SG43954A1 - X-ray mask structure and x-ray exposing method and semiconductor device manufactured by use of x-ray mask structure and method for manufacturing x-ray mask structure - Google Patents
X-ray mask structure and x-ray exposing method and semiconductor device manufactured by use of x-ray mask structure and method for manufacturing x-ray mask structureInfo
- Publication number
- SG43954A1 SG43954A1 SG1996006884A SG1996006884A SG43954A1 SG 43954 A1 SG43954 A1 SG 43954A1 SG 1996006884 A SG1996006884 A SG 1996006884A SG 1996006884 A SG1996006884 A SG 1996006884A SG 43954 A1 SG43954 A1 SG 43954A1
- Authority
- SG
- Singapore
- Prior art keywords
- ray
- mask structure
- ray mask
- manufacturing
- semiconductor device
- Prior art date
Links
- 238000000034 method Methods 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 239000006096 absorbing agent Substances 0.000 abstract 3
- 229910044991 metal oxide Inorganic materials 0.000 abstract 1
- 150000004706 metal oxides Chemical class 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32671791A JP2880341B2 (ja) | 1991-11-15 | 1991-11-15 | X線マスクの製造方法 |
| JP32671691A JP2952097B2 (ja) | 1991-11-15 | 1991-11-15 | X線マスク構造体 |
| JP19467292A JP3280074B2 (ja) | 1992-06-30 | 1992-06-30 | X線マスク製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG43954A1 true SG43954A1 (en) | 1997-11-14 |
Family
ID=27326977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG1996006884A SG43954A1 (en) | 1991-11-15 | 1992-11-12 | X-ray mask structure and x-ray exposing method and semiconductor device manufactured by use of x-ray mask structure and method for manufacturing x-ray mask structure |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US5422921A (de) |
| EP (1) | EP0542265B1 (de) |
| AT (1) | ATE184711T1 (de) |
| CA (1) | CA2082909C (de) |
| DE (1) | DE69229987T2 (de) |
| SG (1) | SG43954A1 (de) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08262699A (ja) * | 1995-03-28 | 1996-10-11 | Canon Inc | レジスト組成物、レジスト処理方法及び装置 |
| JP3267471B2 (ja) * | 1995-08-02 | 2002-03-18 | キヤノン株式会社 | マスク、これを用いた露光装置やデバイス生産方法 |
| JPH0992602A (ja) * | 1995-09-26 | 1997-04-04 | Canon Inc | マスク構造体及びその製造方法 |
| JPH09306807A (ja) * | 1996-05-14 | 1997-11-28 | Canon Inc | X線露光用マスク構造体の製造方法 |
| US6317479B1 (en) | 1996-05-17 | 2001-11-13 | Canon Kabushiki Kaisha | X-ray mask, and exposure method and apparatus using the same |
| US6101237A (en) * | 1996-08-28 | 2000-08-08 | Canon Kabushiki Kaisha | X-ray mask and X-ray exposure method using the same |
| JP4011687B2 (ja) | 1997-10-01 | 2007-11-21 | キヤノン株式会社 | マスク構造体、該マスク構造体を用いた露光装置、該マスク構造体を用いた半導体デバイス製造方法 |
| JP2000012428A (ja) | 1998-06-19 | 2000-01-14 | Canon Inc | X線マスク構造体、該x線マスク構造体を用いたx線露光方法、前記x線マスク構造体を用いたx線露光装置、前記x線マスク構造体を用いた半導体デバイスの製造方法、および該製造方法によって製造された半導体デバイス |
| KR100308854B1 (ko) * | 1998-12-21 | 2002-10-31 | 엘지.필립스 엘시디 주식회사 | 액정표시장치의제조방법 |
| JP2000286187A (ja) | 1999-03-31 | 2000-10-13 | Canon Inc | 露光装置、該露光装置に用いるマスク構造体、露光方法、前記露光装置を用いて作製された半導体デバイス、および半導体デバイス製造方法 |
| JP3619118B2 (ja) | 2000-05-01 | 2005-02-09 | キヤノン株式会社 | 露光用反射型マスクとその製造方法、並びに露光装置とデバイス製造方法 |
| JP3510235B2 (ja) * | 2002-04-18 | 2004-03-22 | 沖電気工業株式会社 | 半導体装置の製造方法 |
| JP4220229B2 (ja) * | 2002-12-16 | 2009-02-04 | 大日本印刷株式会社 | 荷電粒子線露光用マスクブランクスおよび荷電粒子線露光用マスクの製造方法 |
| US7608367B1 (en) * | 2005-04-22 | 2009-10-27 | Sandia Corporation | Vitreous carbon mask substrate for X-ray lithography |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3742230A (en) * | 1972-06-29 | 1973-06-26 | Massachusetts Inst Technology | Soft x-ray mask support substrate |
| JPS5350680A (en) * | 1976-10-19 | 1978-05-09 | Nec Corp | Transfer mask for x-ray exposure and its production |
| US4178403A (en) * | 1977-08-04 | 1979-12-11 | Konishiroku Photo Industry Co., Ltd. | Mask blank and mask |
| EP0049799B1 (de) * | 1980-10-09 | 1986-02-12 | Dai Nippon Insatsu Kabushiki Kaisha | Blankophotoschablone und Photoschablone |
| DE3119682A1 (de) * | 1981-05-18 | 1982-12-02 | Philips Patentverwaltung Gmbh, 2000 Hamburg | "verfahren zur herstellung einer maske fuer die mustererzeugung in lackschichten mittels strahlungslithographie" |
| JPS57211732A (en) * | 1981-06-24 | 1982-12-25 | Toshiba Corp | X ray exposing mask and manufacture thereof |
| US4411972A (en) * | 1981-12-30 | 1983-10-25 | International Business Machines Corporation | Integrated circuit photomask |
| DE3425063A1 (de) * | 1984-07-07 | 1986-02-06 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Maske fuer die roentgenlithographie |
| US4735877A (en) * | 1985-10-07 | 1988-04-05 | Canon Kabushiki Kaisha | Lithographic mask structure and lithographic process |
| JPS62202518A (ja) * | 1986-02-03 | 1987-09-07 | Fujitsu Ltd | X線露光用マスク |
| JPH0682604B2 (ja) * | 1987-08-04 | 1994-10-19 | 三菱電機株式会社 | X線マスク |
| JPH02170410A (ja) * | 1988-12-23 | 1990-07-02 | Hitachi Ltd | 放射線露光用マスクおよびこれを用いた放射線露光方法 |
| JPH0775219B2 (ja) * | 1989-01-18 | 1995-08-09 | 富士通株式会社 | X線露光マスクの製造方法 |
| US5196283A (en) * | 1989-03-09 | 1993-03-23 | Canon Kabushiki Kaisha | X-ray mask structure, and x-ray exposure process |
| US5057388A (en) * | 1989-05-26 | 1991-10-15 | Technion Research And Development Foundation Ltd. | Method for the preparation of mask for X-ray lithography |
| JP2801270B2 (ja) * | 1989-07-13 | 1998-09-21 | キヤノン株式会社 | マスク作成方法 |
| US5335256A (en) * | 1991-03-18 | 1994-08-02 | Canon Kabushiki Kaisha | Semiconductor substrate including a single or multi-layer film having different densities in the thickness direction |
| JP3105990B2 (ja) * | 1991-06-26 | 2000-11-06 | 株式会社東芝 | X線マスクおよびx線マスクの製造方法 |
| JPH0567561A (ja) * | 1991-09-10 | 1993-03-19 | Canon Inc | X線マスク基板とその製造方法およびx線マスク |
| JP3073067B2 (ja) * | 1991-10-04 | 2000-08-07 | キヤノン株式会社 | X線露光用マスク及びその製造方法 |
| US5334466A (en) * | 1991-10-24 | 1994-08-02 | Matsushita Electric Industrial Co., Ltd. | X-ray mask and process comprising convex-concave alignment mark with alignment reflection film |
-
1992
- 1992-11-12 SG SG1996006884A patent/SG43954A1/en unknown
- 1992-11-12 DE DE69229987T patent/DE69229987T2/de not_active Expired - Fee Related
- 1992-11-12 AT AT92119367T patent/ATE184711T1/de not_active IP Right Cessation
- 1992-11-12 US US07/975,521 patent/US5422921A/en not_active Expired - Fee Related
- 1992-11-12 EP EP92119367A patent/EP0542265B1/de not_active Expired - Lifetime
- 1992-11-13 CA CA002082909A patent/CA2082909C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| DE69229987D1 (de) | 1999-10-21 |
| EP0542265B1 (de) | 1999-09-15 |
| CA2082909C (en) | 2000-01-04 |
| EP0542265A1 (de) | 1993-05-19 |
| CA2082909A1 (en) | 1993-05-16 |
| US5422921A (en) | 1995-06-06 |
| ATE184711T1 (de) | 1999-10-15 |
| DE69229987T2 (de) | 2000-04-20 |
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