ATE330046T1 - Verfahren und fördereinrichtung zur elektrolytischen behandlung von werkstücken - Google Patents
Verfahren und fördereinrichtung zur elektrolytischen behandlung von werkstückenInfo
- Publication number
- ATE330046T1 ATE330046T1 AT02781274T AT02781274T ATE330046T1 AT E330046 T1 ATE330046 T1 AT E330046T1 AT 02781274 T AT02781274 T AT 02781274T AT 02781274 T AT02781274 T AT 02781274T AT E330046 T1 ATE330046 T1 AT E330046T1
- Authority
- AT
- Austria
- Prior art keywords
- counter electrodes
- work pieces
- various counter
- electrolytically
- far
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
- C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing of the conductive pattern
- H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Forging (AREA)
- Electrolytic Production Of Metals (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10153171A DE10153171B4 (de) | 2001-10-27 | 2001-10-27 | Verfahren und Vorrichtung zum elektrolytischen Behandeln von Teilen in Durchlaufanlagen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE330046T1 true ATE330046T1 (de) | 2006-07-15 |
Family
ID=7703987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT02781274T ATE330046T1 (de) | 2001-10-27 | 2002-10-21 | Verfahren und fördereinrichtung zur elektrolytischen behandlung von werkstücken |
Country Status (14)
| Country | Link |
|---|---|
| US (1) | US7563352B2 (de) |
| EP (1) | EP1438447B1 (de) |
| JP (1) | JP4268874B2 (de) |
| KR (1) | KR100956536B1 (de) |
| CN (1) | CN1325699C (de) |
| AT (1) | ATE330046T1 (de) |
| AU (1) | AU2002348997A1 (de) |
| BR (1) | BR0213532A (de) |
| CA (1) | CA2454267A1 (de) |
| DE (2) | DE10153171B4 (de) |
| ES (1) | ES2265516T3 (de) |
| MX (1) | MXPA04003963A (de) |
| TW (1) | TW574434B (de) |
| WO (1) | WO2003038159A2 (de) |
Families Citing this family (62)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7241366B2 (en) * | 2004-11-30 | 2007-07-10 | Metokote Corporation | Continuous coating process |
| DE102005009024B4 (de) * | 2005-02-28 | 2010-09-30 | Advanced Micro Devices Inc., Sunnyvale | Verfahren und System zum Steuern einer vertikalen Substratposition in einem elektrochemischen Prozess zur Herstellung von mikrostrukturierten integrierten Schaltungen |
| WO2007116667A1 (ja) | 2006-03-29 | 2007-10-18 | Toray Industries, Inc. | 給電方法、ウェブの連続電解めっき装置およびめっき膜付きプラスチックフィルムの製造方法 |
| US8815073B2 (en) | 2007-03-28 | 2014-08-26 | Toray Industries, Inc. | Web pressure welding method, pressure welding device, power supply method, power supply device, continuous electrolytic plating apparatus and method for manufacturing web with plated coating film |
| JP5457010B2 (ja) * | 2007-11-01 | 2014-04-02 | アルメックスＰｅ株式会社 | 連続めっき処理装置 |
| US8313627B2 (en) * | 2008-01-24 | 2012-11-20 | GM Global Technology Operations LLC | Drag through electro-deposition system |
| NL1035265C2 (nl) * | 2008-04-07 | 2009-10-08 | Meco Equip Eng | Werkwijze en inrichting voor het elektrolytisch galvaniseren van niet-metallische glasachtige substraten. |
| US11476566B2 (en) | 2009-03-09 | 2022-10-18 | Nucurrent, Inc. | Multi-layer-multi-turn structure for high efficiency wireless communication |
| US9232893B2 (en) | 2009-03-09 | 2016-01-12 | Nucurrent, Inc. | Method of operation of a multi-layer-multi-turn structure for high efficiency wireless communication |
| US9439287B2 (en) | 2009-03-09 | 2016-09-06 | Nucurrent, Inc. | Multi-layer wire structure for high efficiency wireless communication |
| US9300046B2 (en) | 2009-03-09 | 2016-03-29 | Nucurrent, Inc. | Method for manufacture of multi-layer-multi-turn high efficiency inductors |
| WO2010104569A1 (en) | 2009-03-09 | 2010-09-16 | Neurds Inc. | System and method for wireless power transfer in implantable medical devices |
| US9306358B2 (en) | 2009-03-09 | 2016-04-05 | Nucurrent, Inc. | Method for manufacture of multi-layer wire structure for high efficiency wireless communication |
| US9444213B2 (en) | 2009-03-09 | 2016-09-13 | Nucurrent, Inc. | Method for manufacture of multi-layer wire structure for high efficiency wireless communication |
| US9208942B2 (en) | 2009-03-09 | 2015-12-08 | Nucurrent, Inc. | Multi-layer-multi-turn structure for high efficiency wireless communication |
| KR101149254B1 (ko) * | 2010-02-26 | 2012-05-25 | 현대제철 주식회사 | 가공물 부식 방지 기능을 갖는 와이어 방전 가공 장치 |
| CN102337577B (zh) * | 2010-07-22 | 2014-03-12 | 富葵精密组件(深圳)有限公司 | 电镀装置 |
| US8784618B2 (en) | 2010-08-19 | 2014-07-22 | International Business Machines Corporation | Working electrode design for electrochemical processing of electronic components |
| KR101242526B1 (ko) | 2010-12-14 | 2013-03-12 | (주)포인텍 | 지능형 도금용 캐리어의 제어방법 |
| US20130068499A1 (en) * | 2011-09-15 | 2013-03-21 | Nucurrent Inc. | Method for Operation of Multi-Layer Wire Structure for High Efficiency Wireless Communication |
| DE102011113976A1 (de) * | 2011-09-21 | 2013-04-25 | Charlotte Schade | Elektronische Formanode zur galvanischen Metallabscheidung |
| JP5795514B2 (ja) * | 2011-09-29 | 2015-10-14 | アルメックスＰｅ株式会社 | 連続メッキ装置 |
| CN102560605B (zh) * | 2011-12-29 | 2016-10-05 | 中国第一汽车股份有限公司 | 降低电泳槽液杂离子含量的工艺方法 |
| CN103590079A (zh) * | 2012-08-14 | 2014-02-19 | 亚洲电镀器材有限公司 | 一种电镀方法 |
| CN103266334B (zh) * | 2013-04-24 | 2015-12-02 | 东莞市鸿展机械设备有限公司 | 隔液传送装置 |
| CN104862768B (zh) * | 2015-05-27 | 2017-09-22 | 广州杰赛科技股份有限公司 | 一种电路板的电镀方法及装置 |
| US10658847B2 (en) | 2015-08-07 | 2020-05-19 | Nucurrent, Inc. | Method of providing a single structure multi mode antenna for wireless power transmission using magnetic field coupling |
| US10063100B2 (en) | 2015-08-07 | 2018-08-28 | Nucurrent, Inc. | Electrical system incorporating a single structure multimode antenna for wireless power transmission using magnetic field coupling |
| US10636563B2 (en) | 2015-08-07 | 2020-04-28 | Nucurrent, Inc. | Method of fabricating a single structure multi mode antenna for wireless power transmission using magnetic field coupling |
| US9941590B2 (en) | 2015-08-07 | 2018-04-10 | Nucurrent, Inc. | Single structure multi mode antenna for wireless power transmission using magnetic field coupling having magnetic shielding |
| US11205848B2 (en) | 2015-08-07 | 2021-12-21 | Nucurrent, Inc. | Method of providing a single structure multi mode antenna having a unitary body construction for wireless power transmission using magnetic field coupling |
| US9948129B2 (en) | 2015-08-07 | 2018-04-17 | Nucurrent, Inc. | Single structure multi mode antenna for wireless power transmission using magnetic field coupling having an internal switch circuit |
| US9960629B2 (en) | 2015-08-07 | 2018-05-01 | Nucurrent, Inc. | Method of operating a single structure multi mode antenna for wireless power transmission using magnetic field coupling |
| US9941743B2 (en) | 2015-08-07 | 2018-04-10 | Nucurrent, Inc. | Single structure multi mode antenna having a unitary body construction for wireless power transmission using magnetic field coupling |
| US9960628B2 (en) | 2015-08-07 | 2018-05-01 | Nucurrent, Inc. | Single structure multi mode antenna having a single layer structure with coils on opposing sides for wireless power transmission using magnetic field coupling |
| US9941729B2 (en) | 2015-08-07 | 2018-04-10 | Nucurrent, Inc. | Single layer multi mode antenna for wireless power transmission using magnetic field coupling |
| WO2017031348A1 (en) | 2015-08-19 | 2017-02-23 | Nucurrent, Inc. | Multi-mode wireless antenna configurations |
| CN105063709B (zh) * | 2015-09-18 | 2018-02-23 | 安捷利电子科技（苏州）有限公司 | 印刷电路板用电镀装置 |
| US11011915B2 (en) | 2016-08-26 | 2021-05-18 | Nucurrent, Inc. | Method of making a wireless connector transmitter module |
| WO2018053158A1 (en) * | 2016-09-14 | 2018-03-22 | Modumetal, Inc. | System for reliable, high throughput, complex electric field generation, and method for producing coatings therefrom |
| EP3552298A4 (de) | 2016-12-09 | 2020-01-15 | NuCurrent, Inc. | Substrat mit konfiguration zur erleichterung der energieübertragung durch metall über eine magnetische nahfeldkopplung |
| US11177695B2 (en) | 2017-02-13 | 2021-11-16 | Nucurrent, Inc. | Transmitting base with magnetic shielding and flexible transmitting antenna |
| US10947636B2 (en) | 2017-03-21 | 2021-03-16 | Rockwell Automation Technologies, Inc. | Adjustable AC/DC conversion topology to regulate an isolated DC load with low AC ripple |
| US11277028B2 (en) | 2017-05-26 | 2022-03-15 | Nucurrent, Inc. | Wireless electrical energy transmission system for flexible device orientation |
| CN109468677A (zh) * | 2018-12-05 | 2019-03-15 | 珠海杰赛科技有限公司 | 一种垂直连续电镀方法 |
| KR102636830B1 (ko) * | 2018-12-31 | 2024-02-14 | 엘지디스플레이 주식회사 | 전기 도금 장치 및 이를 이용한 전기 도금 방법 |
| US11271430B2 (en) | 2019-07-19 | 2022-03-08 | Nucurrent, Inc. | Wireless power transfer system with extended wireless charging range |
| US11227712B2 (en) | 2019-07-19 | 2022-01-18 | Nucurrent, Inc. | Preemptive thermal mitigation for wireless power systems |
| CN110965112B (zh) * | 2019-12-19 | 2022-02-11 | 漳州市福美鑫新材料科技有限公司 | 一种用于自动电镀设备的电镀时间调节装置 |
| US11056922B1 (en) | 2020-01-03 | 2021-07-06 | Nucurrent, Inc. | Wireless power transfer system for simultaneous transfer to multiple devices |
| CN113943966A (zh) * | 2020-07-16 | 2022-01-18 | 南通深南电路有限公司 | 一种电路板的电镀装置和电镀方法 |
| US11283303B2 (en) | 2020-07-24 | 2022-03-22 | Nucurrent, Inc. | Area-apportioned wireless power antenna for maximized charging volume |
| US11876386B2 (en) | 2020-12-22 | 2024-01-16 | Nucurrent, Inc. | Detection of foreign objects in large charging volume applications |
| US11881716B2 (en) | 2020-12-22 | 2024-01-23 | Nucurrent, Inc. | Ruggedized communication for wireless power systems in multi-device environments |
| US11695302B2 (en) | 2021-02-01 | 2023-07-04 | Nucurrent, Inc. | Segmented shielding for wide area wireless power transmitter |
| KR102456239B1 (ko) * | 2021-04-16 | 2022-10-20 | 주식회사 디에이피 | 도금장치의 이물제거장치 |
| US12003116B2 (en) | 2022-03-01 | 2024-06-04 | Nucurrent, Inc. | Wireless power transfer system for simultaneous transfer to multiple devices with cross talk and interference mitigation |
| US11831174B2 (en) | 2022-03-01 | 2023-11-28 | Nucurrent, Inc. | Cross talk and interference mitigation in dual wireless power transmitter |
| CN115058759B (zh) * | 2022-07-04 | 2024-05-24 | 厦门海辰新材料科技有限公司 | 电镀设备及镀膜机 |
| CN115058757B (zh) * | 2022-07-04 | 2024-05-24 | 厦门海辰新材料科技有限公司 | 电镀设备及镀膜机 |
| CN115058760B (zh) * | 2022-07-04 | 2024-05-24 | 厦门海辰新材料科技有限公司 | 电镀设备及镀膜机 |
| US20250043452A1 (en) * | 2023-07-31 | 2025-02-06 | Lawrence Livermore National Security, Llc | Systems and methods for high density electrochemical additive manufacturing with cmos microanode array |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3347770A (en) * | 1964-09-03 | 1967-10-17 | Gen Dynamics Corp | Area measurement and current density control device |
| US4459183A (en) * | 1981-10-07 | 1984-07-10 | Chemcut Corporation | Electroplating apparatus and method |
| US4385967A (en) | 1981-10-07 | 1983-05-31 | Chemcut Corporation | Electroplating apparatus and method |
| DE3645319C3 (de) * | 1986-07-19 | 2000-07-27 | Atotech Deutschland Gmbh | Anordnung und Verfahren zum elektrolytischen Behandeln von plattenförmigen Gegenständen |
| US5606534A (en) * | 1989-09-01 | 1997-02-25 | Quantronix, Inc. | Laser-based dimensioning system |
| DE3939681A1 (de) * | 1989-12-01 | 1991-06-06 | Schering Ag | Verfahren zur steuerung des ablaufes von galvanischen anlagen, sowie zur durchfuehrung des verfahrens dienender anordnung |
| JPH0525699A (ja) | 1991-07-22 | 1993-02-02 | Hitachi Cable Ltd | メツキ厚みの制御方法 |
| JPH0535855U (ja) | 1991-10-14 | 1993-05-14 | 兵庫日本電気株式会社 | めつき装置 |
| US6395163B1 (en) * | 1992-08-01 | 2002-05-28 | Atotech Deutschland Gmbh | Process for the electrolytic processing especially of flat items and arrangement for implementing the process |
| JPH06228791A (ja) * | 1992-12-07 | 1994-08-16 | Ebara Yuujiraito Kk | 電気めっき装置 |
| JP2757328B2 (ja) | 1993-06-11 | 1998-05-25 | 三菱電機株式会社 | メッキ電流制御装置 |
| DE4417551C2 (de) * | 1994-05-19 | 1996-04-04 | Atotech Deutschland Gmbh | Elektrolytisches Verfahren zum präzisen Behandeln von Leiterplatten und Vorrichtung zur Durchführung des Verfahrens |
| CN1095882C (zh) * | 1994-11-15 | 2002-12-11 | 比利时西门子公司 | 板形工件,特别是印刷电路板的电解加工装置 |
| JPH0971894A (ja) | 1995-09-01 | 1997-03-18 | Kawasaki Steel Corp | 鋼帯の電気メッキ方法 |
| DE19612555C2 (de) * | 1996-03-29 | 1998-03-19 | Atotech Deutschland Gmbh | Verfahren zur selektiven elektrochemischen Behandlung von Leiterplatten und Vorrichtung zur Durchführung des Verfahrens |
| AT406385B (de) * | 1996-10-25 | 2000-04-25 | Andritz Patentverwaltung | Verfahren und vorrichtung zum elektrolytischen beizen von metallischen bändern |
| DE19717510C1 (de) * | 1997-04-25 | 1998-10-01 | Atotech Deutschland Gmbh | Vorrichtung zur Abblendung von Galvanisiergut in Durchlaufanlagen |
| JP2000045099A (ja) | 1998-07-28 | 2000-02-15 | Canon Inc | 電析槽、および電析装置 |
| JP2000096299A (ja) | 1998-09-21 | 2000-04-04 | Nkk Corp | 通電処理槽内の電極装置 |
| JP2001123298A (ja) * | 1999-10-25 | 2001-05-08 | Sumitomo Metal Ind Ltd | 電解めっき方法と多層配線基板とその作製方法 |
-
2001
- 2001-10-27 DE DE10153171A patent/DE10153171B4/de not_active Expired - Lifetime
-
2002
- 2002-10-21 DE DE60212426T patent/DE60212426T2/de not_active Expired - Lifetime
- 2002-10-21 JP JP2003540418A patent/JP4268874B2/ja not_active Expired - Lifetime
- 2002-10-21 AU AU2002348997A patent/AU2002348997A1/en not_active Abandoned
- 2002-10-21 ES ES02781274T patent/ES2265516T3/es not_active Expired - Lifetime
- 2002-10-21 EP EP02781274A patent/EP1438447B1/de not_active Expired - Lifetime
- 2002-10-21 US US10/488,352 patent/US7563352B2/en not_active Expired - Lifetime
- 2002-10-21 WO PCT/EP2002/011764 patent/WO2003038159A2/en not_active Ceased
- 2002-10-21 CA CA002454267A patent/CA2454267A1/en not_active Abandoned
- 2002-10-21 CN CNB028214315A patent/CN1325699C/zh not_active Expired - Lifetime
- 2002-10-21 AT AT02781274T patent/ATE330046T1/de active
- 2002-10-21 KR KR1020047002449A patent/KR100956536B1/ko not_active Expired - Lifetime
- 2002-10-21 BR BR0213532-9A patent/BR0213532A/pt not_active IP Right Cessation
- 2002-10-21 MX MXPA04003963A patent/MXPA04003963A/es active IP Right Grant
- 2002-10-25 TW TW91125044A patent/TW574434B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CN1578853A (zh) | 2005-02-09 |
| JP2005507463A (ja) | 2005-03-17 |
| AU2002348997A1 (en) | 2003-05-12 |
| CN1325699C (zh) | 2007-07-11 |
| DE10153171B4 (de) | 2004-09-16 |
| US20040245093A1 (en) | 2004-12-09 |
| DE60212426D1 (de) | 2006-07-27 |
| JP4268874B2 (ja) | 2009-05-27 |
| DE10153171A1 (de) | 2003-05-22 |
| KR20050038574A (ko) | 2005-04-27 |
| TW574434B (en) | 2004-02-01 |
| US7563352B2 (en) | 2009-07-21 |
| HK1063341A1 (en) | 2004-12-24 |
| DE60212426T2 (de) | 2007-05-31 |
| EP1438447A2 (de) | 2004-07-21 |
| ES2265516T3 (es) | 2007-02-16 |
| WO2003038159A3 (en) | 2003-10-09 |
| MXPA04003963A (es) | 2004-06-18 |
| KR100956536B1 (ko) | 2010-05-07 |
| WO2003038159A2 (en) | 2003-05-08 |
| EP1438447B1 (de) | 2006-06-14 |
| BR0213532A (pt) | 2004-10-19 |
| CA2454267A1 (en) | 2003-05-08 |
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| UEP | Publication of translation of european patent specification |
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