KR920020594A - Ldd 트랜지스터의 구조 및 제조방법 - Google Patents

Ldd 트랜지스터의 구조 및 제조방법 Download PDF

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Publication number
KR920020594A
KR920020594A KR1019910005714A KR910005714A KR920020594A KR 920020594 A KR920020594 A KR 920020594A KR 1019910005714 A KR1019910005714 A KR 1019910005714A KR 910005714 A KR910005714 A KR 910005714A KR 920020594 A KR920020594 A KR 920020594A
Authority
KR
South Korea
Prior art keywords
low concentration
drain region
concentration source
polysilicon
gate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1019910005714A
Other languages
English (en)
Korean (ko)
Inventor
황이연
Original Assignee
문정환
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 문정환, 금성일렉트론 주식회사 filed Critical 문정환
Priority to KR1019910005714A priority Critical patent/KR920020594A/ko
Priority to TW081102330A priority patent/TW268136B/zh
Priority to DE4211999A priority patent/DE4211999C2/de
Priority to JP4116768A priority patent/JP2547690B2/ja
Publication of KR920020594A publication Critical patent/KR920020594A/ko
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/601Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs 
    • H10D30/605Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs  having significant overlap between the lightly-doped extensions and the gate electrode
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/0223Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate
    • H10D30/0227Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate having both lightly-doped source and drain extensions and source and drain regions self-aligned to the sides of the gate, e.g. lightly-doped drain [LDD] MOSFET or double-diffused drain [DDD] MOSFET
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/0123Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/013Manufacturing their source or drain regions, e.g. silicided source or drain regions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00Diffusion of dopants within, into or out of wafers, substrates or parts of devices
    • H10P32/10Diffusion of dopants within, into or out of semiconductor bodies or layers
    • H10P32/14Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase
    • H10P32/1408Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase from or through or into an external applied layer, e.g. photoresist or nitride layers
    • H10P32/141Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase from or through or into an external applied layer, e.g. photoresist or nitride layers the applied layer comprising oxides only
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00Diffusion of dopants within, into or out of wafers, substrates or parts of devices
    • H10P32/10Diffusion of dopants within, into or out of semiconductor bodies or layers
    • H10P32/17Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material
    • H10P32/171Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material being group IV material

Landscapes

  • Insulated Gate Type Field-Effect Transistor (AREA)
KR1019910005714A 1991-04-10 1991-04-10 Ldd 트랜지스터의 구조 및 제조방법 Ceased KR920020594A (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1019910005714A KR920020594A (ko) 1991-04-10 1991-04-10 Ldd 트랜지스터의 구조 및 제조방법
TW081102330A TW268136B (2) 1991-04-10 1992-03-26
DE4211999A DE4211999C2 (de) 1991-04-10 1992-04-09 LDD-Transistor und Verfahren zu dessen Herstellung
JP4116768A JP2547690B2 (ja) 1991-04-10 1992-04-10 Lddトランジスタの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019910005714A KR920020594A (ko) 1991-04-10 1991-04-10 Ldd 트랜지스터의 구조 및 제조방법

Publications (1)

Publication Number Publication Date
KR920020594A true KR920020594A (ko) 1992-11-21

Family

ID=19313084

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910005714A Ceased KR920020594A (ko) 1991-04-10 1991-04-10 Ldd 트랜지스터의 구조 및 제조방법

Country Status (4)

Country Link
JP (1) JP2547690B2 (2)
KR (1) KR920020594A (2)
DE (1) DE4211999C2 (2)
TW (1) TW268136B (2)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5518945A (en) * 1995-05-05 1996-05-21 International Business Machines Corporation Method of making a diffused lightly doped drain device with built in etch stop
US6339005B1 (en) * 1999-10-22 2002-01-15 International Business Machines Corporation Disposable spacer for symmetric and asymmetric Schottky contact to SOI MOSFET
US7732285B2 (en) * 2007-03-28 2010-06-08 Intel Corporation Semiconductor device having self-aligned epitaxial source and drain extensions

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6143477A (ja) * 1984-08-08 1986-03-03 Hitachi Ltd Mosトランジスタの製造方法
JPH06105715B2 (ja) * 1985-03-20 1994-12-21 株式会社日立製作所 半導体集積回路装置の製造方法
JPH01309376A (ja) * 1988-06-07 1989-12-13 Mitsubishi Electric Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
JPH0629308A (ja) 1994-02-04
DE4211999A1 (de) 1992-10-15
JP2547690B2 (ja) 1996-10-23
TW268136B (2) 1996-01-11
DE4211999C2 (de) 1999-06-10

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