1955-06-07 | Peter Fries Jr | Automatic can handling and liquid dispensing machine |
| DE3435213A1 (de) * | 1984-09-26 | 1986-04-03 | Walter Hofmann GmbH, 2084 Rellingen | Anordnung zur automatischen konstanthaltung der schichtdicke von markierungslinien o.dgl. |
| JPH0673651B2 (ja) * | 1986-10-31 | 1994-09-21 | トリニテイ工業株式会社 | 塗布剤供給装置 |
| JPH0673653B2 (ja) * | 1986-10-31 | 1994-09-21 | トリニテイ工業株式会社 | 塗布剤供給装置 |
| SE456727B (sv) * | 1987-03-11 | 1988-10-31 | Inst Verkstadstek Forsk Ivf | Anordning foer att frammata och paafoera en viskoes substans |
| FR2626501B1 (fr) * | 1988-01-29 | 1992-01-03 | Graco France Sa | Procede d'alimentation de moyens d'extrusion ou de pulverisation de produit pateux, dispositif d'alimentation et installation comportant le dispositif |
| NL8901125A (nl) * | 1989-05-03 | 1990-12-03 | Zwart Gerard Johannes De | Vernevelinstallatie voor vloeistoffen. |
| KR940009257B1 (ko) | 1990-07-10 | 1994-10-06 | 무사시엔지니어링 가부시기가이샤 | 액체 정량 토출장치 |
| US5215253A (en) * | 1990-08-30 | 1993-06-01 | Nordson Corporation | Method and apparatus for forming and dispersing single and multiple phase coating material containing fluid diluent |
| US5199607A (en) | 1990-12-03 | 1993-04-06 | Musashi Engineering, Inc. | Liquid dispensing apparatus |
| JPH0531434A (ja) * | 1991-07-29 | 1993-02-09 | Sony Corp | 塗布装置 |
| US5318225A (en) * | 1992-09-28 | 1994-06-07 | Union Carbide Chemicals & Plastics Technology Corporation | Methods and apparatus for preparing mixtures with compressed fluids |
| US5487346A (en) | 1994-01-10 | 1996-01-30 | Taylor; Donald K. | Soil injection system |
| FR2746822B1 (fr) * | 1996-04-02 | 1998-06-19 | Mauguin Sa | Equipement monte sur un vehicule pour le deversement sur le sol d'un liquide contenu dans un reservoir |
| DE19700633B4 (de) * | 1997-01-10 | 2005-06-02 | Voith Sulzer Papiermaschinen Gmbh | Vorrichtung zum Auftragen eines flüssigen oder pastösen Mediums auf eine laufende Materialbahn, vorzugsweise aus Papier oder Karton, und Maschine zur Papier- oder Kartonherstellung |
| US5992686A (en) | 1998-02-27 | 1999-11-30 | Fluid Research Corporation | Method and apparatus for dispensing liquids and solids |
| WO2001024605A1 (en) | 1999-10-04 | 2001-04-12 | Textron Inc. | Method and system for high pressure liquid injection of turf seed |
| JP2002316081A (ja) * | 2001-04-20 | 2002-10-29 | Heishin Engineering & Equipment Co Ltd | シール剤等の定量塗布・充填システム |
| US7141119B2 (en) * | 2003-05-19 | 2006-11-28 | Imation Corp. | Pressure-controlling dispersion delivery system |
| CN1933920A (zh) * | 2004-03-25 | 2007-03-21 | 东丽株式会社 | 涂覆装置、涂覆方法以及由此所得显示部件 |
-
2004
- 2004-02-06 JP JP2004030229A patent/JP4512680B2/ja not_active Expired - Lifetime
- 2004-03-05 DE DE102004010774A patent/DE102004010774B4/de not_active Expired - Lifetime
- 2004-03-09 GB GB0405227A patent/GB2399523B/en not_active Expired - Fee Related
- 2004-03-16 US US10/801,192 patent/US7066352B2/en not_active Expired - Fee Related
- 2004-03-16 CN CNB2004100086846A patent/CN100548505C/zh not_active Expired - Lifetime
- 2004-03-17 KR KR1020040017905A patent/KR100915519B1/ko not_active Expired - Fee Related
- 2004-03-18 FR FR0402784A patent/FR2852532B1/fr not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4989756A (en) * | 1986-10-14 | 1991-02-05 | Kabushiki Kaisha Shinkawa | Dispensing apparatus |
| US6799698B2 (en) * | 2003-02-21 | 2004-10-05 | Heishin Sobi Kabushiki Kaisha | Liquid material supply system |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004298862A (ja) | 2004-10-28 |
| DE102004010774B4 (de) | 2009-07-02 |
| GB2399523A (en) | 2004-09-22 |
| CN100548505C (zh) | 2009-10-14 |
| DE102004010774A1 (de) | 2004-09-30 |
| FR2852532A1 (fr) | 2004-09-24 |
| GB2399523B (en) | 2005-11-23 |
| CN1530175A (zh) | 2004-09-22 |
| KR20040082323A (ko) | 2004-09-24 |
| FR2852532B1 (fr) | 2011-04-22 |
| US20040182889A1 (en) | 2004-09-23 |
| JP4512680B2 (ja) | 2010-07-28 |
| GB0405227D0 (en) | 2004-04-21 |
| US7066352B2 (en) | 2006-06-27 |
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St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
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St.27 status event code: A-3-3-R10-R17-oth-X000 |
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