SG62286G - An integrated circuit device and sub-assembly therefor - Google Patents

An integrated circuit device and sub-assembly therefor

Info

Publication number
SG62286G
SG62286G SG622/86A SG62286A SG62286G SG 62286 G SG62286 G SG 62286G SG 622/86 A SG622/86 A SG 622/86A SG 62286 A SG62286 A SG 62286A SG 62286 G SG62286 G SG 62286G
Authority
SG
Singapore
Prior art keywords
capacitor
power supply
terminals
chip
circuit
Prior art date
Application number
SG622/86A
Other languages
English (en)
Original Assignee
Avx Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avx Corp filed Critical Avx Corp
Publication of SG62286G publication Critical patent/SG62286G/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/475—Capacitors in combination with leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
SG622/86A 1982-01-15 1986-07-14 An integrated circuit device and sub-assembly therefor SG62286G (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/339,490 US4454529A (en) 1981-01-12 1982-01-15 Integrated circuit device having internal dampening for a plurality of power supplies

Publications (1)

Publication Number Publication Date
SG62286G true SG62286G (en) 1987-03-27

Family

ID=23329237

Family Applications (1)

Application Number Title Priority Date Filing Date
SG622/86A SG62286G (en) 1982-01-15 1986-07-14 An integrated circuit device and sub-assembly therefor

Country Status (8)

Country Link
US (1) US4454529A (2)
JP (1) JPS58124259A (2)
CA (1) CA1180824A (2)
DE (1) DE3234668A1 (2)
FR (1) FR2521780B1 (2)
GB (1) GB2113908B (2)
HK (1) HK83786A (2)
SG (1) SG62286G (2)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4527185A (en) * 1981-01-12 1985-07-02 Avx Corporation Integrated circuit device and subassembly
JPS5954249A (ja) * 1982-09-22 1984-03-29 Fujitsu Ltd 半導体装置
FR2550009B1 (fr) * 1983-07-29 1986-01-24 Inf Milit Spatiale Aeronaut Boitier de composant electronique muni d'un condensateur
US4534105A (en) * 1983-08-10 1985-08-13 Rca Corporation Method for grounding a pellet support pad in an integrated circuit device
JPH0828447B2 (ja) * 1983-10-05 1996-03-21 富士通株式会社 半導体装置の製造方法
US4595945A (en) * 1983-10-21 1986-06-17 At&T Bell Laboratories Plastic package with lead frame crossunder
US4680613A (en) * 1983-12-01 1987-07-14 Fairchild Semiconductor Corporation Low impedance package for integrated circuit die
JPS60192359A (ja) * 1984-03-14 1985-09-30 Nec Corp 半導体メモリ装置
DE3424876A1 (de) * 1984-07-06 1986-02-06 Telefunken Fernseh Und Rundfunk Gmbh, 3000 Hannover Integrierter schaltkreis
US4714981A (en) * 1986-04-09 1987-12-22 Rca Corporation Cover for a semiconductor package
US5065224A (en) * 1986-06-30 1991-11-12 Fairchild Semiconductor Corporation Low noise integrated circuit and leadframe
KR960013630B1 (ko) * 1986-06-30 1996-10-10 페어차일드 세미콘덕터 코퍼레이션 집적회로에서의 접지 변동 감소 장치
US5173621A (en) * 1986-06-30 1992-12-22 Fairchild Semiconductor Corporation Transceiver with isolated power rails for ground bounce reduction
US4819056A (en) * 1986-07-03 1989-04-04 Delco Electronics Corporation Hybrid thick film circuit device
DE3635375A1 (de) * 1986-10-17 1988-04-28 Heraeus Gmbh W C Systemtraeger fuer elektronische bauelemente
US4744008A (en) * 1986-11-18 1988-05-10 International Business Machines Corporation Flexible film chip carrier with decoupling capacitors
AU2780689A (en) * 1987-11-20 1989-06-14 Magellan Corporation (Australia) Pty Ltd Z-folded capacitor construction
US5099306A (en) * 1988-11-21 1992-03-24 Honeywell Inc. Stacked tab leadframe assembly
DE3900512A1 (de) * 1989-01-10 1990-07-19 Tucker Gmbh Bostik Halbleiterbauelement fuer ein schaltnetzteil
US5049979A (en) * 1990-06-18 1991-09-17 Microelectronics And Computer Technology Corporation Combined flat capacitor and tab integrated circuit chip and method
US5219787A (en) * 1990-07-23 1993-06-15 Microelectronics And Computer Technology Corporation Trenching techniques for forming channels, vias and components in substrates
US10361802B1 (en) 1999-02-01 2019-07-23 Blanding Hovenweep, Llc Adaptive pattern recognition based control system and method
US8352400B2 (en) 1991-12-23 2013-01-08 Hoffberg Steven M Adaptive pattern recognition based controller apparatus and method and human-factored interface therefore
JPH06173081A (ja) * 1992-12-03 1994-06-21 Murata Mfg Co Ltd 電子部品
DE4410212A1 (de) * 1994-03-24 1995-09-28 Telefunken Microelectron Elektronische Baugruppe
DE19520700B4 (de) * 1994-06-09 2004-09-09 Samsung Electronics Co., Ltd., Suwon Halbleiterbausteinanordnung
US5877930A (en) * 1997-03-27 1999-03-02 Digital Equipment Corporation Input and output noise reduction circuit
US7904187B2 (en) 1999-02-01 2011-03-08 Hoffberg Steven M Internet appliance system and method
JP2002026251A (ja) * 2000-07-11 2002-01-25 Toshiba Corp 半導体装置
US6683781B2 (en) * 2002-05-23 2004-01-27 Industrial Technology Research Institute Packaging structure with low switching noises
JP4661645B2 (ja) * 2005-03-23 2011-03-30 トヨタ自動車株式会社 パワー半導体モジュール
US20070096269A1 (en) * 2005-10-31 2007-05-03 Mediatek Inc. Leadframe for semiconductor packages
DE102011002864A1 (de) * 2011-01-19 2012-07-19 Zf Friedrichshafen Ag Leiterplatine und Verfahren zur Herstellung einer Leiterplatine
US10204737B2 (en) 2014-06-11 2019-02-12 Avx Corporation Low noise capacitors
JP6620404B2 (ja) * 2015-03-03 2019-12-18 Tdk株式会社 電子部品
DE102015106151B4 (de) * 2015-04-22 2019-07-11 Infineon Technologies Ag Leiterplatte mit eingebettetem Leistungshalbleiterchip
CN110098156B (zh) * 2018-01-29 2023-04-18 光宝新加坡有限公司 用于电容耦合隔离器的电容耦合封装结构
US11869727B2 (en) * 2021-08-31 2024-01-09 Kemet Electronics Corporation Device and process for forming membrane type capacitor devices

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5332233B1 (2) * 1968-12-25 1978-09-07
US3866311A (en) * 1971-06-14 1975-02-18 Nat Semiconductor Corp Method of providing electrically isolated overlapping metallic conductors
US3942245A (en) * 1971-11-20 1976-03-09 Ferranti Limited Related to the manufacture of lead frames and the mounting of semiconductor devices thereon
US4079511A (en) * 1976-07-30 1978-03-21 Amp Incorporated Method for packaging hermetically sealed integrated circuit chips on lead frames
US4200880A (en) * 1978-03-28 1980-04-29 Microwave Semiconductor Corp. Microwave transistor with distributed output shunt tuning
US4210885A (en) * 1978-06-30 1980-07-01 International Business Machines Corporation Thin film lossy line for preventing reflections in microcircuit chip package interconnections
US4234666A (en) * 1978-07-26 1980-11-18 Western Electric Company, Inc. Carrier tapes for semiconductor devices
US4249196A (en) * 1978-08-21 1981-02-03 Burroughs Corporation Integrated circuit module with integral capacitor
FR2456388A1 (fr) * 1979-05-10 1980-12-05 Thomson Brandt Microboitier de circuit electronique, et circuit hybride comportant un tel microboitier
JPS568854A (en) * 1979-07-04 1981-01-29 Mitsubishi Electric Corp Package for semiconductor device
US4303934A (en) * 1979-08-30 1981-12-01 Burr-Brown Research Corp. Molded lead frame dual in line package including a hybrid circuit
DE3001613C2 (de) * 1980-01-17 1986-04-03 Siemens AG, 1000 Berlin und 8000 München Befestigung eines, eine monolithisch integrierte Halbleiterschaltung enthaltenden Halbleiterkörpers aus Silicium an einer Unterlage mit einem entsprechenden Verfahren hierzu

Also Published As

Publication number Publication date
CA1180824A (en) 1985-01-08
FR2521780B1 (fr) 1987-03-20
GB2113908B (en) 1985-12-04
JPS58124259A (ja) 1983-07-23
FR2521780A1 (fr) 1983-08-19
DE3234668A1 (de) 1983-07-21
GB2113908A (en) 1983-08-10
HK83786A (en) 1986-11-14
US4454529A (en) 1984-06-12
JPS6352781B2 (2) 1988-10-20

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