PT3603877T - Liga de soldadura, pasta de soldadura, e junta de soldadura - Google Patents

Liga de soldadura, pasta de soldadura, e junta de soldadura

Info

Publication number
PT3603877T
PT3603877T PT187744784T PT18774478T PT3603877T PT 3603877 T PT3603877 T PT 3603877T PT 187744784 T PT187744784 T PT 187744784T PT 18774478 T PT18774478 T PT 18774478T PT 3603877 T PT3603877 T PT 3603877T
Authority
PT
Portugal
Prior art keywords
solder
alloy
joint
paste
solder paste
Prior art date
Application number
PT187744784T
Other languages
English (en)
Portuguese (pt)
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of PT3603877T publication Critical patent/PT3603877T/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/264—Bi as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
PT187744784T 2017-03-31 2018-03-30 Liga de soldadura, pasta de soldadura, e junta de soldadura PT3603877T (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017073270 2017-03-31

Publications (1)

Publication Number Publication Date
PT3603877T true PT3603877T (pt) 2021-09-09

Family

ID=63676469

Family Applications (1)

Application Number Title Priority Date Filing Date
PT187744784T PT3603877T (pt) 2017-03-31 2018-03-30 Liga de soldadura, pasta de soldadura, e junta de soldadura

Country Status (16)

Country Link
US (1) US10967464B2 (de)
EP (1) EP3603877B1 (de)
JP (1) JP6447790B1 (de)
KR (1) KR102071255B1 (de)
CN (1) CN110430968B (de)
BR (1) BR112019020490B1 (de)
DK (1) DK3603877T3 (de)
ES (1) ES2887361T3 (de)
HR (1) HRP20211378T1 (de)
HU (1) HUE056341T2 (de)
MX (1) MX374387B (de)
MY (1) MY188597A (de)
PH (1) PH12019502148B1 (de)
PT (1) PT3603877T (de)
TW (1) TWI677580B (de)
WO (1) WO2018181873A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6624322B1 (ja) * 2019-03-27 2019-12-25 千住金属工業株式会社 はんだ合金、はんだボール、はんだプリフォーム、はんだペースト及びはんだ継手
TWI814081B (zh) * 2019-09-02 2023-09-01 美商阿爾發金屬化工公司 高溫超高可靠性合金、其製造方法及其應用
TWI782423B (zh) * 2020-04-10 2022-11-01 日商千住金屬工業股份有限公司 焊料合金、焊料粉末、焊膏、焊料球、焊料預成形物及焊料接頭
JP6836040B1 (ja) * 2020-07-31 2021-02-24 千住金属工業株式会社 はんだ合金
JP6936926B1 (ja) * 2021-03-10 2021-09-22 千住金属工業株式会社 はんだ合金、はんだ粉末、はんだペースト、およびはんだ継手
TWI778648B (zh) * 2021-06-04 2022-09-21 岱暉股份有限公司 焊料合金
KR20250041178A (ko) * 2022-08-12 2025-03-25 센주긴조쿠고교 가부시키가이샤 땜납 합금, 땜납 페이스트 및 땜납 조인트
WO2024034689A1 (ja) * 2022-08-12 2024-02-15 千住金属工業株式会社 はんだ合金、はんだペースト及びはんだ継手
CN117798544B (zh) * 2023-11-10 2024-09-20 苏州优诺电子材料科技有限公司 一种高强抗热疲劳无铅焊料合金及其制备方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7607047A (nl) 1976-06-28 1977-12-30 Stamicarbon Werkwijze voor het winnen van epsilon-caprolac- tam uit een epsilon-caprolactam-zwavelzuur- -reactiemengsel.
JPS5349703A (en) 1976-10-19 1978-05-06 Nitto Tire Pneumatic tire and rim assembly
JPS53117216A (en) 1977-03-23 1978-10-13 Sugie Seitou Kk Roof structure
JPS5723056A (en) 1980-07-17 1982-02-06 Nippon Steel Corp Preparation of molten lead-tin alloy plated steel plate with excellent plating appearance and corrosion resistance
JPS6053248B2 (ja) 1981-03-27 1985-11-25 工業技術院長 軟鋼等超厚板の水中ガス切断法
JPS6047254A (ja) 1983-08-26 1985-03-14 Hitachi Ltd 光デイスクの作製方法
JPS6053248A (ja) 1983-08-31 1985-03-26 Daido Kogyo Co Ltd スチ−ルベルト
JP2005340275A (ja) * 2004-05-24 2005-12-08 Denso Corp 電子部品接合体、その製造方法、およびそれを含む電子装置
WO2014002304A1 (ja) * 2012-06-29 2014-01-03 ハリマ化成株式会社 はんだ合金、ソルダペーストおよび電子回路基板
WO2014013632A1 (ja) * 2012-07-19 2014-01-23 ハリマ化成株式会社 はんだ合金、ソルダペーストおよび電子回路基板
JP2015077601A (ja) * 2013-04-02 2015-04-23 千住金属工業株式会社 鉛フリーはんだ合金
JP5730354B2 (ja) 2013-07-17 2015-06-10 ハリマ化成株式会社 はんだ組成物、ソルダペーストおよび電子回路基板
AU2015254179B2 (en) 2014-04-30 2017-07-20 Nihon Superior Co., Ltd. Lead-free solder alloy
JP5723056B1 (ja) 2014-12-15 2015-05-27 ハリマ化成株式会社 はんだ合金、ソルダペーストおよび電子回路基板
US20160279741A1 (en) 2015-03-24 2016-09-29 Tamura Corporation Lead-free solder alloy, electronic circuit board, and electronic control device
JP6200534B2 (ja) 2015-03-24 2017-09-20 株式会社タムラ製作所 鉛フリーはんだ合金、電子回路基板および電子制御装置
KR102685941B1 (ko) * 2015-05-05 2024-07-17 인듐 코포레이션 전자장치 적용을 위한 무연 땜납 합금
US10518362B2 (en) * 2015-07-24 2019-12-31 Harima Chemicals, Incorporated Solder alloy, solder paste, and electronic circuit board
JP6052381B2 (ja) 2015-12-24 2016-12-27 千住金属工業株式会社 鉛フリーはんだ合金
JP2016107343A (ja) * 2015-12-24 2016-06-20 千住金属工業株式会社 鉛フリーはんだ合金と車載電子回路
BR112018068596A2 (pt) 2016-03-22 2019-02-12 Tamura Corporation liga de soldas sem chumbo, composição de fluxo, composição de pasta de solda, placa de circuito eletrônico, e controlador eletrônico
JP6047254B1 (ja) 2016-03-22 2016-12-21 株式会社タムラ製作所 鉛フリーはんだ合金、電子回路基板および電子制御装置
JP2018083211A (ja) * 2016-11-24 2018-05-31 ハリマ化成株式会社 ソルダペースト、フラックスおよび電子回路基板

Also Published As

Publication number Publication date
TW201842206A (zh) 2018-12-01
HUE056341T2 (hu) 2022-02-28
ES2887361T3 (es) 2021-12-22
HRP20211378T1 (hr) 2021-12-24
MX374387B (es) 2025-03-06
DK3603877T3 (da) 2021-09-06
EP3603877B1 (de) 2021-08-11
EP3603877A1 (de) 2020-02-05
JPWO2018181873A1 (ja) 2019-04-04
TWI677580B (zh) 2019-11-21
BR112019020490B1 (pt) 2023-03-28
CN110430968A (zh) 2019-11-08
PH12019502148B1 (en) 2021-08-27
MY188597A (en) 2021-12-22
CN110430968B (zh) 2021-07-16
US10967464B2 (en) 2021-04-06
KR20190112166A (ko) 2019-10-02
US20200114475A1 (en) 2020-04-16
WO2018181873A1 (ja) 2018-10-04
MX2019011465A (es) 2019-11-01
PH12019502148A1 (en) 2020-06-08
KR102071255B1 (ko) 2020-01-31
JP6447790B1 (ja) 2019-01-09
BR112019020490A2 (pt) 2020-04-28
EP3603877A4 (de) 2020-02-05

Similar Documents

Publication Publication Date Title
HUE056341T2 (hu) Forrasztóötvözet, forrasztópaszta és forrasztási kötés
EP3715041A4 (de) Flussmittel und lötpaste
PL3666453T3 (pl) Stop lutowniczy, pasta lutownicza, kulka lutownicza, lut z rdzeniem topnikowym z żywicy oraz złącze lutownicze
PL3597356T3 (pl) Stop lutowniczy
SG11201700778TA (en) Solder alloy, solder ball, chip solder, solder paste and solder joint
SG11202009069YA (en) Solder paste
PT3238861T (pt) Material de solda, pasta de solda, solda de espuma, material de revestimento de fluxo
PL3427888T3 (pl) Stop lutowniczy, kulka lutownicza, lutowie chipowe, pasta lutownicza i złącze lutownicze
EP3103565A4 (de) Cu-kugel, cu-kernkugel, lötverbindung, lötpaste und lötschaum
EP3219433A4 (de) Flussmittel für lötpaste, lötpaste und verbundener körper
EP3878990A4 (de) Lötlegierung, lötpaste, lötvorform und lötverbindung
PT3381601T (pt) Liga de solda, esferas de solda e juntas de solda
EP3112080A4 (de) Bleifreie lötlegierung, lotmaterial und verbundene struktur
PL3715040T3 (pl) Stop lutowniczy, pasta lutownicza, kulki lutownicze, lut z rdzeniem żywicznym oraz złącze lutownicze
EP3124167A4 (de) Flussmittel und lötpaste
GB201911367D0 (en) Composition, paste and methods
PT3603879T (pt) Composição de fundente e composição de pasta para soldar
EP3034230A4 (de) Flussmittel, lötpaste und lötverbindung
SG11202013086VA (en) Metal paste and use thereof for joining components
HUE061616T2 (hu) Folyasztószer forrasztópasztához és forrasztópaszta
GB201910100D0 (en) Composition, paste and methods
EP3308901A4 (de) Flussmittel für bleifreies lot und bleifreie lotpaste
EP3040154A4 (de) Reinigungsflussmittel, reinigungslötpaste und lotverbindung
EP3254800A4 (de) Flussmittelaktivierer, flussmittel und lot
EP3299113A4 (de) Lötlegierung und verpackungsstruktur damit