NL1011077C2 - Werkwijze en inrichting voor het langs een snijlijn(en) van elkaar scheiden van met een gemeenschappelijke drager gevormde producten. - Google Patents

Werkwijze en inrichting voor het langs een snijlijn(en) van elkaar scheiden van met een gemeenschappelijke drager gevormde producten. Download PDF

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Publication number
NL1011077C2
NL1011077C2 NL1011077A NL1011077A NL1011077C2 NL 1011077 C2 NL1011077 C2 NL 1011077C2 NL 1011077 A NL1011077 A NL 1011077A NL 1011077 A NL1011077 A NL 1011077A NL 1011077 C2 NL1011077 C2 NL 1011077C2
Authority
NL
Netherlands
Prior art keywords
carrier
products
cutting
cutting blade
support member
Prior art date
Application number
NL1011077A
Other languages
English (en)
Dutch (nl)
Inventor
Hugo Franklin Menschaar
Wilhelmus Gijsbertus Le Sprang
Joerg Werner Rischke
Original Assignee
Meco Equip Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meco Equip Eng filed Critical Meco Equip Eng
Priority to NL1011077A priority Critical patent/NL1011077C2/nl
Priority to EP99203838A priority patent/EP1022779A1/en
Priority to US09/447,954 priority patent/US6588308B2/en
Priority to KR10-1999-0054414A priority patent/KR100366922B1/ko
Priority to SG9906120A priority patent/SG85684A1/en
Priority to TW088121543A priority patent/TW437003B/zh
Priority to JP2000006089A priority patent/JP3641646B2/ja
Priority to CA002295421A priority patent/CA2295421A1/en
Priority to CNB001011049A priority patent/CN1155994C/zh
Priority to MYPI20000135A priority patent/MY124915A/en
Priority to IDP20000016A priority patent/ID24404A/id
Application granted granted Critical
Publication of NL1011077C2 publication Critical patent/NL1011077C2/nl
Priority to HK00105917.9A priority patent/HK1026770B/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0405—With preparatory or simultaneous ancillary treatment of work
    • Y10T83/041—By heating or cooling
    • Y10T83/0414—At localized area [e.g., line of separation]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0405—With preparatory or simultaneous ancillary treatment of work
    • Y10T83/0443—By fluid application
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0495—Making and using a registration cut
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/263—With means to apply transient nonpropellant fluent material to tool or work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/283—With means to control or modify temperature of apparatus or work
    • Y10T83/293—Of tool
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/525—Operation controlled by detector means responsive to work
    • Y10T83/533—With photo-electric work-sensing means

Landscapes

  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Nonmetal Cutting Devices (AREA)
  • Processing Of Solid Wastes (AREA)
NL1011077A 1999-01-19 1999-01-19 Werkwijze en inrichting voor het langs een snijlijn(en) van elkaar scheiden van met een gemeenschappelijke drager gevormde producten. NL1011077C2 (nl)

Priority Applications (12)

Application Number Priority Date Filing Date Title
NL1011077A NL1011077C2 (nl) 1999-01-19 1999-01-19 Werkwijze en inrichting voor het langs een snijlijn(en) van elkaar scheiden van met een gemeenschappelijke drager gevormde producten.
EP99203838A EP1022779A1 (en) 1999-01-19 1999-11-16 Method and device for separating products, mounted on a common substrate, from each other, along (a) cutting line(s)
US09/447,954 US6588308B2 (en) 1999-01-19 1999-11-29 Method and device for separating products, mounted on a common substrate, from each other along (a) cutting line(s)
KR10-1999-0054414A KR100366922B1 (ko) 1999-01-19 1999-12-02 공통기판상에 장착된 제품을 절단선을 따라 서로 분리하기 위한 방법 및 장치
SG9906120A SG85684A1 (en) 1999-01-19 1999-12-07 Method and device for separating products, mounted on a common substrate, from each other along (a) cutting line (s)
TW088121543A TW437003B (en) 1999-01-19 1999-12-09 Method and device for separating products, mounted on a common substrate, from each other along a cutting line
JP2000006089A JP3641646B2 (ja) 1999-01-19 2000-01-11 製品の分離方法及び分離装置
CA002295421A CA2295421A1 (en) 1999-01-19 2000-01-14 Method and device for separating products, mounted on a common substrate, from each other along (a) cutting line (s)
CNB001011049A CN1155994C (zh) 1999-01-19 2000-01-17 使处于一共同基片上的产品沿切割线互相分离的方法和装置
MYPI20000135A MY124915A (en) 1999-01-19 2000-01-17 Method and device for separating products, mounted on a common substrate, from each other along (a) cutting line(s)
IDP20000016A ID24404A (id) 1999-01-19 2000-01-17 Metoda dan alat untuk memisahkan produk, yang dipasang pada suatu substrad biasa, satu dengan yang lain sepanjang jalur pemotongan
HK00105917.9A HK1026770B (en) 1999-01-19 2000-09-20 Method and device for separating products, mounted on a common substrate, from each other along (a) cutting line(s)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1011077A NL1011077C2 (nl) 1999-01-19 1999-01-19 Werkwijze en inrichting voor het langs een snijlijn(en) van elkaar scheiden van met een gemeenschappelijke drager gevormde producten.
NL1011077 1999-01-19

Publications (1)

Publication Number Publication Date
NL1011077C2 true NL1011077C2 (nl) 2000-07-20

Family

ID=19768507

Family Applications (1)

Application Number Title Priority Date Filing Date
NL1011077A NL1011077C2 (nl) 1999-01-19 1999-01-19 Werkwijze en inrichting voor het langs een snijlijn(en) van elkaar scheiden van met een gemeenschappelijke drager gevormde producten.

Country Status (11)

Country Link
US (1) US6588308B2 (id)
EP (1) EP1022779A1 (id)
JP (1) JP3641646B2 (id)
KR (1) KR100366922B1 (id)
CN (1) CN1155994C (id)
CA (1) CA2295421A1 (id)
ID (1) ID24404A (id)
MY (1) MY124915A (id)
NL (1) NL1011077C2 (id)
SG (1) SG85684A1 (id)
TW (1) TW437003B (id)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4860177B2 (ja) * 2005-05-09 2012-01-25 エステック株式会社 ガラス板等ワークの切断方法及び装置
US7644512B1 (en) * 2006-01-18 2010-01-12 Akrion, Inc. Systems and methods for drying a rotating substrate
CN101356047B (zh) * 2006-07-06 2011-11-09 Rena有限责任公司 用于分开和输送基片的装置和方法
JP5709370B2 (ja) * 2009-11-26 2015-04-30 株式会社ディスコ 切削装置及び切削方法
KR20110005473U (ko) * 2009-11-26 2011-06-01 세크론 주식회사 냉각용수 공급이 가능한 반도체소자 절단장치의 진공척테이블
JP7019241B2 (ja) * 2017-09-21 2022-02-15 株式会社ディスコ 切削ブレードの装着機構
CN108823944B (zh) * 2018-07-02 2024-04-12 江苏湛德医疗用品有限公司 一种无纺布生产过程剪裁机系统

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55118647A (en) * 1979-03-06 1980-09-11 Toshiba Corp Method of dicing semiconductor wafer
DE3137301A1 (de) * 1981-09-18 1983-04-14 Presco Inc., Beverly Hills, Calif. "verfahren und vorrichtung zur handhabung kleiner teile in der fertigung"
JPH03198363A (ja) * 1989-12-27 1991-08-29 Ricoh Co Ltd 半導体ユニットのダイシング方法
JPH06326185A (ja) * 1993-05-17 1994-11-25 Hitachi Ltd ダイシング装置およびダイシング用ブレード

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US2191916A (en) * 1938-02-28 1940-02-27 Bower Roller Bearing Co Method of forming roller bearing cups
US3407690A (en) * 1966-12-12 1968-10-29 Armstrong Cork Co Method of trimming and cutting in register
US3798782A (en) * 1971-10-18 1974-03-26 R Lindahl Register mark punch system and method
US3818790A (en) * 1972-11-29 1974-06-25 Armstrong Cork Co Carpet tile cutter
US4054070A (en) * 1976-05-17 1977-10-18 Globe Machine Manufacturing Company Panel saw mechanism
US4209129A (en) * 1978-12-29 1980-06-24 International Business Machines Corporation Cooling manifold for multiple solenoid operated punching apparatus
US4484417A (en) * 1982-11-22 1984-11-27 W. J. Savage Company Sawing apparatus
US4578203A (en) * 1983-04-01 1986-03-25 Ppg Industries, Inc. Polymer solution working fluid for finishing processes
NZ213316A (en) * 1985-08-30 1988-10-28 Trigon Packaging Systems Forming arrays of evacuated packages on independent magazines which packages are separated after sealing
JPS62249446A (ja) 1986-04-23 1987-10-30 Hitachi Ltd 保持装置およびその使用方法
JPH01188308A (ja) 1988-01-22 1989-07-27 Nec Corp 半導体ウェハのダイシング装置
US4920947A (en) * 1988-04-14 1990-05-01 Blount, Inc. Chain saw components and system for cutting masonry and the like
US4872381A (en) * 1988-07-13 1989-10-10 International Business Machines Corp. Programmable magnetic repulsion punching apparatus
JPH02102559A (ja) 1988-10-11 1990-04-16 Rohm Co Ltd 半導体製造装置
JPH0348443A (ja) 1989-06-23 1991-03-01 Nec Kansai Ltd 半導体ウェーハ切断方法
US5074178A (en) * 1990-05-04 1991-12-24 Cad Futures Corporation Apparatus and method for cutting drawings from a web of sheet material
US5062334A (en) * 1990-05-21 1991-11-05 Killilea Timothy R Apparatus for cleaning cutting table support surface
JPH0435846A (ja) 1990-05-31 1992-02-06 Toshiba Corp 半導体ウエハの位置合せ方法
JPH04147622A (ja) * 1990-10-11 1992-05-21 Nec Kyushu Ltd 水中加工用ウエハチャッキングテーブル
DE4309134C2 (de) * 1993-03-22 1999-03-04 Wilfried Wahl Verfahren zur Schmierung und Kühlung von Schneiden und/oder Werkstücken bei zerspanenden Arbeitsprozessen
JPH06275712A (ja) 1993-03-24 1994-09-30 Nec Kansai Ltd ダイシング装置
EP0616860B1 (de) * 1993-03-26 1997-10-22 ALFONS HAAR Maschinenbau GmbH & Co. Presse mit einem Tafelanlage- und Vorschubsystem
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JPH0917752A (ja) * 1995-06-28 1997-01-17 Sony Corp 偏平な被切削物の切断方法及びその装置
KR100475524B1 (ko) * 1996-11-27 2005-05-17 삼성전자주식회사 기판의절단방법
KR100225909B1 (ko) * 1997-05-29 1999-10-15 윤종용 웨이퍼 소잉 장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55118647A (en) * 1979-03-06 1980-09-11 Toshiba Corp Method of dicing semiconductor wafer
DE3137301A1 (de) * 1981-09-18 1983-04-14 Presco Inc., Beverly Hills, Calif. "verfahren und vorrichtung zur handhabung kleiner teile in der fertigung"
JPH03198363A (ja) * 1989-12-27 1991-08-29 Ricoh Co Ltd 半導体ユニットのダイシング方法
JPH06326185A (ja) * 1993-05-17 1994-11-25 Hitachi Ltd ダイシング装置およびダイシング用ブレード

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 004, no. 170 (E - 035) 22 November 1980 (1980-11-22) *
PATENT ABSTRACTS OF JAPAN vol. 015, no. 464 (E - 1137) 25 November 1991 (1991-11-25) *
PATENT ABSTRACTS OF JAPAN vol. 095, no. 002 31 March 1995 (1995-03-31) *

Also Published As

Publication number Publication date
JP2000216113A (ja) 2000-08-04
ID24404A (id) 2000-07-20
EP1022779A1 (en) 2000-07-26
US6588308B2 (en) 2003-07-08
MY124915A (en) 2006-07-31
US20010029820A1 (en) 2001-10-18
TW437003B (en) 2001-05-28
JP3641646B2 (ja) 2005-04-27
SG85684A1 (en) 2002-01-15
HK1026770A1 (en) 2000-12-22
CN1261204A (zh) 2000-07-26
CA2295421A1 (en) 2000-07-19
CN1155994C (zh) 2004-06-30
KR100366922B1 (ko) 2003-01-06
KR20000052404A (ko) 2000-08-25

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PD2B A search report has been drawn up
SD Assignments of patents

Owner name: BESI SINGULATION B.V.

TD Modifications of names of proprietors of patents

Owner name: BESI PLATING B.V.

SD Assignments of patents

Owner name: FICO B.V.

Effective date: 20081010

TD Modifications of names of proprietors of patents

Owner name: FICO SINGULATION B.V.

Effective date: 20081010

V1 Lapsed because of non-payment of the annual fee

Effective date: 20130801