TW315516B - - Google Patents

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Publication number
TW315516B
TW315516B TW085115435A TW85115435A TW315516B TW 315516 B TW315516 B TW 315516B TW 085115435 A TW085115435 A TW 085115435A TW 85115435 A TW85115435 A TW 85115435A TW 315516 B TW315516 B TW 315516B
Authority
TW
Taiwan
Prior art keywords
stamper
junction
pins
lower side
punch
Prior art date
Application number
TW085115435A
Other languages
English (en)
Chinese (zh)
Original Assignee
Ueno Seiki Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ueno Seiki Kk filed Critical Ueno Seiki Kk
Application granted granted Critical
Publication of TW315516B publication Critical patent/TW315516B/zh

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01Manufacture or treatment
    • H10W70/04Manufacture or treatment of leadframes
    • H10W70/048Mechanical treatments, e.g. punching, cutting, deforming or cold welding
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Bending Of Plates, Rods, And Pipes (AREA)
TW085115435A 1996-02-02 1996-12-13 TW315516B (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8040704A JPH09213860A (ja) 1996-02-02 1996-02-02 半導体リード成形方法

Publications (1)

Publication Number Publication Date
TW315516B true TW315516B (ja) 1997-09-11

Family

ID=12587970

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085115435A TW315516B (ja) 1996-02-02 1996-12-13

Country Status (4)

Country Link
JP (1) JPH09213860A (ja)
KR (1) KR100331292B1 (ja)
SG (1) SG64415A1 (ja)
TW (1) TW315516B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102916155B (zh) * 2012-10-23 2016-06-01 东莞新能源科技有限公司 一种降低卷绕式软包装电芯背部台阶的设备

Also Published As

Publication number Publication date
KR100331292B1 (ko) 2002-06-20
KR970063596A (ko) 1997-09-12
JPH09213860A (ja) 1997-08-15
SG64415A1 (en) 1999-04-27

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