TW200931008A - Pattern inspection device - Google Patents

Pattern inspection device Download PDF

Info

Publication number
TW200931008A
TW200931008A TW097140607A TW97140607A TW200931008A TW 200931008 A TW200931008 A TW 200931008A TW 097140607 A TW097140607 A TW 097140607A TW 97140607 A TW97140607 A TW 97140607A TW 200931008 A TW200931008 A TW 200931008A
Authority
TW
Taiwan
Prior art keywords
illumination
pattern
tape
inspection
image
Prior art date
Application number
TW097140607A
Other languages
English (en)
Chinese (zh)
Inventor
Shinichi Hattori
Original Assignee
Nippon Avionics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Avionics Co Ltd filed Critical Nippon Avionics Co Ltd
Publication of TW200931008A publication Critical patent/TW200931008A/zh

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/24Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N21/95607Inspecting patterns on the surface of objects using a comparative method
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N21/95692Patterns showing hole parts, e.g. honeycomb filtering structures
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N2021/95638Inspecting patterns on the surface of objects for PCB's

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Wire Bonding (AREA)
TW097140607A 2007-11-27 2008-10-23 Pattern inspection device TW200931008A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007305323A JP2009128268A (ja) 2007-11-27 2007-11-27 パターン検査装置

Publications (1)

Publication Number Publication Date
TW200931008A true TW200931008A (en) 2009-07-16

Family

ID=40819335

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097140607A TW200931008A (en) 2007-11-27 2008-10-23 Pattern inspection device

Country Status (3)

Country Link
JP (1) JP2009128268A (ko)
KR (1) KR20090054917A (ko)
TW (1) TW200931008A (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105004721B (zh) * 2014-04-24 2018-04-13 奥蒂玛光学科技(深圳)有限公司 电路板双面检测设备
CN105021619B (zh) * 2014-04-24 2018-08-07 奥蒂玛光学科技(深圳)有限公司 电路板检测设备及其距离调节机构
CN105352461A (zh) * 2015-12-15 2016-02-24 重庆志成机械有限公司 一种用于摩托车配件外观合格检测的图像获取装置
KR101865338B1 (ko) * 2016-09-08 2018-06-08 에스엔유 프리시젼 주식회사 선폭 측정장치 및 이를 이용한 선폭 측정방법
CN117147586A (zh) * 2023-10-26 2023-12-01 江苏纳沛斯半导体有限公司 一种cof树脂区异物检测方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH058458U (ja) * 1991-07-12 1993-02-05 旭光学工業株式会社 欠陥検査用の照明装置
JPH0992692A (ja) * 1995-07-13 1997-04-04 Toray Ind Inc Tabテープの検査装置および検査方法ならびに実装tabテープの製造方法および製造装置
JP3679471B2 (ja) * 1995-09-18 2005-08-03 ジェネシス・テクノロジー株式会社 光学的欠陥検査装置
JPH10221041A (ja) * 1997-02-10 1998-08-21 Toppan Printing Co Ltd 欠陥検査方法
KR19990039797A (ko) * 1997-11-14 1999-06-05 윤종용 테이프 케리어 패키지 부품의 외관 검사방법 및 장치
JPH11296657A (ja) * 1998-04-09 1999-10-29 Nippon Avionics Co Ltd 画像処理装置の撮像光学系
JP3875600B2 (ja) * 2002-07-15 2007-01-31 三井金属鉱業株式会社 画像作製方法
JP2004151622A (ja) * 2002-11-01 2004-05-27 Sony Corp マスク欠陥検査装置及びマスク欠陥検査方法
JP4403777B2 (ja) * 2003-11-07 2010-01-27 ウシオ電機株式会社 配線パターン検査装置及び方法
KR100578560B1 (ko) * 2005-01-10 2006-05-12 아주하이텍(주) 자동 광학 검사 장치

Also Published As

Publication number Publication date
KR20090054917A (ko) 2009-06-01
JP2009128268A (ja) 2009-06-11

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