MY206287A - Dressing tool - Google Patents

Dressing tool

Info

Publication number
MY206287A
MY206287A MYPI2020001733A MYPI2020001733A MY206287A MY 206287 A MY206287 A MY 206287A MY PI2020001733 A MYPI2020001733 A MY PI2020001733A MY PI2020001733 A MYPI2020001733 A MY PI2020001733A MY 206287 A MY206287 A MY 206287A
Authority
MY
Malaysia
Prior art keywords
dressing
board
reverse side
dressing board
dressing tool
Prior art date
Application number
MYPI2020001733A
Other languages
English (en)
Inventor
Hoshikawa Hirotoshi
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of MY206287A publication Critical patent/MY206287A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B24B53/14—Dressing tools equipped with rotary rollers or cutters; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
MYPI2020001733A 2019-04-15 2020-04-03 Dressing tool MY206287A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019076780A JP7317440B2 (ja) 2019-04-15 2019-04-15 ドレッシング工具

Publications (1)

Publication Number Publication Date
MY206287A true MY206287A (en) 2024-12-06

Family

ID=72613129

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2020001733A MY206287A (en) 2019-04-15 2020-04-03 Dressing tool

Country Status (8)

Country Link
US (1) US20200324387A1 (ja)
JP (1) JP7317440B2 (ja)
KR (1) KR102918826B1 (ja)
CN (1) CN111823140B (ja)
DE (1) DE102020204604A1 (ja)
MY (1) MY206287A (ja)
SG (1) SG10202002974UA (ja)
TW (1) TWI834863B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7599780B2 (ja) * 2020-12-16 2024-12-16 株式会社ディスコ ドレッシング工具

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0261568U (ja) * 1988-10-27 1990-05-08
US6090475A (en) * 1996-05-24 2000-07-18 Micron Technology Inc. Polishing pad, methods of manufacturing and use
JPH10217109A (ja) * 1997-02-04 1998-08-18 Nippon Steel Corp 研磨装置の被研磨材保持装置
JPH11151662A (ja) * 1997-11-18 1999-06-08 Asahi Chem Ind Co Ltd 研磨布
JP3049921U (ja) * 1997-12-18 1998-06-30 旭ダイヤモンド工業株式会社 超砥粒ホイール
US6106661A (en) * 1998-05-08 2000-08-22 Advanced Micro Devices, Inc. Polishing pad having a wear level indicator and system using the same
US20030199238A1 (en) * 2000-01-18 2003-10-23 Shigeo Moriyama Polishing apparatus and method for producing semiconductors using the apparatus
US6217426B1 (en) * 1999-04-06 2001-04-17 Applied Materials, Inc. CMP polishing pad
JP4154067B2 (ja) 1999-04-06 2008-09-24 株式会社ディスコ 研削装置
US6616513B1 (en) * 2000-04-07 2003-09-09 Applied Materials, Inc. Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile
JP2002001647A (ja) * 2000-06-19 2002-01-08 Rodel Nitta Co 研磨パッド
JP2003117816A (ja) * 2001-10-03 2003-04-23 Hitachi Ltd 研磨パッドの修復方法および研磨パッドの修復装置およびそれを用いた被加工物の研磨方法
JP2003205451A (ja) * 2002-01-07 2003-07-22 Hitachi Ltd 研磨パッド
JP4165118B2 (ja) * 2002-05-14 2008-10-15 ソニー株式会社 研磨装置、研磨部材厚さ検出方法および研磨部材厚さ検出装置
US6887138B2 (en) * 2003-06-20 2005-05-03 Freescale Semiconductor, Inc. Chemical mechanical polish (CMP) conditioning-disk holder
WO2006003697A1 (ja) * 2004-06-30 2006-01-12 Toho Engineering Kabushiki Kaisha 研磨パッドおよびその製造方法
WO2006042010A1 (en) * 2004-10-06 2006-04-20 Rajeev Bajaj Method and apparatus for improved chemical mechanical planarization
TWI368555B (en) * 2004-11-01 2012-07-21 Ebara Corp Polishing apparatus
US20060276111A1 (en) * 2005-06-02 2006-12-07 Applied Materials, Inc. Conditioning element for electrochemical mechanical processing
US8607399B2 (en) * 2006-05-17 2013-12-17 Richard T. Umbrell Quick release connector for a single or dual-sided pad
JP5179158B2 (ja) 2007-12-11 2013-04-10 株式会社ディスコ ドレッサボード
JP5236515B2 (ja) * 2009-01-28 2013-07-17 株式会社荏原製作所 ドレッシング装置、化学的機械的研磨装置及び方法
US20110097977A1 (en) * 2009-08-07 2011-04-28 Abrasive Technology, Inc. Multiple-sided cmp pad conditioning disk
JP5918254B2 (ja) * 2010-11-18 2016-05-18 キャボット マイクロエレクトロニクス コーポレイション 透過性領域を含む研磨パッド
JP5919157B2 (ja) * 2012-10-01 2016-05-18 株式会社荏原製作所 ドレッサー
JP2014217935A (ja) * 2013-05-10 2014-11-20 株式会社ディスコ ドレッシング工具
JP6234250B2 (ja) * 2014-01-29 2017-11-22 株式会社ディスコ ドレッシング工具
CN106853610B (zh) * 2015-12-08 2019-11-01 中芯国际集成电路制造(北京)有限公司 抛光垫及其监测方法和监测系统
US11260495B2 (en) * 2018-07-27 2022-03-01 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus and methods for chemical mechanical polishing

Also Published As

Publication number Publication date
SG10202002974UA (en) 2020-11-27
CN111823140A (zh) 2020-10-27
TWI834863B (zh) 2024-03-11
DE102020204604A1 (de) 2020-10-15
KR20200121232A (ko) 2020-10-23
JP7317440B2 (ja) 2023-07-31
TW202039156A (zh) 2020-11-01
US20200324387A1 (en) 2020-10-15
KR102918826B1 (ko) 2026-01-27
JP2020172009A (ja) 2020-10-22
CN111823140B (zh) 2024-02-20

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