KR20020006545A - 폴리카보네이트 제품 및 접착제 조성물 - Google Patents
폴리카보네이트 제품 및 접착제 조성물 Download PDFInfo
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- KR20020006545A KR20020006545A KR1020017015512A KR20017015512A KR20020006545A KR 20020006545 A KR20020006545 A KR 20020006545A KR 1020017015512 A KR1020017015512 A KR 1020017015512A KR 20017015512 A KR20017015512 A KR 20017015512A KR 20020006545 A KR20020006545 A KR 20020006545A
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- adhesive composition
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- polycarbonate substrate
- polycarbonate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
- B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
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- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
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- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/414—Translucent
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B2429/00—Carriers for sound or information
- B32B2429/02—Records or discs
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- C—CHEMISTRY; METALLURGY
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/08—Homopolymers or copolymers of acrylic acid esters
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L39/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Compositions of derivatives of such polymers
- C08L39/04—Homopolymers or copolymers of monomers containing heterocyclic rings having nitrogen as ring member
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/241—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material
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- G11B7/253—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of layers other than recording layers of substrates
- G11B7/2533—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of layers other than recording layers of substrates comprising resins
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Optical Record Carriers And Manufacture Thereof (AREA)
- Manufacturing Optical Record Carriers (AREA)
Abstract
Description
| 실시예 | 성분 | 배합 | 제품 | 조건 | 결합해제 | 부식 | 핀홀 |
| 1 | IOA/NVC | 66/34 | C/A/C1 | 80℃90%RH16시간 | 무 | NA4 | NA |
| 2 | IOA/NVC | 65/35 | C/A/C | 무 | NA | NA | |
| 3 | IOA/NVC | 64/36 | C/A/C | 무 | NA | NA | |
| 4 | IOA/NVC | 60/40 | C/A/C | 무 | NA | NA | |
| 5 | EHA/NVC | 65/35 | C/A/C | 무 | NA | NA | |
| 6 | EHA/NVC | 64/36 | C/A/C | 무 | NA | NA | |
| 7 | INA/NVC | 62/38 | C/A/C | 무 | NA | NA | |
| 8 | INA/NVC | 61/39 | C/A/C | 무 | NA | NA | |
| 9 | INA/NVC | 60/40 | C/A/C | 무 | NA | NA | |
| 10 | INA/NVC | 55/45 | C/A/C | 무 | NA | NA | |
| 11 | INA/NVC | 62/38 | C/A/C | 무 | NA | NA | |
| 12 | INA/NVC | 61/39 | C/A/C | 무 | NA | NA | |
| 13 | INA/NVC | 60/40 | C/A/C | 무 | NA | NA | |
| 14 | IOA/DMA | 60/40 | C/A/C | 무 | NA | NA | |
| 15 | EHA/NVC | 68/32 | C/A/Al2 | 무 | NT5 | NT | |
| 16 | INA/NVC | 55/45 | C/A/C | 80℃90%RH1000시간 | 무 | 무 | 6 |
| 17 | INA/NVC | 60/40 | AL/A/ST3 | 무 | 무 | 무 | |
| 18 | INA/NVC | 65/35 | AL/A/ST | 무 | 무 | 2 | |
| 19 | EHA/NVC | 66/34 | Al/A/C | 80℃90%RH900시간 | 무 | 무 | 5 |
| 20 | EHA/NVC | 66/34 | Al/A/ST | 무 | 무 | 1 | |
| 21 | EHA/NVC | 66/34 | Al/A/ST | 무 | 무 | 2 | |
| 22 | EHA/NVC/(Et3)SiH | 66/34/0.4 | Al/A/ST | 무 | 무 | 3 | |
| 1C = 폴리카보네이트 및 A = 접착제2 Al = 알루미늄3 ST = 반투명4 NA = 부적절함5 NT = 테스트하지 않음 |
| 실시예 | 성분 | 배합 | 제품 | 균열(균열을 개시하는 힘(lb)) |
| 23 | IOA/NVC | 68/32 | Al/A/Al | 209 |
| 24 | IOA/NVC | 66/34 | Al/A/Al | 240,260 |
| 25 | IOA/NVC | 64/36 | Al/A/Al | 254,300 |
| 26 | IOA/NVC | 62/38 | Al/A/Al | 332 |
| 27 | IOA/NVC | 60/40 | Al/A/Al | 334 |
| 28 | EHA/NVC | 68/32 | Al/A/ST | 205,198, 240 |
| 29 | INA/NVC | 55/45 | Al/A/ST | 282 |
| 30 | IOA/NVC | 70/30 | Al/A/ST | 305 |
| 31 | IOA/NVC | 68/32 | Al/A/ST | 242, 255 |
| 실시예 | 성분 | 배합 | -30℃에서의 G'(Pa) 1x108 | 23℃에서의 G'(Pa) 1x105 | 80℃에서의 G'(Pa) 1x104 |
| 32 | IOA/NVC | 66/34 | 4.8 | 14.9 | 10.1 |
| 33 | IOA/NVC | 65/35 | 4.63 | 15.1 | 10.8 |
| 34 | IOA/NVC | 64/36 | 4.27 | 15.1 | 9.34 |
| 35 | EHA/NVC | 66/34 | 2.83 | 6.06 | 9.36 |
| 36 | EHA/NVC | 65/35 | 3.33 | 5.25 | 9.05 |
| 37 | EHA/NVC | 64/36 | 3.1 | 5.45 | 9.29 |
| 38 | INA/NVC | 61/39 | 3.96 | 27.2 | 17.5 |
| 실시예 | 성분 | SS1에 대한 90。박리 접착성(Oz/in) | 180。박리 접착성(Oz/in) | ||||||
| 15 분 | 72 시간 | C215분 | C72시간 | Al/C315분 | Al/C72시간 | ST/C415분 | ST/C72시간 | ||
| 32 | IOA/NVC | 61.8 | 87.2 | 50.2 | 63 | 22 | 59.8 | 28 | 56.7 |
| 33 | IOA/NVC | 62.4 | 81.4 | 71.6 | 94.8 | NT5 | NT | NT | NT |
| 34 | IOA/NVC | 42.8 | 77.8 | 31.2 | NT | NT | NT | NT | NT |
| 35 | EHA/NVC | 55.2 | 72.8 | 69.9 | 82 | 50.4 | 70.9 | 58.1 | 68.4 |
| 36 | EHA/NVC | 57.6 | 65.2 | NT | NT | NT | NT | NT | NT |
| 37 | EHA/NVC | 60.2 | 75.6 | NT | NT | NT | NT | NT | NT |
| 38 | INA/NVC | 18.6 | 33.2 | 27.8 | 61.8 | 25.6 | 54 | 23.1 | 55.6 |
| 1 = 스텐레스 강2 = 폴리카보네이트 기재에 대한 박리 접착성3 = 폴리카보네이트 기재의 알루미늄 표면에 대한 박리 접착성4 = 폴리카보네이트 기재의 반투명 표면에 대한 박리 접착성5 NT = 테스트되지 않음 |
| 실시예 | 성분 | 배합 | 투과율% |
| 39 | IOA/NVC | 68/32 | 92.85 |
| 40 | IOA/NVC | 66/34 | 92.71 |
| 41 | EHA/NVC | 68/32 | 92.81 |
| 42 | EHA/NVC | 66/34 | 92.72 |
| 43 | INA/NVC | 61/39 | 92.22 |
| 실시예 | 성분 | 배합 | 조건 | 결과 |
| 44 | EHA/NVC/t-BAA | 60/35/5 | 85℃, 85% RH, 16 시간 | 결합해제 또는 헤이즈가 없음 |
| 45 | IOA/NVC/t-BAA | 60/35/5 | 85℃, 85% RH, 16 시간 | 결합해제 또는 헤이즈가 없음 |
| 46 | INA/NVC/t-BAA | 60/35/5 | 85℃, 85% RH, 16 시간 | 결합해제 또는 헤이즈가 없음 |
| 47 | INA/NVC/t-BAA | 60/35/5 | 85℃, 85% RH, 16 시간 | 결합해제 또는 헤이즈가 없음 |
| 실시예 | 성분 | 배합 | 제품 | 결합해제 | 부식 | 핀홀 |
| 48 | IOA/NVC | 70/30 | C/A/Al | 무 | 무 | 2 |
| 49 | IOA/NVC | 70/30 | C/A/Al | 무 | 무 | 무 |
| 50 | IOA/NVC | 70/30 | C/A/Al | 무 | 무 | 무 |
| 51 | IOA/NVC | 70/30 | Al/A/Al | 무 | 무 | 무 |
| 52 | IOA/NVC | 70/30 | Al/A/Al | 무 | 무 | 무 |
| 53 | IOA/NVC | 70/30 | Al/A/Al | 무 | 무 | 무 |
| 54 | IOA/NVC | 70/30 | Al/A/ST | 무 | 무 | 무 |
| 55 | IOA/NVC | 70/30 | Al/A/ST | 무 | 무 | 무 |
| 56 | IOA/NVC | 70/30 | Al/A/ST | 무 | 무 | 무 |
| 57 | EHA/NVC | 68/32 | C/A/Al | 무 | 무 | 16 |
| 58 | EHA/NVC | 68/32 | C/A/Al | 무 | 무 | 2 |
| 59 | EHA/NVC | 68/32 | C/A/Al | 무 | 무 | 무 |
| 60 | EHA/NVC | 68/32 | Al/A/Al | 무 | 무 | 무 |
| 61 | EHA/NVC | 68/32 | Al/A/Al | 무 | 무 | 무 |
| 62 | EHA/NVC | 68/32 | Al/A/Al | 무 | 무 | 무 |
| 63 | EHA/NVC | 68/32 | Al/A/ST | 무 | 무 | 무 |
| 64 | EHA/NVC | 68/32 | Al/A/ST | 무 | 무 | 무 |
| 65 | EHA/NVC | 68/32 | Al/A/ST | 무 | 무 | 무 |
Claims (54)
- (a) 제1 폴리카보네이트 기재,(b) 제2 폴리카보네이트 기재, 및(c) 상기 제1 폴리카보네이트 기재가 접착제 조성물을 통해 상기 제2 폴리카보네이트 기재에 결합하도록 상기 제1 폴리카보네이트 기재와 상기 제2 폴리카보네이트 기재 사이에 배치된 접착제 조성물을 포함하는 제품으로서,상기 접착제 조성물은(1) N-비닐 카프롤락탐, N-비닐 피롤리돈, N-비닐 이미다졸 및 이들의 조합물로 이루어진 군 중에서 선택되는 N-비닐 함유 단량체와,(2) 탄소 원자수가 4 내지 20개인 알킬기를 갖는 비-tert 알코올의 아크릴산 에스테르 단량체의 반응 생성물을 포함하는 접착제 중합체를 포함하는 것인 제품.
- 제1항에 있어서, 상기 제품은 가속화 숙성 테스트 방법 II로 처리한 후에, 결합 해제가 실질적으로 존재하지 않는 것을 특징으로 하는 제품.
- 제1항에 있어서, 상기 제품은 80℃에서 90% 상대 습도에 16 시간동안 노출시킨 후에, 결합 해제가 실질적으로 존재하지 않는 것을 특징으로 하는 제품.
- 제1항에 있어서, 상기 접착제 조성물은 80℃에서 90% 상대 습도에 16 시간동안 노출시킨 후에, 버블이 실질적으로 존재하지 않는 것을 특징으로 하는 제품.
- 제1항에 있어서, 상기 제1 기재 표면에 배치된 무기 층을 더 포함하고, 상기 접착제 조성물은 이 무기층과 접촉되는 것을 특징으로 하는 제품.
- 제5항에 있어서, 상기 무기층은 금속을 포함하는 것을 특징으로 하는 제품.
- 제6항에 있어서, 상기 금속층은 375 ㎚ 내지 850 ㎚의 파장을 갖는 광선을 반사하는 것을 특징으로 하는 제품.
- 제6항에 있어서, 상기 금속은 알루미늄, 은, 놋쇠, 금, 금 합금, 구리, 구리-아연 합금, 구리-알루미늄 합금, 알루미늄-몰리브덴 합금, 알루미늄-탄탈륨 합금, 알루미늄-코발트 합금, 알루미늄-크롬 합금, 알루미늄-티타늄 합금, 알루미늄-백금 합금 및 이들의 조합물로 이루어지는 군 중에서 선택되는 것을 특징으로 하는 제품.
- 제6항에 있어서, 상기 금속층은 상기 제품을 가속화 숙성 테스트 방법 II로 처리한 후에, 부식이 실질적으로 존재하지 않는 것을 특징으로 하는 제품.
- 제6항에 있어서, 상기 금속층은 상기 제품을 80℃에서 90% 상대 습도에 16 시간동안 노출시킨 후에, 부식이 실질적으로 존재하지 않는 것을 특징으로 하는 제품.
- 제6항에 있어서, 상기 금속층은 상기 제품을 80℃에서 90% 상대 습도에 1000 시간동안 노출시킨 후에, 부식이 실질적으로 존재하지 않는 것을 특징으로 하는 제품.
- 제6항에 있어서, 상기 금속층은 상기 제품을 80℃에서 85% 상대 습도에 100 시간동안 노출시킨 후에, 부식이 실질적으로 존재하지 않는 것을 특징으로 하는 제품.
- 제5항에 있어서, 상기 무기층은 반투명한 것을 특징으로 하는 제품.
- 제5항에 있어서, 상기 무기층은 금 및 SinXm(식 중, X는 산소, 질소, 탄소 및 이들의 조합물로 이루어지는 군 중에서 선택되고, ∑(n+m)은 Si와 X의 원자가전자 요건을 만족시킴)로 이루어지는 군 중에서 선택되는 것을 특징으로 하는 제품.
- 제1항에 있어서, 상기 제1 기재는 이 제1 기재 표면에 배치된 금속층을 더 포함하고, 상기 제2 기재는 이 제2 폴리카보네이트 기재 표면에 배치된 무기층을 더 포함하며,상기 접착제 조성물은 상기 제1 기재의 상기 금속층 및 상기 제2 기재의 상기 무기 층과 접촉하는 것을 특징으로 하는 제품.
- 제15항에 있어서, 상기 무기층은 반투명한 것을 특징으로 하는 제품.
- 제15항에 있어서, 상기 무기층은 금 및 SinXm(식 중, X는 산소, 질소, 탄소 및 이들의 조합물로 이루어지는 군 중에서 선택되고, ∑(n+m)은 Si와 X의 원자가전자 요건을 만족시킴)로 이루어지는 군 중에서 선택되는 것을 특징으로 하는 제품.
- 제1항에 있어서, 상기 제품은 광학적으로 투명한 것을 특징으로 하는 제품.
- 제1항에 있어서, 상기 접착제 조성물은 광학적으로 투명한 것을 특징으로 하는 제품.
- 제1항에 있어서, 상기 제품은 광학 기록 매체를 포함하는 것을 특징으로 하는 제품.
- 제20항에 있어서, 상기 광학 기록 매체는 데이타를 포함하는 것을 특징으로 하는 제품.
- 제20항에 있어서, 상기 광학 기록 매체는 1 기가바이트 이상의 저장 용량을 갖는 것을 특징으로 하는 제품.
- 제20항에 있어서, 상기 광학 기록 매체는 DVD, DVD-R, DVD-RW, DVD-RAM, DVR, DVD 오디오 및 DVD 하이브리드로 이루어진 군 중에서 선택되는 것을 특징으로 하는 제품.
- 제1항에 있어서, 상기 접착제 중합체는(1) N-비닐 카프롤락탐, N-비닐 피롤리돈, N-비닐 이미다졸 및 이들의 조합물로 이루어진 군 중에서 선택되는 N-비닐 함유 단량체,(2) 탄소 원자수가 4 내지 20 개인 알킬기를 갖는 비-tert 알코올의 아크릴산 에스테르 단량체(이것의 단독중합체는 Tg가 0℃ 미만임),(3) 알킬기의 탄소 원자수가 4 내지 20 개인 임의의 모노에틸렌계 불포화 단량체(이것의 단독중합체는 Tg가 10℃ 이상임),(4) 임의의 치환된 아크릴아미드,(5) 임의의 개시제,(6) 임의의 가교제, 및(7) 임의의 연쇄 전달제의 반응 생성물로 이루어지는 것을 특징으로 하는 제품.
- 제24항에 있어서, 상기 제품은 가속화 숙성 테스트 방법 II로 처리한 후에, 결합 해제가 실질적으로 존재하지 않는 것을 특징으로 하는 제품.
- 제24항에 있어서, 상기 제품은 80℃에서 90% 상대 습도에 16 시간동안 노출시킨 후에, 결합 해제가 실질적으로 존재하지 않는 것을 특징으로 하는 제품.
- 제24항에 있어서, 상기 제품은 80℃에서 90% 상대 습도에 1000 시간동안 노출시킨 후에, 결합 해제가 실질적으로 존재하지 않는 것을 특징으로 하는 제품.
- 제24항에 있어서, 상기 제품은 80℃에서 90% 상대 습도에 16 시간동안 노출시킨 후에, 광학적으로 투명한 것을 특징으로 하는 제품.
- 제24항에 있어서, 상기 제1 기재는 이 제1 기재 표면에 배치된 금속층을 더 포함하고, 상기 제2 기재는 이 제2 폴리카보네이트 기재 표면에 배치된 무기층을 더 포함하며, 상기 접착제 조성물은 상기 제1 기재의 상기 금속층 및 상기 제2 기재의 상기 무기 층과 접촉하고,상기 제품은 80℃에서 90% 상대 습도에 16 시간동안 노출시킨 후에, 부식이 실질적으로 존재하지 않는 것을 특징으로 하는 제품.
- (1) 30 중량부 이상의 N-비닐 카프롤락탐,(2) 탄소 원자수가 4 내지 20개인 알킬기를 갖는 비-tert 알코올의 아크릴산 에스테르 단량체(이것의 단독중합체는 Tg가 0℃ 미만임),(3) 알킬기의 탄소 원자수가 4 내지 20 개인 임의의 모노에틸렌계 불포화 단량체(이것의 단독중합체는 Tg가 10℃ 이상임),(4) 임의의 치환된 아크릴아미드,(5) 임의의 개시제,(6) 임의의 가교제, 및(7) 임의의 연쇄 전달제의 반응 생성물로 이루어진 접착제 중합체를 포함하는 접착제 조성물.
- 제30항에 있어서, 상기 접착제 조성물은 제1 폴리카보네이트 기재를 제2 폴리카보네이트 기재에 대해 고정 관계로 유지하여, 제품을 가속화 숙성 테스트 방법 II로 처리한 후에 결합 해제가 실질적으로 존재하지 않는 제품을 형성할 수 있는 것을 특징으로 하는 접착제 조성물.
- 제30항에 있어서, 상기 접착제 조성물은 제1 폴리카보네이트 기재를 제2 폴리카보네이트 기재에 결합시켜, 80℃에서 90% 상대 습도에 16 시간동안 노출시킨 후에 결합 해제가 실질적으로 존재하지 않는 제품을 형성할 수 있는 것을 특징으로 하는 접착제 조성물.
- 제30항에 있어서, 상기 접착제 조성물은 폴리카보네이트 표면에 금속층이 배치된 제1 폴리카보네이트 기재를 제2 폴리카보네이트 기재에 결합시켜, 80℃에서 90% 상대 습도에 16 시간동안 노출시킨 후에 부식이 실질적으로 존재하지 않는 제품을 형성할 수 있는 것을 특징으로 하는 접착제 조성물.
- 제30항에 있어서, 상기 접착제 조성물은 실온에서 약 2 x 105Pa 이상의 저장 모듈러스를 갖는 것을 특징으로 하는 접착제 조성물.
- 제30항에 있어서, 상기 N-비닐 카프롤락탐의 양은 약 33 중량부 내지 약 50 중량부인 것을 특징으로 하는 접착제 조성물.
- 제30항에 있어서, 상기 아크릴산 에스테르 단량체는 이소옥틸 아크릴레이트, 2-에틸헥실 아크릴레이트, 이소노닐 아크릴레이트, 이소데실 아크릴레이트, 데실 아크릴레이트, 라우릴 아크릴레이트, 헥실 아크릴레이트, 부틸 아크릴레이트, 옥타데실 아크릴레이트 및 이들의 조합물로 이루어지는 군 중에서 선택되는 것을 특징으로 하는 접착제 조성물.
- 제30항에 있어서, 상기 접착제 중합체는 상기 N-비닐 카프롤락탐, 상기 아크릴산 에스테르 단량체, 및 광개시제의 반응 생성물로 이루어지는 것을 특징으로 하는 접착제 조성물.
- 제30항에 있어서, 상기 접착제 중합체는 상기 N-비닐 카프롤락탐, 상기 아크릴산 에스테르 단량체, 광개시제 및 가교제의 반응 생성물로 이루어지는 것을 특징으로 하는 접착제 조성물.
- 제30항에 있어서, 상기 접착제 중합체는 상기 N-비닐 카프롤락탐, 상기 아크릴산 에스테르 단량체, 광개시제, 가교제 및 연쇄전달제의 반응 생성물로 이루어지는 것을 특징으로 하는 접착제 조성물.
- 제30항에 있어서, 상기 접착제 중합체는 상기 N-비닐 카프롤락탐, 상기 아크릴산 에스테르 단량체, t-부틸 아크릴아미드 및 광개시제의 반응 생성물로 이루어지는 것을 특징으로 하는 접착제 조성물.
- 제30항에 있어서, 상기 접착제 조성물은 광학적으로 투명한 것을 특징으로 하는 접착제 조성물.
- 제30항에 있어서, 상기 접착제 조성물은 제1 폴리카보네이트 기재와 제2 폴리카보네이트 기재사이에 배치되어 80℃에서 90% 상대 습도에 16 시간동안 노출되는 경우, 광학적으로 투명한 것을 특징으로 하는 접착제 조성물.
- 표면에 실리콘이 배치된 제1 폴리에틸렌 테레프탈레이트 기재,표면에 실리콘이 배치된 제2 폴리에틸렌 테레프탈레이트 기재(상기 제1 기재는 이 제2 기재와 상이함), 및상기 제1 기재와 상기 제2 기재 사이에 배치된 제31항에 의한 압감 접착제 조성물을 포함하는 제품.
- (a) 제1 폴리카보네이트 기재,(b) 제2 폴리카보네이트 기재, 및(c) 상기 제1 폴리카보네이트 기재가 접착제 조성물을 통해 상기 제2 폴리카보네이트 기재에 결합하도록 상기 제1 폴리카보네이트 기재와 상기 제2 폴리카보네이트 기재 사이에 배치된 압감 접착제 조성물을 포함하는 제품으로서, 이 제품은 80℃에서 90% 상대 습도에 16 시간동안 노출된 후에, 결합 해제가 실질적으로 존재하지 않는 제품.
- 제44항에 있어서, 상기 제품은 80℃에서 90% 상대 습도에 1000 시간동안 노출된 후에, 결합 해제가 실질적으로 존재하지 않는 것을 특징으로 하는 제품.
- 제44항에 있어서, 상기 제1 폴리카보네이트 기재는 데이타와, 이 제1 폴리카보네이트 기재 표면에 배치된 금속층을 포함하며, 상기 데이타는 80℃에서 85% 상대 습도에 100 시간동안 노출된 후, DVD 성능 테스트에 의해 판독이 가능한 것을 특징으로 하는 광학 기록 매체.
- 제44항에 있어서, 상기 제1 기재는 이 제1 기재 표면에 배치된 금속층을 더 포함하고, 상기 제2 기재는 이 제2 폴리카보네이트 기재 표면에 배치된 무기층을 더 포함하며, 상기 접착제 조성물은 상기 제1 기재의 상기 금속층 및 상기 제2 기재의 상기 무기 층과 접촉하는 것을 특징으로 하는 제품.
- (a) 제1 폴리카보네이트 기재,(b) 제2 폴리카보네이트 기재, 및(c) 상기 제1 폴리카보네이트 기재가 접착제 조성물을 통해 상기 제2 폴리카보네이트 기재에 결합하도록 상기 제1 폴리카보네이트 기재와 상기 제2 폴리카보네이트 기재 사이에 배치된 접착제 조성물을 포함하는 제품으로서, 이 제품은 80℃에서 85% 상대 습도에 16 시간동안 노출된 후에, 결합 해제가 실질적으로 존재하지 않는 것을 특징으로 하는 제품.
- 제48항에 있어서, 상기 제1 기재는 이 제1 기재 표면에 배치된 금속층을 더 포함하고, 상기 제2 기재는 이 제2 폴리카보네이트 기재 표면에 배치된 무기층을 더 포함하며, 상기 접착제 조성물은 상기 제1 기재의 상기 금속층 및 상기 제2 기재의 상기 무기 층과 접촉하는 것을 특징으로 하는 제품.
- 제48항에 있어서, 상기 제1 폴리카보네이트 기재는 데이타와, 상기 폴리카보네이트 기재 표면에 배치된 금속층을 포함하며, 상기 데이타는 80℃에서 85% 상대 습도에 100 시간동안 노출된 후, DVD 성능 테스트에 의해 판독이 가능한 것을 특징으로 하는 광학 기록 매체.
- (a) 제1 폴리카보네이트 기재,(b) 제2 폴리카보네이트 기재, 및(c) 상기 제1 폴리카보네이트 기재가 접착제 조성물을 통해 상기 제2 폴리카보네이트 기재에 결합하도록 상기 제1 폴리카보네이트 기재와 상기 제2 폴리카보네이트 기재 사이에 배치된 접착제 조성물을 포함하는 제품으로서, 상기 접착제 조성물은(1) 아크릴산 에스테르 단량체와 공중합 가능한 질소 함유 단량체(이것의 AlogP 값은 #1.0임),(2) 탄소 원자수가 4 내지 20개인 알킬기를 갖는 비-tert 알코올의 아크릴산에스테르 단량체(이것의 단독중합체는 Tg가 0℃ 미만임),(3) 알킬기의 탄소 원자수가 4 내지 20개인 임의의 모노에틸렌계 불포화 단량체(이것의 단독중합체는 Tg가 10℃ 이상임),(4) 임의의 치환된 아크릴아미드,(5) 임의의 개시제,(6) 임의의 가교제, 및(7) 임의의 연쇄 전달제의 반응 생성물로 이루어진 접착제 중합체를 포함하는 것인 제품.
- 제51항에 있어서, 상기 질소 함유 단량체는 0.0# AlogP #1.0을 갖는 것을 특징으로 하는 제품.
- 제51항에 있어서, 상기 아크릴산 에스테르 단량체는 AlogP 값이 1.0 이상인 것을 특징으로 하는 제품.
- (1) 상기 제1 폴리카보네이트 기재를 상기 접착제 조성물과 접촉시키는 단계, 및(2) 상기 제1 폴리카보네이트 기재가 접착제 조성물을 통해 상기 제2 폴리카보네이트 기재에 결합하도록 상기 접착제 조성물을 상기 제2 폴리카보네이트 기재와 접촉시키는 단계를 포함하는 제1항에 의한 폴리카보네이트 제품의 제조 방법
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| US09/324,148 US6599602B2 (en) | 1999-06-02 | 1999-06-02 | Polycarbonate articles and adhesive composition therefor |
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-
1999
- 1999-06-02 US US09/324,148 patent/US6599602B2/en not_active Expired - Lifetime
- 1999-10-29 DE DE69934437T patent/DE69934437T2/de not_active Expired - Lifetime
- 1999-10-29 WO PCT/US1999/025493 patent/WO2000074937A1/en not_active Ceased
- 1999-10-29 AT AT99962670T patent/ATE347998T1/de not_active IP Right Cessation
- 1999-10-29 EP EP99962670A patent/EP1192046B1/en not_active Expired - Lifetime
- 1999-10-29 MX MXPA01012380A patent/MXPA01012380A/es unknown
- 1999-10-29 JP JP2001501446A patent/JP2003501296A/ja active Pending
- 1999-10-29 AU AU19069/00A patent/AU1906900A/en not_active Abandoned
- 1999-10-29 KR KR1020017015512A patent/KR100663789B1/ko not_active Expired - Fee Related
- 1999-10-29 CN CNB998168971A patent/CN1329188C/zh not_active Expired - Fee Related
-
2003
- 2003-02-20 US US10/370,789 patent/US6815035B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| DE69934437T2 (de) | 2007-09-27 |
| KR100663789B1 (ko) | 2007-01-03 |
| CN1329188C (zh) | 2007-08-01 |
| EP1192046B1 (en) | 2006-12-13 |
| JP2003501296A (ja) | 2003-01-14 |
| US20020098361A1 (en) | 2002-07-25 |
| US6599602B2 (en) | 2003-07-29 |
| CN1406179A (zh) | 2003-03-26 |
| US6815035B2 (en) | 2004-11-09 |
| US20030162031A1 (en) | 2003-08-28 |
| EP1192046A1 (en) | 2002-04-03 |
| AU1906900A (en) | 2000-12-28 |
| DE69934437D1 (de) | 2007-01-25 |
| ATE347998T1 (de) | 2007-01-15 |
| MXPA01012380A (es) | 2002-09-18 |
| WO2000074937A1 (en) | 2000-12-14 |
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