SG65092A1 - Substrate processing apparatus substrate support apparatus substrate processing method and substrate fabrication method - Google Patents

Substrate processing apparatus substrate support apparatus substrate processing method and substrate fabrication method

Info

Publication number
SG65092A1
SG65092A1 SG1998003112A SG1998003112A SG65092A1 SG 65092 A1 SG65092 A1 SG 65092A1 SG 1998003112 A SG1998003112 A SG 1998003112A SG 1998003112 A SG1998003112 A SG 1998003112A SG 65092 A1 SG65092 A1 SG 65092A1
Authority
SG
Singapore
Prior art keywords
substrate
substrate processing
support apparatus
fabrication method
processing apparatus
Prior art date
Application number
SG1998003112A
Other languages
English (en)
Inventor
Toru Takisawa
Takao Yonehara
Kenji Yamagata
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Publication of SG65092A1 publication Critical patent/SG65092A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/19—Preparing inhomogeneous wafers
    • H10P90/1904—Preparing vertically inhomogeneous wafers
    • H10P90/1906—Preparing SOI wafers
    • H10P90/1914—Preparing SOI wafers using bonding
SG1998003112A 1997-08-27 1998-08-17 Substrate processing apparatus substrate support apparatus substrate processing method and substrate fabrication method SG65092A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9231132A JPH1174164A (ja) 1997-08-27 1997-08-27 基板処理装置、基板支持装置及び基板処理方法並びに基板の製造方法

Publications (1)

Publication Number Publication Date
SG65092A1 true SG65092A1 (en) 1999-05-25

Family

ID=16918791

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1998003112A SG65092A1 (en) 1997-08-27 1998-08-17 Substrate processing apparatus substrate support apparatus substrate processing method and substrate fabrication method

Country Status (8)

Country Link
US (2) US6451670B1 (2)
EP (1) EP0899778A3 (2)
JP (1) JPH1174164A (2)
KR (1) KR100396014B1 (2)
CN (1) CN1209644A (2)
AU (1) AU732569B2 (2)
SG (1) SG65092A1 (2)
TW (1) TW480617B (2)

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JP6782087B2 (ja) * 2016-03-28 2020-11-11 株式会社日本マイクロニクス シート治具、ステージ、製造装置、及び二次電池の製造方法
KR102651753B1 (ko) * 2016-07-12 2024-03-28 가부시키가이샤 니콘 적층 기판 제조 방법, 적층 기판 제조 장치, 적층 기판 제조 시스템, 및 기판 처리 장치
CN105957817A (zh) * 2016-07-12 2016-09-21 武汉新芯集成电路制造有限公司 一种晶圆键合方法
KR102300481B1 (ko) * 2016-08-12 2021-09-10 에베 그룹 에. 탈너 게엠베하 기판을 접합하기 위한 방법 및 샘플 홀더
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KR102468794B1 (ko) 2018-07-06 2022-11-18 삼성전자주식회사 웨이퍼 본딩 장치 및 이를 이용한 웨이퍼 본딩 시스템
CN111599664B (zh) * 2019-02-21 2023-06-23 株洲中车时代半导体有限公司 一种硅片承载装置以及非对称扩散掺杂方法
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Also Published As

Publication number Publication date
KR19990023901A (ko) 1999-03-25
TW480617B (en) 2002-03-21
KR100396014B1 (ko) 2003-10-17
US6451670B1 (en) 2002-09-17
JPH1174164A (ja) 1999-03-16
EP0899778A2 (en) 1999-03-03
AU8190298A (en) 1999-03-11
US6706618B2 (en) 2004-03-16
AU732569B2 (en) 2001-04-26
US20020182038A1 (en) 2002-12-05
CN1209644A (zh) 1999-03-03
US20020034859A1 (en) 2002-03-21
EP0899778A3 (en) 2001-03-21

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