AU732569B2 - Substrate processing apparatus, substrate support apparatus, substrate processing method, and substrate fabrication method - Google Patents

Substrate processing apparatus, substrate support apparatus, substrate processing method, and substrate fabrication method Download PDF

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Publication number
AU732569B2
AU732569B2 AU81902/98A AU8190298A AU732569B2 AU 732569 B2 AU732569 B2 AU 732569B2 AU 81902/98 A AU81902/98 A AU 81902/98A AU 8190298 A AU8190298 A AU 8190298A AU 732569 B2 AU732569 B2 AU 732569B2
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AU
Australia
Prior art keywords
substrate
wafer
substrates
pressing
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU81902/98A
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English (en)
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AU8190298A (en
Inventor
Toru Takisawa
Kenji Yamagata
Takao Yonehara
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Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of AU8190298A publication Critical patent/AU8190298A/en
Application granted granted Critical
Publication of AU732569B2 publication Critical patent/AU732569B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/19—Preparing inhomogeneous wafers
    • H10P90/1904—Preparing vertically inhomogeneous wafers
    • H10P90/1906—Preparing SOI wafers
    • H10P90/1914—Preparing SOI wafers using bonding

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
AU81902/98A 1997-08-27 1998-08-26 Substrate processing apparatus, substrate support apparatus, substrate processing method, and substrate fabrication method Ceased AU732569B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9-231132 1997-08-27
JP9231132A JPH1174164A (ja) 1997-08-27 1997-08-27 基板処理装置、基板支持装置及び基板処理方法並びに基板の製造方法

Publications (2)

Publication Number Publication Date
AU8190298A AU8190298A (en) 1999-03-11
AU732569B2 true AU732569B2 (en) 2001-04-26

Family

ID=16918791

Family Applications (1)

Application Number Title Priority Date Filing Date
AU81902/98A Ceased AU732569B2 (en) 1997-08-27 1998-08-26 Substrate processing apparatus, substrate support apparatus, substrate processing method, and substrate fabrication method

Country Status (8)

Country Link
US (2) US6451670B1 (2)
EP (1) EP0899778A3 (2)
JP (1) JPH1174164A (2)
KR (1) KR100396014B1 (2)
CN (1) CN1209644A (2)
AU (1) AU732569B2 (2)
SG (1) SG65092A1 (2)
TW (1) TW480617B (2)

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US6940089B2 (en) 2001-04-04 2005-09-06 Massachusetts Institute Of Technology Semiconductor device structure
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JP4711904B2 (ja) * 2006-07-31 2011-06-29 日東電工株式会社 半導体ウエハへの粘着テープ貼付け方法および半導体ウエハからの保護テープ剥離方法
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JP5476657B2 (ja) * 2007-04-10 2014-04-23 株式会社ニコン 基板ホルダ、基板接合装置および基板接合方法
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US8042590B2 (en) * 2010-02-03 2011-10-25 C Sum Mfg. Ltd. Protection mechanism for dry film laminator
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JP5913914B2 (ja) * 2011-11-08 2016-04-27 東京応化工業株式会社 基板処理装置及び基板処理方法
JP5139604B1 (ja) * 2011-11-25 2013-02-06 信越エンジニアリング株式会社 基板搬送装置及び基板組み立てライン
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JP6501447B2 (ja) * 2013-03-26 2019-04-17 芝浦メカトロニクス株式会社 貼合装置および貼合基板の製造方法
US10586727B2 (en) 2013-09-25 2020-03-10 Shibaura Mechatronics Corporation Suction stage, lamination device, and method for manufacturing laminated substrate
JP6177739B2 (ja) * 2014-08-07 2017-08-09 東京エレクトロン株式会社 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体
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US9570488B2 (en) 2014-09-19 2017-02-14 Microsoft Technology Licensing, Llc Image sensor bending by induced substrate swelling
US9870927B2 (en) 2015-04-02 2018-01-16 Microsoft Technology Licensing, Llc Free-edge semiconductor chip bending
US10304900B2 (en) 2015-04-02 2019-05-28 Microsoft Technology Licensing, Llc Bending semiconductor chip in molds having radially varying curvature
SG11201706844QA (en) 2015-04-10 2017-10-30 Ev Group E Thallner Gmbh Substrate holder and method for bonding two substrates
KR102507283B1 (ko) 2015-12-22 2023-03-07 삼성전자주식회사 기판 척 및 이를 포함하는 기판 접합 시스템
EP3417477B1 (de) 2016-02-16 2020-01-29 EV Group E. Thallner GmbH Verfahren zum bonden von substraten
EP3433875B1 (de) 2016-03-22 2022-05-04 EV Group E. Thallner GmbH Verfahren zum bonden von substraten
JP6782087B2 (ja) * 2016-03-28 2020-11-11 株式会社日本マイクロニクス シート治具、ステージ、製造装置、及び二次電池の製造方法
KR102651753B1 (ko) * 2016-07-12 2024-03-28 가부시키가이샤 니콘 적층 기판 제조 방법, 적층 기판 제조 장치, 적층 기판 제조 시스템, 및 기판 처리 장치
CN105957817A (zh) * 2016-07-12 2016-09-21 武汉新芯集成电路制造有限公司 一种晶圆键合方法
KR102300481B1 (ko) * 2016-08-12 2021-09-10 에베 그룹 에. 탈너 게엠베하 기판을 접합하기 위한 방법 및 샘플 홀더
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TW201826333A (zh) * 2016-11-16 2018-07-16 日商尼康股份有限公司 保持構件、接合裝置、及接合方法
KR102395194B1 (ko) * 2017-06-21 2022-05-06 삼성전자주식회사 웨이퍼 본딩 장치 및 그 장치를 포함한 웨이퍼 본딩 시스템
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TWI766105B (zh) 2017-09-28 2022-06-01 美商魯道夫科技股份有限公司 晶圓級封裝組裝體處置
KR102356595B1 (ko) 2017-11-28 2022-01-28 삼성디스플레이 주식회사 플렉시블 디스플레이 장치의 제조방법 및 제조장치
KR102455415B1 (ko) * 2017-12-18 2022-10-17 삼성전자주식회사 기판 접합 장치 및 이를 이용한 기판의 접합 방법
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JPH04324613A (ja) * 1991-04-24 1992-11-13 Sony Corp ウエハの貼り合わせ方法
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Also Published As

Publication number Publication date
KR19990023901A (ko) 1999-03-25
TW480617B (en) 2002-03-21
KR100396014B1 (ko) 2003-10-17
US6451670B1 (en) 2002-09-17
JPH1174164A (ja) 1999-03-16
EP0899778A2 (en) 1999-03-03
AU8190298A (en) 1999-03-11
US6706618B2 (en) 2004-03-16
US20020182038A1 (en) 2002-12-05
CN1209644A (zh) 1999-03-03
US20020034859A1 (en) 2002-03-21
SG65092A1 (en) 1999-05-25
EP0899778A3 (en) 2001-03-21

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