PH26033A - Process for preparing photo-cured coatings - Google Patents

Process for preparing photo-cured coatings Download PDF

Info

Publication number
PH26033A
PH26033A PH38367A PH38367A PH26033A PH 26033 A PH26033 A PH 26033A PH 38367 A PH38367 A PH 38367A PH 38367 A PH38367 A PH 38367A PH 26033 A PH26033 A PH 26033A
Authority
PH
Philippines
Prior art keywords
radiation
coating
reactive system
actinic radiation
actinic
Prior art date
Application number
PH38367A
Other languages
English (en)
Inventor
Charles Edward Warburton Jr
Nicholas Andrew Rounds
Original Assignee
Rohm & Haas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas filed Critical Rohm & Haas
Publication of PH26033A publication Critical patent/PH26033A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • G03F7/0955—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer one of the photosensitive systems comprising a non-macromolecular photopolymerisable compound having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Structural Engineering (AREA)
  • Architecture (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Paints Or Removers (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Epoxy Resins (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Polymerisation Methods In General (AREA)
PH38367A 1988-03-29 1989-03-21 Process for preparing photo-cured coatings PH26033A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US17457988A 1988-03-29 1988-03-29

Publications (1)

Publication Number Publication Date
PH26033A true PH26033A (en) 1992-01-29

Family

ID=22636685

Family Applications (1)

Application Number Title Priority Date Filing Date
PH38367A PH26033A (en) 1988-03-29 1989-03-21 Process for preparing photo-cured coatings

Country Status (14)

Country Link
EP (1) EP0335629A3 (de)
JP (1) JPH029480A (de)
KR (1) KR890014180A (de)
CN (1) CN1037041A (de)
AU (1) AU607318B2 (de)
BR (1) BR8901395A (de)
DK (1) DK149489A (de)
FI (1) FI891480A7 (de)
IL (1) IL89775A0 (de)
MX (1) MX169037B (de)
MY (1) MY103987A (de)
NO (1) NO891226L (de)
PH (1) PH26033A (de)
ZA (1) ZA892266B (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2604438B2 (ja) * 1988-09-19 1997-04-30 旭電化工業株式会社 樹脂の光学的造形方法
JP2632961B2 (ja) * 1988-09-13 1997-07-23 旭電化工業株式会社 樹脂の光学的造形方法
EP0526463B1 (de) * 1990-04-23 1996-05-22 Minnesota Mining And Manufacturing Company Energiehärtbare, kationisch oder radikalisch polymerisierbare druckempfindliche zusammensetzungen
US5102924A (en) * 1990-08-16 1992-04-07 Minnesota Mining And Manufacturing Company Polymeric mixtures and process therefor
US5238744A (en) * 1990-08-16 1993-08-24 Minnesota Mining And Manufacturing Company Tough polymeric mixtures
CA2048232A1 (en) * 1990-09-05 1992-03-06 Jerry W. Williams Energy curable pressure-sensitive compositions
EP0487086B2 (de) * 1990-11-22 2008-08-13 Canon Kabushiki Kaisha Verfahren zum Herstellen von einem Volumen-Phasenhologram mit einem photoempfindlichen Aufzeichnungsmedium
JP2849021B2 (ja) * 1993-04-12 1999-01-20 日本ペイント株式会社 体積ホログラム記録用感光性組成物
JPH0732696U (ja) * 1993-11-25 1995-06-16 防衛庁技術研究本部長 水中吸音材ユニット
IT1274039B (it) * 1994-09-02 1997-07-14 Atohaas C V Ora Atohaas Holdin Processo per la preparazione di articoli formati a base di polimeri acrilici rivestiti con un film antigraffio e antiabrasione
US6100007A (en) * 1998-04-06 2000-08-08 Ciba Specialty Chemicals Corp. Liquid radiation-curable composition especially for producing cured articles by stereolithography having high heat deflection temperatures
DE69918568T2 (de) * 1999-09-22 2005-08-25 SurModics, Inc., Eden Prairie Initiationsgruppentragendes wasserlösliches beschichtungsmittel und beschichtungsverfahren
JP4967656B2 (ja) * 2004-06-17 2012-07-04 株式会社スリーボンド 光カチオン重合性組成物及びそれを用いたオプトエレクトロニクス部品
CN100399138C (zh) * 2006-06-26 2008-07-02 友达光电股份有限公司 液晶面板及其制造方法
JP5163602B2 (ja) * 2009-07-06 2013-03-13 大日本印刷株式会社 高低パターン層形成体の製造方法
EP2533890A2 (de) * 2010-02-13 2012-12-19 McAlister Technologies, LLC Chemische reaktoren mit rückstrahlungsoberflächen sowie entsprechende systeme und verfahren
JP5607486B2 (ja) * 2010-10-08 2014-10-15 サーモディクス,インコーポレイティド 開始剤基を有する水溶性コーティング剤およびコーティング方法
CN102566285B (zh) * 2010-12-09 2014-05-28 远东新世纪股份有限公司 制造微结构的方法及该微结构
DE102011077612A1 (de) * 2011-06-16 2012-12-20 Evonik Röhm Gmbh Verfahren zur kontinuierlichen inline Herstellung von beschichteten polymeren Substraten oder Laminaten
JP5855899B2 (ja) 2011-10-27 2016-02-09 日立オートモティブシステムズ株式会社 Dc−dcコンバータ及び電力変換装置
US11845885B2 (en) * 2015-12-30 2023-12-19 3M Innovative Properties Company Dual stage structural bonding adhesive
US10858541B2 (en) 2017-12-19 2020-12-08 Rohm And Haas Electronic Materials Llc Curable composition
CN109485436A (zh) * 2018-01-15 2019-03-19 杭州创屹机电科技有限公司 一种3d打印陶瓷材料两步光固化成型方法
CN109467387A (zh) * 2018-01-15 2019-03-15 杭州创屹机电科技有限公司 一种低孔隙率3d打印陶瓷制品及其制备方法
CN109467385B (zh) * 2018-01-15 2021-09-03 杭州创屹机电科技有限公司 一种抗菌环保3d打印陶瓷材料及其制备方法
JP2019137721A (ja) * 2018-02-06 2019-08-22 スリーエム イノベイティブ プロパティズ カンパニー 樹脂組成物、隙間充填用接着剤、隙間充填用接着剤の製造方法及び隙間充填方法
JP7591818B2 (ja) * 2020-07-07 2024-11-29 フェニックス電機株式会社 露光用の光照射装置および露光装置
CN114641145A (zh) * 2020-12-16 2022-06-17 深南电路股份有限公司 一种线路板及其线路板阻焊层的制作方法
CN114721229B (zh) * 2022-03-18 2023-07-28 浙江鑫柔科技有限公司 一种新型非对称性紫外曝光方法
CN117255495A (zh) * 2022-06-09 2023-12-19 庆鼎精密电子(淮安)有限公司 降低防焊层表面离子含量的方法、背光模组及其制造方法
CN116535636B (zh) 2023-05-17 2024-04-16 浙江皇马科技股份有限公司 一种低粘度密封胶用硅烷封端树脂及其制备方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH678897A5 (de) * 1986-05-10 1991-11-15 Ciba Geigy Ag
GB8715435D0 (en) * 1987-07-01 1987-08-05 Ciba Geigy Ag Forming images

Also Published As

Publication number Publication date
ZA892266B (en) 1989-11-29
JPH029480A (ja) 1990-01-12
AU607318B2 (en) 1991-02-28
DK149489A (da) 1989-09-30
EP0335629A2 (de) 1989-10-04
NO891226L (no) 1989-10-02
CN1037041A (zh) 1989-11-08
EP0335629A3 (de) 1991-10-09
MX169037B (es) 1993-06-17
DK149489D0 (da) 1989-03-28
FI891480L (fi) 1989-09-30
FI891480A0 (fi) 1989-03-28
BR8901395A (pt) 1989-11-07
NO891226D0 (no) 1989-03-21
IL89775A0 (en) 1989-09-28
KR890014180A (ko) 1989-10-23
MY103987A (en) 1993-10-30
FI891480A7 (fi) 1989-09-30
AU3174889A (en) 1989-10-05

Similar Documents

Publication Publication Date Title
AU607318B2 (en) Process for preparing photocured coatings
CA1246384A (en) Process for the production of images
KR100536922B1 (ko) 포토이미지의화질개량방법
US6045972A (en) Coating method using aqueous photopolymerizable compositions
US5055378A (en) Solder resist composition
JP3750101B2 (ja) 感光性樹脂組成物及びプリント配線板
CA2028259A1 (en) Tacky photopolymerizable adhesive compositions
JPH0752294B2 (ja) 画像形成方法
CA1330175C (en) Photoimageable compositions
EP0298030B1 (de) Bildaufzeichnungsverfahren
KR920005776B1 (ko) 광결상화 조성물
US5114830A (en) Solder mask resins having improved stability containing a multifunctional epoxide and a partial ester or styrene-maleic anhydride copolymer
JP2005120142A (ja) 硬化性組成物、その硬化物及びそれを用いたプリント配線板
EP0546768A1 (de) Wässrige lichtempfindliche Zusammensetzungen
JPH0720631A (ja) 感光性・熱硬化性樹脂組成物及びソルダーマスク形成方法
JPH0756334A (ja) 感光性樹脂組成物及びこれを用いた感光性エレメント
JP2005105006A (ja) 光硬化性・熱硬化性組成物、その硬化物及びそれを用いたプリント配線板
JPH03223315A (ja) 光硬化性樹脂組成物
JP2877868B2 (ja) 光硬化性樹脂組成物
JP2005128300A (ja) 感光性樹脂組成物及びこれを用いた感光性エレメント、レジストパターンの製造方法、プリント配線板、ディスプレイ板の製造方法
EP0717318A1 (de) Verfahren zum Einstellen der Thixotropie einer fotoempfindlichen Zusammensetzung
JPH03223314A (ja) 光硬化性樹脂組成物
JPH07134407A (ja) 感光性樹脂組成物及びこれを用いた感光性エレメント
JPH0616978A (ja) ネガ型感光性電着塗料樹脂組成物、これを用いた電着塗装浴及びレジストパターンの製造法
JPH04329544A (ja) フォトレジスト膜形成用電着塗料組成物