KR970077232A - 반도체 장치의 스몰콘택홀 형성방법 - Google Patents
반도체 장치의 스몰콘택홀 형성방법 Download PDFInfo
- Publication number
- KR970077232A KR970077232A KR1019960015572A KR19960015572A KR970077232A KR 970077232 A KR970077232 A KR 970077232A KR 1019960015572 A KR1019960015572 A KR 1019960015572A KR 19960015572 A KR19960015572 A KR 19960015572A KR 970077232 A KR970077232 A KR 970077232A
- Authority
- KR
- South Korea
- Prior art keywords
- forming
- contact hole
- oxide film
- critical dimension
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
- H10W20/071—Manufacture or treatment of dielectric parts thereof
- H10W20/081—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
- H10P50/282—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials
- H10P50/283—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials by chemical means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/73—Etching of wafers, substrates or parts of devices using masks for insulating materials
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Description
Claims (1)
- 반도체 기판 상에 제1산화막을 형성하는 단계; 상기 제1산화막 상에 질화막을 형성하는 단계; 상기 질화막 상에 제2산화막을 형성하는 단계; 상기 제2산화막 상에 포토레지스트 패턴을 형성하는 단계; 및 상기 포토레지스트 패턴을 마스크로 상기 제2산화막, 질화막 및 제1산화막을 CHF3와 CO가스가 혼합된 가스로 고밀도 플라즈마 식각하여 상부 임계크기와 하부 임계크기가 동일한 콘택홀을 형성하는 단계를 포함하는 것을 특징으로 하는 반도체 장치의 스몰콘택홀 형성방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960015572A KR970077232A (ko) | 1996-05-11 | 1996-05-11 | 반도체 장치의 스몰콘택홀 형성방법 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960015572A KR970077232A (ko) | 1996-05-11 | 1996-05-11 | 반도체 장치의 스몰콘택홀 형성방법 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR970077232A true KR970077232A (ko) | 1997-12-12 |
Family
ID=66220010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019960015572A Withdrawn KR970077232A (ko) | 1996-05-11 | 1996-05-11 | 반도체 장치의 스몰콘택홀 형성방법 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR970077232A (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100306374B1 (ko) * | 1998-06-30 | 2001-10-19 | 박종섭 | 반도체소자의콘택홀형성방법 |
-
1996
- 1996-05-11 KR KR1019960015572A patent/KR970077232A/ko not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100306374B1 (ko) * | 1998-06-30 | 2001-10-19 | 박종섭 | 반도체소자의콘택홀형성방법 |
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|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
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| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
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| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
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| PN2301 | Change of applicant |
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| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
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| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
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| PC1203 | Withdrawal of no request for examination |
St.27 status event code: N-1-6-B10-B12-nap-PC1203 |
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| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid | ||
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| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
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| R18-X000 | Changes to party contact information recorded |
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| PN2301 | Change of applicant |
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| R18-X000 | Changes to party contact information recorded |
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| P22-X000 | Classification modified |
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| P22-X000 | Classification modified |
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