SG44486A1 - Film adhesive and process for production thereof - Google Patents

Film adhesive and process for production thereof

Info

Publication number
SG44486A1
SG44486A1 SG1996000842A SG1996000842A SG44486A1 SG 44486 A1 SG44486 A1 SG 44486A1 SG 1996000842 A SG1996000842 A SG 1996000842A SG 1996000842 A SG1996000842 A SG 1996000842A SG 44486 A1 SG44486 A1 SG 44486A1
Authority
SG
Singapore
Prior art keywords
production
film adhesive
adhesive
film
Prior art date
Application number
SG1996000842A
Other languages
English (en)
Inventor
Tatsuhiro Yoshida
Yishitaka Okugawa
Yoshio Suzuki
Toshiro Takeda
Yushi Sakamoto
Takuya Tochimoto
Toshio Suzuki
Yoshitaka Okugawa
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP4144187A external-priority patent/JP2887359B2/ja
Priority claimed from JP14418392A external-priority patent/JPH05331445A/ja
Priority claimed from JP04325017A external-priority patent/JP3093062B2/ja
Priority claimed from JP32501292A external-priority patent/JPH06172736A/ja
Priority claimed from JP32501592A external-priority patent/JPH06172713A/ja
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of SG44486A1 publication Critical patent/SG44486A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C08G73/1014—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)anhydrid
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C08G73/1017—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)amine
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S526/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S526/935—Hot melt adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Adhesives Or Adhesive Processes (AREA)
SG1996000842A 1992-06-04 1993-03-24 Film adhesive and process for production thereof SG44486A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP4144187A JP2887359B2 (ja) 1992-06-04 1992-06-04 フィルム接着剤
JP14418392A JPH05331445A (ja) 1992-06-04 1992-06-04 フィルム接着剤の製造方法
JP04325017A JP3093062B2 (ja) 1992-12-04 1992-12-04 フィルム接着剤およびその製造方法
JP32501292A JPH06172736A (ja) 1992-12-04 1992-12-04 フィルム接着剤およびその製造方法
JP32501592A JPH06172713A (ja) 1992-12-04 1992-12-04 フィルム接着剤およびその製造方法

Publications (1)

Publication Number Publication Date
SG44486A1 true SG44486A1 (en) 1997-12-19

Family

ID=27527699

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996000842A SG44486A1 (en) 1992-06-04 1993-03-24 Film adhesive and process for production thereof

Country Status (6)

Country Link
US (1) US5739263A (fr)
EP (1) EP0598911B1 (fr)
KR (1) KR100262417B1 (fr)
DE (1) DE69318675T2 (fr)
SG (1) SG44486A1 (fr)
WO (1) WO1993024583A1 (fr)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG49197A1 (en) * 1993-03-16 1998-05-18 Occidental Chem Co Three-layer polyimidesiloxane adhesive tape
EP0775716B1 (fr) * 1995-01-11 1999-07-28 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Nouveau copolymere thermosoudable; poudres, films, isolants thermiques, modules electroniques et condensateur stratifies fabriques a partir de ce polymere et technique de production correspondante
WO1999047968A1 (fr) * 1998-03-19 1999-09-23 Sumitomo Bakelite Company Limited Agents d'alignement de cristaux liquides
MY124687A (en) * 1998-05-20 2006-06-30 Hitachi Chemical Co Ltd Insulating adhesive for electronic parts, and lead frame and semiconductor device using the same
US6156820A (en) * 1998-12-28 2000-12-05 Occidental Chemical Corporation Polyamideimidesiloxane hot melt adhesive
KR100335663B1 (ko) * 1999-10-19 2002-05-06 윤종용 테입리스 ｌｏｃ 패키징용 폴리(이미드-실록산) 화합물
KR100780505B1 (ko) 1999-12-28 2007-11-29 가부시키가이샤 가네카 에폭시변성폴리이미드 및, 이것을 사용한 감광성조성물,커버레이필름, 솔더레지스트, 프린트배선판
JP4362917B2 (ja) * 2000-01-31 2009-11-11 宇部興産株式会社 金属箔積層体およびその製法
JP4665298B2 (ja) * 2000-08-25 2011-04-06 東レ株式会社 半導体装置用接着剤付きテープおよびそれを用いた銅張り積層板、半導体接続用基板ならびに半導体装置
US20030066603A1 (en) * 2001-08-20 2003-04-10 Lord Corporation Adhesive composition for bonding an elastomer to a substrate and a method for the bonding thereof
DE60327695D1 (de) * 2002-05-30 2009-07-02 Mitsui Chemicals Inc Klebharz und damit hergestellte filmklebstoffe
US7892651B2 (en) * 2004-09-14 2011-02-22 Mitsubishi Gas Chemical Company, Inc. Resin composite metal foil, laminate and process for the production of printed wiring board using the laminate
US7989081B2 (en) * 2006-01-25 2011-08-02 Mitsubishi Gas Chemical Company, Inc. Resin composite copper foil, printed wiring board, and production processes thereof
US20090186295A1 (en) * 2006-03-03 2009-07-23 Maw Soe Win Photosensitive Ink Composition for Screen Printing and Method of Forming Positive Relief Pattern with Use Thereof
JP4806815B2 (ja) * 2008-03-31 2011-11-02 リンテック株式会社 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
JP2009242605A (ja) * 2008-03-31 2009-10-22 Lintec Corp 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
JP6010531B2 (ja) * 2011-04-20 2016-10-19 株式会社カネカ ポリアミドイミド溶液およびポリアミドイミド膜の製造方法
EP3187559B1 (fr) 2014-08-08 2021-02-17 Toray Industries, Inc. Adhésif de liaison temporaire, couche adhésive, procédé de fabrication de pièce de type plaquette et dispositif semi-conducteur l'utilisant, solvant de remise en fabrication, copolymère de polyimide, résine mixte à base de polyimide et composition de résine

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5827721A (ja) * 1981-08-10 1983-02-18 Hitachi Chem Co Ltd ポリアミド酸シリコン型中間体及びポリイミドシリコン共重合体樹脂の製造法
JPS5844712B2 (ja) * 1981-07-07 1983-10-05 日立化成工業株式会社 接着剤組成物
JPS5844712A (ja) * 1981-09-10 1983-03-15 Fujitsu Ltd 半導体の熱処理装置
JPS60258229A (ja) * 1984-06-05 1985-12-20 Mitsui Toatsu Chem Inc 芳香族ポリイミド樹脂に用いるプレポリマ−溶液の調整方法
JPH0765027B2 (ja) * 1984-12-18 1995-07-12 三井東圧化学株式会社 耐熱性接着剤
JPS61241359A (ja) * 1985-03-30 1986-10-27 Nitto Electric Ind Co Ltd ポリイミド前駆体溶液
US4658010A (en) * 1985-04-25 1987-04-14 Long John V Polyimide adhesive and method of making from lactam, dianhydride mixture and diamine
JPH0632351B2 (ja) * 1986-05-30 1994-04-27 日東電工株式会社 フレキシブルプリント基板
JPS63225629A (ja) * 1986-12-15 1988-09-20 Mitsubishi Electric Corp ポリイミド系樹脂
JPS6442136A (en) * 1987-08-07 1989-02-14 Nitto Denko Corp Manufacture of semiconductor device
JPH01188577A (ja) * 1988-01-21 1989-07-27 Hitachi Chem Co Ltd 気密封止用接着剤
US5192619A (en) * 1988-06-30 1993-03-09 Chisso Corporation Flexible copper-applied substrates
JP2848918B2 (ja) * 1990-05-14 1999-01-20 住友ベークライト株式会社 両面フレキシブルプリント回路基板用樹脂。
JPH0446983A (ja) * 1990-06-14 1992-02-17 Sumitomo Bakelite Co Ltd ポリイミド系接着剤
JP2834544B2 (ja) * 1990-06-18 1998-12-09 住友ベークライト株式会社 カバーレイ用接着剤
JPH0513902A (ja) * 1990-09-04 1993-01-22 Chisso Corp フレキシブルプリント基板及びその製造法
JP2938227B2 (ja) * 1991-04-17 1999-08-23 住友ベークライト株式会社 ポリアミック酸樹脂
JP3065388B2 (ja) * 1991-05-09 2000-07-17 住友ベークライト株式会社 フレキシブル印刷回路板の製造方法
JP3059248B2 (ja) * 1991-05-09 2000-07-04 住友ベークライト株式会社 フレキシブル印刷回路板の製造方法
US5300627A (en) * 1991-10-17 1994-04-05 Chisso Corporation Adhesive polyimide film
JP3221756B2 (ja) * 1992-12-28 2001-10-22 新日鐵化学株式会社 プリント基板用耐熱性接着剤フィルム及びその使用方法並びにこれを用いたプリント基板の製造方法
US5604041A (en) * 1995-11-14 1997-02-18 Choi; Jin-O Method of making free-standing polyimide film

Also Published As

Publication number Publication date
KR100262417B1 (ko) 2000-08-01
WO1993024583A1 (fr) 1993-12-09
EP0598911A1 (fr) 1994-06-01
DE69318675D1 (de) 1998-06-25
EP0598911B1 (fr) 1998-05-20
US5739263A (en) 1998-04-14
EP0598911A4 (fr) 1994-11-30
DE69318675T2 (de) 1999-02-04

Similar Documents

Publication Publication Date Title
US5468440B1 (en) Process of making oriented film or structure
IL104248A0 (en) Energy-polymerizable adhesive,coating,film and process for making the same
EP0519251A3 (en) Laminated film and process for producing the same
EP0449125A3 (en) Thin film electroluminescence device and process for production thereof
EP0277839A3 (en) Heat-shrinkable laminated film and process for producing the same
EP0299750A3 (en) Linear polyethylene film and process for producing the same
GB2264456B (en) Process for the application of protective self-adhesive film
SG44486A1 (en) Film adhesive and process for production thereof
CA2107977A1 (fr) Procédé de fabrication d'étiquettes autocollants appliqués sur les deux faces d'un produit assemblé
EP0448825A3 (en) Melt adhesive process
EP0485719A3 (en) Dielectrically isolated substrate and a process for producing the same
EP0438671A3 (en) Abrasive film and method for production thereof
EP0456472A3 (en) Zone adhesive/release coated tape and process
EP0504433A4 (en) Laminated film and production thereof
AU4657293A (en) Laminated product and process for making the same
AU5236686A (en) Process and apparatus for covering articles with film
GB8906628D0 (en) Process for manufacturing poly-epsilon-caproamide film
EP0198326A3 (en) Poly-p-phenylene-terephthalamide film and process for producing the same
GB9315201D0 (en) Adhesive films
GB2277529B (en) Inorganic skin film and process for forming the same
GB8924626D0 (en) Adhesive films
KR930003822B1 (en) Film forming process
GB9610969D0 (en) Thin film forming apparatus
EP0485720A3 (en) Dielectrically isolated substrate and a process for producing the same
EP0757937A3 (fr) Procédé pour la fabrication des rubans d'étiquettes auto-adhésives et les rubans d'étiquettes auto-adhésives ainsi fabriqués