ATE316560T1 - Klebstoff, klebstoffgegenstand, schaltungssubstrat für halbleitermontage mit einem klebstoff und eine halbleiteranordnung die diesen enthält - Google Patents

Klebstoff, klebstoffgegenstand, schaltungssubstrat für halbleitermontage mit einem klebstoff und eine halbleiteranordnung die diesen enthält

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Publication number
ATE316560T1
ATE316560T1 AT00937250T AT00937250T ATE316560T1 AT E316560 T1 ATE316560 T1 AT E316560T1 AT 00937250 T AT00937250 T AT 00937250T AT 00937250 T AT00937250 T AT 00937250T AT E316560 T1 ATE316560 T1 AT E316560T1
Authority
AT
Austria
Prior art keywords
adhesive
semiconductor
same
circuit substrate
assembly containing
Prior art date
Application number
AT00937250T
Other languages
English (en)
Inventor
Yuko Tanaka
Yasushi Shimada
Teiichi Inada
Hiroyuki Kuriya
Kazunori Yamamoto
Yasushi Kumashiro
Keiji Sumiya
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Application granted granted Critical
Publication of ATE316560T1 publication Critical patent/ATE316560T1/de

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/027—Polycondensates containing more than one epoxy group per molecule obtained by epoxidation of unsaturated precursor, e.g. polymer or monomer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/068—Copolymers with monomers not covered by C09J133/06 containing glycidyl groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/26—Porous or cellular plastics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00—Presence of halogenated polymer
    • C09J2427/006—Presence of halogenated polymer in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2477/00—Presence of polyamide
    • C09J2477/006—Presence of polyamide in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2481/00—Presence of sulfur containing polymers
    • C09J2481/006—Presence of sulfur containing polymers in the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/656—Fan-in layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
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    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
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    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/381—Auxiliary members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/884—Die-attach connectors and bond wires
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/922—Bond pads being integral with underlying chip-level interconnections
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    • H10W74/00—Encapsulations, e.g. protective coatings
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    • H10W90/00—Package configurations
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    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
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    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
AT00937250T 1999-06-18 2000-06-15 Klebstoff, klebstoffgegenstand, schaltungssubstrat für halbleitermontage mit einem klebstoff und eine halbleiteranordnung die diesen enthält ATE316560T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP17281599 1999-06-18
JP33787899 1999-11-29

Publications (1)

Publication Number Publication Date
ATE316560T1 true ATE316560T1 (de) 2006-02-15

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Families Citing this family (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100931745B1 (ko) * 2000-02-15 2009-12-14 히다치 가세고교 가부시끼가이샤 접착제 조성물, 그 제조 방법, 이것을 이용한 접착 필름, 반도체 탑재용 기판 및 반도체 장치
JP4780844B2 (ja) * 2001-03-05 2011-09-28 Ｏｋｉセミコンダクタ株式会社 半導体装置
JP2002299378A (ja) * 2001-03-30 2002-10-11 Lintec Corp 導電体付接着シート、半導体装置製造方法および半導体装置
US7423083B2 (en) * 2001-09-14 2008-09-09 Sumitomo Chemical Company Limited Photosemiconductor encapsulant of epoxy group-containing (meth) acrylic polymer and alicyclic anhydride
JP2003092379A (ja) * 2001-09-18 2003-03-28 Hitachi Ltd 半導体装置
US6873059B2 (en) 2001-11-13 2005-03-29 Texas Instruments Incorporated Semiconductor package with metal foil attachment film
US20050205972A1 (en) * 2002-03-13 2005-09-22 Mitsui Mining & Smelting Co., Ltd. COF flexible printed wiring board and semiconductor device
US7173322B2 (en) * 2002-03-13 2007-02-06 Mitsui Mining & Smelting Co., Ltd. COF flexible printed wiring board and method of producing the wiring board
JP3889700B2 (ja) * 2002-03-13 2007-03-07 三井金属鉱業株式会社 Ｃｏｆフィルムキャリアテープの製造方法
US7304362B2 (en) * 2002-05-20 2007-12-04 Stmicroelectronics, Inc. Molded integrated circuit package with exposed active area
CN100449776C (zh) * 2002-06-17 2009-01-07 亨凯尔公司 间层电介质和预施涂的模片连接粘合剂材料
JP2004140313A (ja) * 2002-08-22 2004-05-13 Jsr Corp 二層積層膜を用いた電極パッド上へのバンプ形成方法
TW582078B (en) * 2002-11-29 2004-04-01 Chipmos Technologies Bermuda Packaging process for improving effective die-bonding area
JP4238124B2 (ja) * 2003-01-07 2009-03-11 積水化学工業株式会社 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、接着性エポキシ樹脂シート、導電接続ペースト、導電接続シート及び電子部品接合体
US20040197571A1 (en) * 2003-04-03 2004-10-07 Yuji Hiroshige Thermosetting composition, and sealing article and sealing structure using the same
KR20120003502A (ko) * 2003-05-21 2012-01-10 니폰 가야꾸 가부시끼가이샤 액정 실란트 및 그것을 사용하여 제조한 액정표시 셀
US7047633B2 (en) * 2003-05-23 2006-05-23 National Starch And Chemical Investment Holding, Corporation Method of using pre-applied underfill encapsulant
KR101169182B1 (ko) * 2003-06-06 2012-07-30 히다치 가세고교 가부시끼가이샤 반도체 장치의 제조방법
JP4610168B2 (ja) * 2003-08-06 2011-01-12 スリーエム イノベイティブ プロパティズ カンパニー 耐熱マスキングテープ
JP4397653B2 (ja) * 2003-08-26 2010-01-13 日東電工株式会社 半導体装置製造用接着シート
KR101103936B1 (ko) * 2003-10-17 2012-01-12 샤프 가부시키가이샤 액정 시일제, 그것을 사용한 액정 표시 장치 및 이 장치의제조 방법
MY138566A (en) * 2004-03-15 2009-06-30 Hitachi Chemical Co Ltd Dicing/die bonding sheet
US20060008735A1 (en) * 2004-07-09 2006-01-12 Jsr Corporation Radiation sensitive resin composition for forming microlens
US7161232B1 (en) 2004-09-14 2007-01-09 National Semiconductor Corporation Apparatus and method for miniature semiconductor packages
US7585570B2 (en) * 2005-04-14 2009-09-08 Sumitomo Chemical Company, Limited Adhesives and optical laminates including the same
DE102006007108B4 (de) * 2006-02-16 2020-09-17 Lohmann Gmbh & Co. Kg Reaktive Harzmischung und Verfahren zu deren Herstellung
US20070212551A1 (en) * 2006-03-10 2007-09-13 Andrew Collins Adhesive composition
JP2007294488A (ja) * 2006-04-20 2007-11-08 Shinko Electric Ind Co Ltd 半導体装置、電子部品、及び半導体装置の製造方法
KR101370245B1 (ko) * 2006-05-23 2014-03-05 린텍 가부시키가이샤 점접착제 조성물, 점접착 시트 및 반도체장치의 제조방법
US7772040B2 (en) * 2006-09-12 2010-08-10 Nitto Denko Corporation Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby
KR20080047990A (ko) 2006-11-27 2008-05-30 린텍 가부시키가이샤 점접착제 조성물, 점접착 시트 및 반도체 장치의 제조방법
JP5143019B2 (ja) * 2006-12-04 2013-02-13 パナソニック株式会社 封止材料、実装方法、リペア方法および実装構造体
TW200837137A (en) 2007-01-26 2008-09-16 Hitachi Chemical Co Ltd Sealing film and semiconductor device using the same
JP2008247936A (ja) * 2007-03-29 2008-10-16 Lintec Corp 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
KR100896106B1 (ko) * 2007-05-31 2009-05-07 엘에스엠트론 주식회사 상분리 패이스트 타입 점착제 및 그를 이용한 반도체 칩패키지 및 패키징 방법
TW200907003A (en) * 2007-07-03 2009-02-16 Hitachi Chemical Co Ltd Adhesive composition and method of manufacturing thereof, adhesive member using the adhesive composition and method of manufacturing thereof, supporting member for mounting semiconductor and method of manufacturing thereof, and semiconductor apparatus an
KR101002488B1 (ko) * 2007-10-24 2010-12-17 제일모직주식회사 공-연속 상 분리 구조를 가지는 반도체 다이 접착제 조성물 및 이로부터 제조된 접착제 필름
US9969909B2 (en) 2007-11-08 2018-05-15 Hitachi Chemical Company, Ltd. Adhesive sheet for semiconductor, and dicing tape integrated adhesive sheet for semiconductor
KR100922226B1 (ko) * 2007-12-10 2009-10-20 주식회사 엘지화학 접착 필름, 다이싱 다이본딩 필름 및 반도체 장치
JP5499448B2 (ja) * 2008-07-16 2014-05-21 デクセリアルズ株式会社 異方性導電接着剤
CN102307725A (zh) 2008-12-15 2012-01-04 3M创新有限公司 用于具有阻挡层的复合材料的贴面膜
JP5558140B2 (ja) * 2009-06-10 2014-07-23 デクセリアルズ株式会社 絶縁性樹脂フィルム、並びにこれを用いた接合体及びその製造方法
US8592260B2 (en) * 2009-06-26 2013-11-26 Nitto Denko Corporation Process for producing a semiconductor device
JP5728804B2 (ja) * 2009-10-07 2015-06-03 デクセリアルズ株式会社 熱硬化性接着組成物、熱硬化性接着シート、その製造方法及び補強フレキシブルプリント配線板
JP5761028B2 (ja) * 2009-12-01 2015-08-12 ニプロ株式会社 細胞電位測定容器及びその製造方法
BR112012014492A2 (pt) * 2009-12-15 2017-03-14 3M Innovative Properties Co filme de fluoropolímero com adesivo à base de epóxi
WO2011086680A1 (ja) * 2010-01-15 2011-07-21 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電接着剤
JP5586313B2 (ja) * 2010-04-23 2014-09-10 京セラケミカル株式会社 接着剤層の形成方法、及び接着剤組成物
JP5820108B2 (ja) * 2010-11-29 2015-11-24 デクセリアルズ株式会社 熱硬化性接着シート及び熱硬化性接着シートの製造方法
JP5770995B2 (ja) 2010-12-01 2015-08-26 デクセリアルズ株式会社 熱硬化性樹脂組成物、熱硬化性接着シート及び熱硬化性接着シートの製造方法
KR101191075B1 (ko) * 2011-06-15 2012-10-16 (주)에프씨아이 에스아이피 구현을 위한 패키지 및 그 제조방법
US20130026660A1 (en) * 2011-07-29 2013-01-31 Namics Corporation Liquid epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same
US20130042976A1 (en) * 2011-08-19 2013-02-21 Harris Corporation Film adhesives and processes for bonding components using same
JP5901923B2 (ja) * 2011-09-30 2016-04-13 太陽インキ製造株式会社 熱硬化性樹脂充填材及びプリント配線板
JP5894035B2 (ja) * 2012-08-15 2016-03-23 日立化成株式会社 半導体装置の製造方法
KR20140123779A (ko) * 2013-04-15 2014-10-23 동우 화인켐 주식회사 광경화 코팅 조성물, 이를 이용한 코팅 필름 및 편광판
CN104570498B (zh) * 2014-11-24 2017-10-13 深圳市华星光电技术有限公司 可挠曲液晶面板及其制作方法
WO2016175612A1 (ko) 2015-04-29 2016-11-03 주식회사 엘지화학 반도체용 접착 필름
JP6265954B2 (ja) * 2015-09-16 2018-01-24 古河電気工業株式会社 半導体裏面用フィルム
EP3336120A1 (de) * 2016-12-14 2018-06-20 Sika Technology AG Epoxidharz-klebstoff mit hoher druckfestigkeit
CN110603624B (zh) * 2017-05-10 2024-12-13 株式会社力森诺科 半导体密封成形用临时保护膜
KR102057204B1 (ko) * 2017-12-18 2020-01-22 (주)이녹스첨단소재 지문인식센서 칩용 보강필름, 이의 제조방법 및 이를 포함하는 지문인식센서 모듈
US12398298B2 (en) 2018-11-09 2025-08-26 Resonac Corporation Temporary protective film for producing semiconductor device, reel body, and method for producing semiconductor device
WO2020150222A1 (en) * 2019-01-16 2020-07-23 Henkel IP & Holding GmbH Curable compositions for production of reaction induced phase separated compositions with improved properties
DE102019004057B4 (de) * 2019-06-11 2022-02-03 Lohmann Gmbh & Co. Kg Komprimierbarer, haftklebriger, struktureller Klebefilm auf Basis einer latent reaktiven Zusammensetzung
US12451367B2 (en) 2019-06-19 2025-10-21 Showa Denko Materials Co., Ltd. Temporary protective film for semiconductor encapsulation molding, lead frame with temporary protective film, encapsulation molded body with temporary protective film, and method for manufacturing semiconductor device
JP6691998B1 (ja) * 2019-12-24 2020-05-13 株式会社鈴木 半導体装置の製造方法及び半導体装置の製造装置
DE102020206619A1 (de) 2020-05-27 2021-12-02 Tesa Se Vorvernetzte epoxid-haftklebmassen und klebebänder, welche diese enthalten
DE102020213368A1 (de) 2020-10-22 2022-04-28 Tesa Se Protonenschwämme als Katalysator in Klebstoffen und Klebstoffe die diese enthalten
KR102485700B1 (ko) * 2020-12-23 2023-01-06 주식회사 두산 반도체 패키지용 언더필 필름 및 이를 이용하는 반도체 패키지의 제조방법
JP7789086B2 (ja) * 2021-12-20 2025-12-19 東京応化工業株式会社 光硬化性組成物、パターン形成方法及び硬化膜

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62297377A (ja) * 1986-06-18 1987-12-24 Nissan Motor Co Ltd エポキシ樹脂系接着性組成物
JPS6372722A (ja) * 1986-09-12 1988-04-02 Matsushita Electric Ind Co Ltd 一液性熱硬化型エポキシ樹脂組成物
JPS6381187A (ja) * 1986-09-25 1988-04-12 Ibiden Co Ltd 熱硬化性接着シ−ト
EP0289939A1 (de) 1987-05-08 1988-11-09 ASTA Pharma AG Neue 4-Benzyl-1-(2H)-phthalazinon-Derivate mit einem Aminosäurerest
JPH0747725B2 (ja) * 1987-10-26 1995-05-24 サンスター技研株式会社 フレキシブルプリント基板用接着剤
US5021519A (en) * 1988-03-24 1991-06-04 Aluminum Company Of America Epoxy-polyimide blend for low temperature cure, high-performance resin system and composites
JPH0715087B2 (ja) * 1988-07-21 1995-02-22 リンテック株式会社 粘接着テープおよびその使用方法
JPH03255185A (ja) * 1990-03-05 1991-11-14 Hitachi Chem Co Ltd アディティブ法プリント配線板用の接着剤
JPH07119273B2 (ja) * 1990-05-30 1995-12-20 ソマール株式会社 エポキシ樹脂組成物の製造方法
JPH04314391A (ja) * 1991-04-12 1992-11-05 Hitachi Chem Co Ltd アディティブ法プリント配線板用接着剤
JP2914794B2 (ja) * 1991-08-31 1999-07-05 日本カーバイド工業株式会社 耐熱性樹脂ライニング用接着剤組成物
JPH05156226A (ja) * 1991-12-03 1993-06-22 Ube Ind Ltd 構造用接着剤組成物
JP3513835B2 (ja) * 1993-03-09 2004-03-31 日立化成工業株式会社 接着フィルム
JP3321261B2 (ja) * 1993-09-08 2002-09-03 日立化成工業株式会社 抵抗回路付シートヒーター用接着剤組成物
JPH07173449A (ja) * 1993-12-17 1995-07-11 Hitachi Chem Co Ltd アクリル系接着剤組成物及びこれを用いた接着フィルム
JPH07292339A (ja) * 1994-04-21 1995-11-07 Nippon Carbide Ind Co Inc 金属箔張積層板用接着剤組成物及び金属箔張積層板用接着シート
WO1996031574A1 (en) 1995-04-04 1996-10-10 Hitachi Chemical Company, Ltd. Adhesive, adhesive film and adhesive-backed metal foil
US5708056A (en) 1995-12-04 1998-01-13 Delco Electronics Corporation Hot melt epoxy encapsulation material
JP3787889B2 (ja) 1996-05-09 2006-06-21 日立化成工業株式会社 多層配線板及びその製造方法
WO1998003047A1 (fr) * 1996-07-15 1998-01-22 Hitachi Chemical Company, Ltd. Adhesif du type film destine a la connexion d'un circuit et d'une plaquette de circuits
TW383435B (en) 1996-11-01 2000-03-01 Hitachi Chemical Co Ltd Electronic device
JP3675072B2 (ja) * 1996-11-28 2005-07-27 日立化成工業株式会社 半導体装置
JP3792327B2 (ja) 1996-12-24 2006-07-05 日立化成工業株式会社 熱伝導性接着剤組成物及び該組成物を用いた熱伝導性接着フィルム
JPH10226769A (ja) * 1997-02-17 1998-08-25 Hitachi Chem Co Ltd フィルム状接着剤及び接続方法
JP4514840B2 (ja) * 1997-02-14 2010-07-28 日立化成工業株式会社 回路部材接続用接着剤
JP4440352B2 (ja) * 1997-02-17 2010-03-24 日立化成工業株式会社 回路部材接続用接着剤
JP3559137B2 (ja) 1997-02-27 2004-08-25 日立化成工業株式会社 熱伝導性接着剤組成物及び該組成物を用いた熱伝導性接着フィルム
JPH10245533A (ja) * 1997-03-06 1998-09-14 Sekisui Chem Co Ltd 硬化型粘接着シート
JP4151081B2 (ja) 1997-03-07 2008-09-17 日立化成工業株式会社 回路部材接続用接着剤
JP3877089B2 (ja) * 1997-03-31 2007-02-07 日立化成工業株式会社 回路接続用接着剤及び回路板の製造法
JP3978623B2 (ja) * 1997-06-10 2007-09-19 日立化成工業株式会社 多層配線板
JP3915940B2 (ja) * 1997-06-10 2007-05-16 日立化成工業株式会社 絶縁層用接着フィルム
JP3944795B2 (ja) * 1997-06-20 2007-07-18 日立化成工業株式会社 多層配線板
JP3498537B2 (ja) * 1997-06-25 2004-02-16 日立化成工業株式会社 絶縁層用接着フィルム
JP4045620B2 (ja) * 1997-10-08 2008-02-13 日立化成工業株式会社 回路接続用フィルム状接着剤
JPH11166019A (ja) * 1997-12-03 1999-06-22 Hitachi Chem Co Ltd アクリル樹脂とこれを用いた接着剤及び接着フィルム並びにアクリル樹脂の製造法
JPH11209723A (ja) * 1998-01-30 1999-08-03 Hitachi Chem Co Ltd 難燃化接着剤、難燃化接着部材、難燃化接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置
JPH11209724A (ja) * 1998-01-30 1999-08-03 Hitachi Chem Co Ltd 難燃化接着剤、難燃化接着部材、難燃化接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置
JPH11246829A (ja) * 1998-02-27 1999-09-14 Hitachi Chem Co Ltd 両面接着フィルム及び半導体装置
JPH11256013A (ja) * 1998-03-12 1999-09-21 Ajinomoto Co Inc エポキシ樹脂組成物
JPH11265960A (ja) * 1998-03-18 1999-09-28 Hitachi Chem Co Ltd 金属製補強材付き半導体装置
JPH11284114A (ja) * 1998-03-27 1999-10-15 Hitachi Chem Co Ltd 半導体装置
JP2000144077A (ja) * 1998-11-17 2000-05-26 Hitachi Chem Co Ltd 両面接着フィルム及びこれを用いた半導体装置
JP2000159860A (ja) * 1998-11-27 2000-06-13 Hitachi Chem Co Ltd 耐熱性樹脂組成物

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DE60025720D1 (de) 2006-04-13
EP1209211A4 (de) 2002-09-25
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ATE370209T1 (de) 2007-09-15
EP1586615A1 (de) 2005-10-19
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DE60036038T2 (de) 2008-04-30
US20030145949A1 (en) 2003-08-07
KR20040064722A (ko) 2004-07-19
EP1209211B1 (de) 2006-01-25
KR100511759B1 (ko) 2005-08-31
EP1209211A1 (de) 2002-05-29
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WO2000078887A1 (en) 2000-12-28
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