SE508280C2 - Förfarande för att öka vidhäftningsförmågan hos ledande material till ytskikt av polymermaterial - Google Patents

Förfarande för att öka vidhäftningsförmågan hos ledande material till ytskikt av polymermaterial

Info

Publication number: SE508280C2
Authority: SE; Sweden
Prior art keywords: substrate; surface layer; benzophenone; conductive; benzyl
Prior art date: 1997-01-31

Application number

SE9700307A

Other languages

English (en)

Swedish (sv)

Other versions

SE9700307D0 (sv

SE9700307L (sv

Inventor

Karl-Gunnar Larsson

Alf Lage Pettersson

Stig Tomas Hedlund

Willis Rudolf Forsling

Mats Einar Eugen Lindberg

Lars Anders Gunneriusson

Original Assignee

Cuptronic Ab

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1997-01-31

Filing date

1997-01-31

Publication date

1998-09-21

1997-01-31 Application filed by Cuptronic Ab filed Critical Cuptronic Ab

1997-01-31 Priority to SE9700307A priority Critical patent/SE508280C2/sv

1997-01-31 Publication of SE9700307D0 publication Critical patent/SE9700307D0/xx

1998-01-27 Priority to ES98902332T priority patent/ES2293674T3/es

1998-01-27 Priority to AU58887/98A priority patent/AU5888798A/en

1998-01-27 Priority to AT98902332T priority patent/ATE373411T1/de

1998-01-27 Priority to DE69838420T priority patent/DE69838420T2/de

1998-01-27 Priority to PCT/SE1998/000111 priority patent/WO1998034446A1/en

1998-01-27 Priority to EP98902332A priority patent/EP0985333B1/de

1998-01-27 Priority to PT98902332T priority patent/PT985333E/pt

1998-01-27 Priority to DK98902332T priority patent/DK0985333T3/da

1998-01-27 Priority to JP53278398A priority patent/JP2001509213A/ja

1998-01-30 Priority to US09/015,943 priority patent/US6303278B1/en

1998-08-01 Publication of SE9700307L publication Critical patent/SE9700307L/xx

1998-09-21 Publication of SE508280C2 publication Critical patent/SE508280C2/sv

Links

238000000034 method Methods 0.000 title claims abstract description 35
239000004020 conductor Substances 0.000 title claims abstract description 21
239000002344 surface layer Substances 0.000 title claims description 15
239000000758 substrate Substances 0.000 claims abstract description 55
-1 e.g. Substances 0.000 claims abstract description 12
239000003999 initiator Substances 0.000 claims description 17
230000005855 radiation Effects 0.000 claims description 16
239000000463 material Substances 0.000 claims description 14
229920000642 polymer Polymers 0.000 claims description 14
239000000203 mixture Substances 0.000 claims description 13
CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 12
150000001875 compounds Chemical class 0.000 claims description 12
RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 9
239000012965 benzophenone Substances 0.000 claims description 9
230000008569 process Effects 0.000 claims description 8
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 7
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 5
239000010949 copper Substances 0.000 claims description 5
125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 5
239000011368 organic material Substances 0.000 claims description 5
XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 claims description 5
KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 claims description 4
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
150000008365 aromatic ketones Chemical class 0.000 claims description 4
125000004429 atom Chemical group 0.000 claims description 4
125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 4
229910052802 copper Inorganic materials 0.000 claims description 4
JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 4
150000003254 radicals Chemical class 0.000 claims description 4
JNELGWHKGNBSMD-UHFFFAOYSA-N xanthone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3OC2=C1 JNELGWHKGNBSMD-UHFFFAOYSA-N 0.000 claims description 4
229910052759 nickel Inorganic materials 0.000 claims description 3
LOXQVPXHWIYIDX-UHFFFAOYSA-N (4-benzylphenyl)-phenylmethanone Chemical compound C=1C=C(CC=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 LOXQVPXHWIYIDX-UHFFFAOYSA-N 0.000 claims description 2
SHJXSYJQBXYBGA-UHFFFAOYSA-N 2-cyclohexyl-2-hydroxy-1-phenylethanone Chemical compound C=1C=CC=CC=1C(=O)C(O)C1CCCCC1 SHJXSYJQBXYBGA-UHFFFAOYSA-N 0.000 claims description 2
OKISUZLXOYGIFP-UHFFFAOYSA-N 4,4'-dichlorobenzophenone Chemical compound C1=CC(Cl)=CC=C1C(=O)C1=CC=C(Cl)C=C1 OKISUZLXOYGIFP-UHFFFAOYSA-N 0.000 claims description 2
UGVRJVHOJNYEHR-UHFFFAOYSA-N 4-chlorobenzophenone Chemical compound C1=CC(Cl)=CC=C1C(=O)C1=CC=CC=C1 UGVRJVHOJNYEHR-UHFFFAOYSA-N 0.000 claims description 2
QSJXEFYPDANLFS-UHFFFAOYSA-N Diacetyl Chemical group CC(=O)C(C)=O QSJXEFYPDANLFS-UHFFFAOYSA-N 0.000 claims description 2
AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical class CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 claims description 2
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 claims description 2
150000001299 aldehydes Chemical class 0.000 claims description 2
PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 claims description 2
150000004056 anthraquinones Chemical class 0.000 claims description 2
YLQWCDOCJODRMT-UHFFFAOYSA-N fluoren-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C2=C1 YLQWCDOCJODRMT-UHFFFAOYSA-N 0.000 claims description 2
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
229910052737 gold Inorganic materials 0.000 claims description 2
239000010931 gold Substances 0.000 claims description 2
CXAYOCVHDCXPAI-UHFFFAOYSA-N naphthalen-1-yl(phenyl)methanone Chemical compound C=1C=CC2=CC=CC=C2C=1C(=O)C1=CC=CC=C1 CXAYOCVHDCXPAI-UHFFFAOYSA-N 0.000 claims description 2
229910052763 palladium Inorganic materials 0.000 claims description 2
229910052709 silver Inorganic materials 0.000 claims description 2
239000004332 silver Substances 0.000 claims description 2
KVFQMAZOBTXCAZ-UHFFFAOYSA-N 3,4-Hexanedione Chemical compound CCC(=O)C(=O)CC KVFQMAZOBTXCAZ-UHFFFAOYSA-N 0.000 claims 2
238000007385 chemical modification Methods 0.000 claims 2
MFEWNFVBWPABCX-UHFFFAOYSA-N 1,1,2,2-tetraphenylethane-1,2-diol Chemical compound C=1C=CC=CC=1C(C(O)(C=1C=CC=CC=1)C=1C=CC=CC=1)(O)C1=CC=CC=C1 MFEWNFVBWPABCX-UHFFFAOYSA-N 0.000 claims 1
230000015572 biosynthetic process Effects 0.000 claims 1
125000003636 chemical group Chemical group 0.000 claims 1
DTUQWGWMVIHBKE-UHFFFAOYSA-N phenylacetaldehyde Chemical compound O=CCC1=CC=CC=C1 DTUQWGWMVIHBKE-UHFFFAOYSA-N 0.000 claims 1
229910052751 metal Inorganic materials 0.000 abstract description 18
239000002184 metal Substances 0.000 abstract description 18
239000000178 monomer Substances 0.000 abstract description 16
238000004519 manufacturing process Methods 0.000 abstract description 11
229910021645 metal ion Inorganic materials 0.000 abstract description 7
150000002739 metals Chemical class 0.000 abstract description 6
239000000654 additive Substances 0.000 abstract description 2
230000000996 additive effect Effects 0.000 abstract description 2
239000010410 layer Substances 0.000 description 18
239000002904 solvent Substances 0.000 description 7
150000001336 alkenes Chemical class 0.000 description 6
239000000126 substance Substances 0.000 description 6
SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 5
NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
238000010521 absorption reaction Methods 0.000 description 5
238000007747 plating Methods 0.000 description 5
239000004593 Epoxy Substances 0.000 description 4
239000003153 chemical reaction reagent Substances 0.000 description 4
239000007788 liquid Substances 0.000 description 4
238000005406 washing Methods 0.000 description 4
LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 3
PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
239000000443 aerosol Substances 0.000 description 3
238000006243 chemical reaction Methods 0.000 description 3
239000003638 chemical reducing agent Substances 0.000 description 3
238000007796 conventional method Methods 0.000 description 3
125000000524 functional group Chemical group 0.000 description 3
238000012986 modification Methods 0.000 description 3
230000004048 modification Effects 0.000 description 3
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
BVQVLAIMHVDZEL-UHFFFAOYSA-N 1-phenyl-1,2-propanedione Chemical compound CC(=O)C(=O)C1=CC=CC=C1 BVQVLAIMHVDZEL-UHFFFAOYSA-N 0.000 description 2
239000004215 Carbon black (E152) Substances 0.000 description 2
BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
238000007792 addition Methods 0.000 description 2
239000012298 atmosphere Substances 0.000 description 2
125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
230000000052 comparative effect Effects 0.000 description 2
238000013461 design Methods 0.000 description 2
239000003822 epoxy resin Substances 0.000 description 2
238000005530 etching Methods 0.000 description 2
239000007789 gas Substances 0.000 description 2
229930195733 hydrocarbon Natural products 0.000 description 2
150000002500 ions Chemical class 0.000 description 2
PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 2
FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
TZMFJUDUGYTVRY-UHFFFAOYSA-N pentane-2,3-dione Chemical compound CCC(=O)C(C)=O TZMFJUDUGYTVRY-UHFFFAOYSA-N 0.000 description 2
229920000647 polyepoxide Polymers 0.000 description 2
230000009467 reduction Effects 0.000 description 2
238000006722 reduction reaction Methods 0.000 description 2
238000004544 sputter deposition Methods 0.000 description 2
238000009281 ultraviolet germicidal irradiation Methods 0.000 description 2
VTESCYNPUGSWKG-UHFFFAOYSA-N (4-tert-butylphenyl)hydrazine;hydrochloride Chemical compound [Cl-].CC(C)(C)C1=CC=C(N[NH3+])C=C1 VTESCYNPUGSWKG-UHFFFAOYSA-N 0.000 description 1
KGIGUEBEKRSTEW-UHFFFAOYSA-N 2-vinylpyridine Chemical class C=CC1=CC=CC=N1 KGIGUEBEKRSTEW-UHFFFAOYSA-N 0.000 description 1
NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
WUROYLKYEHHEOT-UHFFFAOYSA-N C=1(C(=CC=C2C(C3=CC=CC=C3C(C12)=O)=O)S(=O)(=O)O)S(=O)(=O)O.[Na].[Na] Chemical compound C=1(C(=CC=C2C(C3=CC=CC=C3C(C12)=O)=O)S(=O)(=O)O)S(=O)(=O)O.[Na].[Na] WUROYLKYEHHEOT-UHFFFAOYSA-N 0.000 description 1
229920002430 Fibre-reinforced plastic Polymers 0.000 description 1
UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
238000004566 IR spectroscopy Methods 0.000 description 1
CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
101150003085 Pdcl gene Proteins 0.000 description 1
239000002202 Polyethylene glycol Substances 0.000 description 1
239000004642 Polyimide Substances 0.000 description 1
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
206010042618 Surgical procedure repeated Diseases 0.000 description 1
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
238000002835 absorbance Methods 0.000 description 1
230000001133 acceleration Effects 0.000 description 1
238000013459 approach Methods 0.000 description 1
125000003118 aryl group Chemical group 0.000 description 1
238000004159 blood analysis Methods 0.000 description 1
CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
239000003990 capacitor Substances 0.000 description 1
125000004432 carbon atom Chemical group C* 0.000 description 1
229910010293 ceramic material Inorganic materials 0.000 description 1
230000008859 change Effects 0.000 description 1
238000005253 cladding Methods 0.000 description 1
239000008139 complexing agent Substances 0.000 description 1
238000010586 diagram Methods 0.000 description 1
125000005594 diketone group Chemical group 0.000 description 1
QILSFLSDHQAZET-UHFFFAOYSA-N diphenylmethanol Chemical compound C=1C=CC=CC=1C(O)C1=CC=CC=C1 QILSFLSDHQAZET-UHFFFAOYSA-N 0.000 description 1
238000001035 drying Methods 0.000 description 1
230000000694 effects Effects 0.000 description 1
238000009713 electroplating Methods 0.000 description 1
238000005265 energy consumption Methods 0.000 description 1
238000005516 engineering process Methods 0.000 description 1
230000007613 environmental effect Effects 0.000 description 1
238000000605 extraction Methods 0.000 description 1
239000011151 fibre-reinforced plastic Substances 0.000 description 1
239000011521 glass Substances 0.000 description 1
239000003365 glass fiber Substances 0.000 description 1
VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
229910052736 halogen Inorganic materials 0.000 description 1
150000002367 halogens Chemical class 0.000 description 1
LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
239000002920 hazardous waste Substances 0.000 description 1
229920001519 homopolymer Polymers 0.000 description 1
150000002430 hydrocarbons Chemical group 0.000 description 1
229910052739 hydrogen Inorganic materials 0.000 description 1
239000001257 hydrogen Substances 0.000 description 1
239000011261 inert gas Substances 0.000 description 1
230000000977 initiatory effect Effects 0.000 description 1
150000002576 ketones Chemical class 0.000 description 1
238000003475 lamination Methods 0.000 description 1
238000005259 measurement Methods 0.000 description 1
WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
125000000956 methoxy group Chemical class [H]C([H])([H])O* 0.000 description 1
125000002496 methyl group Chemical class [H]C([H])([H])* 0.000 description 1
238000001000 micrograph Methods 0.000 description 1
239000003595 mist Substances 0.000 description 1
230000007433 nerve pathway Effects 0.000 description 1
239000012811 non-conductive material Substances 0.000 description 1
JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
238000007540 photo-reduction reaction Methods 0.000 description 1
229920001223 polyethylene glycol Polymers 0.000 description 1
229920001721 polyimide Polymers 0.000 description 1
230000001902 propagating effect Effects 0.000 description 1
238000012827 research and development Methods 0.000 description 1
150000003333 secondary alcohols Chemical class 0.000 description 1
230000001235 sensitizing effect Effects 0.000 description 1
238000007669 thermal treatment Methods 0.000 description 1
229920002554 vinyl polymer Polymers 0.000 description 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
- C23C18/204—Radiation, e.g. UV, laser
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1168—Graft-polymerization

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
General Chemical & Material Sciences (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Health & Medical Sciences (AREA)
Toxicology (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing & Machinery (AREA)
Inorganic Chemistry (AREA)
Physics & Mathematics (AREA)
Optics & Photonics (AREA)
Manufacturing Of Printed Wiring (AREA)
Chemically Coating (AREA)
Treatments Of Macromolecular Shaped Articles (AREA)
Other Surface Treatments For Metallic Materials (AREA)
Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Mechanical Treatment Of Semiconductor (AREA)
Polymerisation Methods In General (AREA)
Chemical Treatment Of Metals (AREA)

SE9700307A 1997-01-31 1997-01-31 Förfarande för att öka vidhäftningsförmågan hos ledande material till ytskikt av polymermaterial SE508280C2 (sv)

Priority Applications (11)

Application Number	Priority Date	Filing Date	Title
SE9700307A SE508280C2 (sv)	1997-01-31	1997-01-31	Förfarande för att öka vidhäftningsförmågan hos ledande material till ytskikt av polymermaterial
JP53278398A JP2001509213A (ja)	1997-01-31	1998-01-27	新規表面変性方法
DE69838420T DE69838420T2 (de)	1997-01-31	1998-01-27	Verfahren zur modifizierung von oberflächen
AU58887/98A AU5888798A (en)	1997-01-31	1998-01-27	New process for modification of surfaces
AT98902332T ATE373411T1 (de)	1997-01-31	1998-01-27	Verfahren zur modifizierung von oberflächen
ES98902332T ES2293674T3 (es)	1997-01-31	1998-01-27	Procedimiento para la modificacion de superficies.
PCT/SE1998/000111 WO1998034446A1 (en)	1997-01-31	1998-01-27	New process for modification of surfaces
EP98902332A EP0985333B1 (de)	1997-01-31	1998-01-27	Verfahren zur modifizierung von oberflächen
PT98902332T PT985333E (pt)	1997-01-31	1998-01-27	Processo de modificação de superfícies
DK98902332T DK0985333T3 (da)	1997-01-31	1998-01-27	Ny fremgangsmåde til modifikation af overflader
US09/015,943 US6303278B1 (en)	1997-01-31	1998-01-30	Method of applying metal layers in distinct patterns

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
SE9700307A SE508280C2 (sv)	1997-01-31	1997-01-31	Förfarande för att öka vidhäftningsförmågan hos ledande material till ytskikt av polymermaterial

Publications (3)

Publication Number	Publication Date
SE9700307D0 SE9700307D0 (sv)	1997-01-31
SE9700307L SE9700307L (sv)	1998-08-01
SE508280C2 true SE508280C2 (sv)	1998-09-21

Family

ID=20405596

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
SE9700307A SE508280C2 (sv)	1997-01-31	1997-01-31	Förfarande för att öka vidhäftningsförmågan hos ledande material till ytskikt av polymermaterial

Country Status (10)

Country	Link
EP (1)	EP0985333B1 (de)
JP (1)	JP2001509213A (de)
AT (1)	ATE373411T1 (de)
AU (1)	AU5888798A (de)
DE (1)	DE69838420T2 (de)
DK (1)	DK0985333T3 (de)
ES (1)	ES2293674T3 (de)
PT (1)	PT985333E (de)
SE (1)	SE508280C2 (de)
WO (1)	WO1998034446A1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
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JP2005347424A (ja) *	2004-06-01	2005-12-15	Fuji Photo Film Co Ltd	多層配線板及びその製造方法
JP2007169763A (ja) *	2005-12-26	2007-07-05	Osaka Univ	二種以上の金属からなる金属ナノ粒子及びその形成方法
DE602007001344D1 (de) *	2006-04-10	2009-07-30	Linea Tergi Ltd	Verfahren zur applizierung eines metalls auf ein substrat
SE0900936A1 (sv) *	2009-07-06	2010-12-28	Cathprint Ab	Kateter och metod för tillverkning av sådan kateter
WO2012066018A2 (en)	2010-11-16	2012-05-24	Cuptronic Technology Ltd.	Metal coating of objects using plasma polymerisation
EP2645830B1 (de)	2012-03-29	2014-10-08	Atotech Deutschland GmbH	Herstellungsverfahren für Schaltungen mit feinen Linien
DK2847363T3 (da)	2012-05-07	2017-01-02	Cuptronic Tech Ltd	Fremgangsmåde til påføring af metal
WO2014086844A2 (en)	2012-12-05	2014-06-12	Cuptronic Technology Ltd.	Metalization of polymeric cavity filters
WO2015149825A1 (en)	2014-03-31	2015-10-08	Abb Technology Ltd	Electric power cable and process for the production of electric power cable
JP6964409B2 (ja)	2014-04-28	2021-11-10	キュプトロニックテクノロジーリミテッド	表面のメタライゼーション
EP3354629A1 (de) *	2017-01-31	2018-08-01	Centre National De La Recherche Scientifique	Material mit einer metallschicht und verfahren zur herstellung dieses materials
WO2022018136A1 (en)	2020-07-21	2022-01-27	Ncapt Ab	METHOD FOR SURFACE TREATMENT PRIOR TO COATING and GLUING
SE545002C2 (en)	2020-07-24	2023-02-21	Cuptronic Tech Ltd	Method for surface treatment prior to metallization

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JPS52117985A (en) *	1976-03-30	1977-10-03	Hitachi Chem Co Ltd	Photosensitive polymer composition
JP2605010B2 (ja) *	1985-01-11	1997-04-30	インターナショナル・ビジネス・マシーンズ・コーポレーション	有機基板への金属付着方法
US4810326A (en) *	1987-08-31	1989-03-07	International Business Machines Corporation	Interlaminate adhesion between polymeric materials and electrolytic copper surfaces
US5114757A (en) *	1990-10-26	1992-05-19	Linde Harold G	Enhancement of polyimide adhesion on reactive metals
US5225495A (en) *	1991-07-10	1993-07-06	Richard C. Stewart, II	Conductive polymer film formation using initiator pretreatment

1997
- 1997-01-31 SE SE9700307A patent/SE508280C2/sv not_active IP Right Cessation
1998
- 1998-01-27 AT AT98902332T patent/ATE373411T1/de active
- 1998-01-27 ES ES98902332T patent/ES2293674T3/es not_active Expired - Lifetime
- 1998-01-27 EP EP98902332A patent/EP0985333B1/de not_active Expired - Lifetime
- 1998-01-27 DE DE69838420T patent/DE69838420T2/de not_active Expired - Lifetime
- 1998-01-27 JP JP53278398A patent/JP2001509213A/ja active Pending
- 1998-01-27 AU AU58887/98A patent/AU5888798A/en not_active Abandoned
- 1998-01-27 DK DK98902332T patent/DK0985333T3/da active
- 1998-01-27 WO PCT/SE1998/000111 patent/WO1998034446A1/en not_active Ceased
- 1998-01-27 PT PT98902332T patent/PT985333E/pt unknown

Also Published As

Publication number	Publication date
EP0985333A1 (de)	2000-03-15
DE69838420D1 (de)	2007-10-25
ATE373411T1 (de)	2007-09-15
SE9700307D0 (sv)	1997-01-31
ES2293674T3 (es)	2008-03-16
DK0985333T3 (da)	2008-01-21
EP0985333B1 (de)	2007-09-12
AU5888798A (en)	1998-08-25
DE69838420T2 (de)	2008-07-03
PT985333E (pt)	2007-12-17
SE9700307L (sv)	1998-08-01
JP2001509213A (ja)	2001-07-10
WO1998034446A1 (en)	1998-08-06

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Date	Code	Title	Description
2017-03-28	NUG	Patent has lapsed

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SE508280C2 (sv)	1998-09-21	Förfarande för att öka vidhäftningsförmågan hos ledande material till ytskikt av polymermaterial
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