TW558760B - Carrier for cleaning silicon wafers - Google Patents

Carrier for cleaning silicon wafers Download PDF

Info

Publication number
TW558760B
TW558760B TW088118050A TW88118050A TW558760B TW 558760 B TW558760 B TW 558760B TW 088118050 A TW088118050 A TW 088118050A TW 88118050 A TW88118050 A TW 88118050A TW 558760 B TW558760 B TW 558760B
Authority
TW
Taiwan
Prior art keywords
wafer
carrier
wafers
patent application
scope
Prior art date
Application number
TW088118050A
Other languages
English (en)
Chinese (zh)
Inventor
Yoshio Iwamoto
Hiroyuki Kurokawa
Original Assignee
Memc Electronic Materials
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Memc Electronic Materials filed Critical Memc Electronic Materials
Application granted granted Critical
Publication of TW558760B publication Critical patent/TW558760B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/13—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW088118050A 1998-10-19 1999-12-07 Carrier for cleaning silicon wafers TW558760B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10297290A JP2000124183A (ja) 1998-10-19 1998-10-19 シリコンウェーハ洗浄用キャリア

Publications (1)

Publication Number Publication Date
TW558760B true TW558760B (en) 2003-10-21

Family

ID=17844608

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088118050A TW558760B (en) 1998-10-19 1999-12-07 Carrier for cleaning silicon wafers

Country Status (6)

Country Link
EP (1) EP1138061A2 (de)
JP (1) JP2000124183A (de)
KR (1) KR20010075619A (de)
CN (1) CN1326588A (de)
TW (1) TW558760B (de)
WO (1) WO2000024041A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100857938B1 (ko) * 2001-09-27 2008-09-09 신에츠 폴리머 가부시키가이샤 백 그라운드 웨이퍼의 이송 용기 및 수납 방법
US6845779B2 (en) * 2001-11-13 2005-01-25 Fsi International, Inc. Edge gripping device for handling a set of semiconductor wafers in an immersion processing system
EP1863079B1 (de) * 2006-06-02 2011-08-10 Rohm and Haas Electronic Materials, L.L.C. Vorrichtung mit Verbindungen mit ausgebuchtetem Radius
US20110195579A1 (en) * 2010-02-11 2011-08-11 Taiwan Semiconductor Manufacturing Company, Ltd. Scribe-line draining during wet-bench etch and clean processes
CN115692271A (zh) * 2022-08-29 2023-02-03 上海提牛机电设备有限公司 硅片夹具

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2513843B2 (ja) * 1989-06-20 1996-07-03 富士通株式会社 基板ホルダ
JP2609815B2 (ja) * 1994-07-22 1997-05-14 九州日本電気株式会社 ウェット処理装置
JPH10223585A (ja) * 1997-02-04 1998-08-21 Canon Inc ウェハ処理装置及びその方法並びにｓｏｉウェハの製造方法

Also Published As

Publication number Publication date
WO2000024041A1 (en) 2000-04-27
WO2000024041B1 (en) 2000-06-29
EP1138061A2 (de) 2001-10-04
KR20010075619A (ko) 2001-08-09
JP2000124183A (ja) 2000-04-28
CN1326588A (zh) 2001-12-12

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