TW315516B - - Google Patents
Download PDFInfo
- Publication number
- TW315516B TW315516B TW085115435A TW85115435A TW315516B TW 315516 B TW315516 B TW 315516B TW 085115435 A TW085115435 A TW 085115435A TW 85115435 A TW85115435 A TW 85115435A TW 315516 B TW315516 B TW 315516B
- Authority
- TW
- Taiwan
- Prior art keywords
- stamper
- junction
- pins
- lower side
- punch
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/04—Manufacture or treatment of leadframes
- H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Bending Of Plates, Rods, And Pipes (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8040704A JPH09213860A (ja) | 1996-02-02 | 1996-02-02 | 半導体リード成形方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW315516B true TW315516B (ja) | 1997-09-11 |
Family
ID=12587970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW085115435A TW315516B (ja) | 1996-02-02 | 1996-12-13 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPH09213860A (ja) |
| KR (1) | KR100331292B1 (ja) |
| SG (1) | SG64415A1 (ja) |
| TW (1) | TW315516B (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102916155B (zh) * | 2012-10-23 | 2016-06-01 | 东莞新能源科技有限公司 | 一种降低卷绕式软包装电芯背部台阶的设备 |
-
1996
- 1996-02-02 JP JP8040704A patent/JPH09213860A/ja active Pending
- 1996-12-13 TW TW085115435A patent/TW315516B/zh active
- 1996-12-26 KR KR1019960072084A patent/KR100331292B1/ko not_active Expired - Fee Related
-
1997
- 1997-01-10 SG SG1997000042A patent/SG64415A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR100331292B1 (ko) | 2002-06-20 |
| KR970063596A (ko) | 1997-09-12 |
| JPH09213860A (ja) | 1997-08-15 |
| SG64415A1 (en) | 1999-04-27 |
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