BRPI0915785A2 - método para depositar eletroquimicamente um metal sobre um substrato - Google Patents

método para depositar eletroquimicamente um metal sobre um substrato

Info

Publication number
BRPI0915785A2
BRPI0915785A2 BRPI0915785A BRPI0915785A BRPI0915785A2 BR PI0915785 A2 BRPI0915785 A2 BR PI0915785A2 BR PI0915785 A BRPI0915785 A BR PI0915785A BR PI0915785 A BRPI0915785 A BR PI0915785A BR PI0915785 A2 BRPI0915785 A2 BR PI0915785A2
Authority
BR
Brazil
Prior art keywords
metal
silica particles
substrate
quaternized
solution
Prior art date
Application number
BRPI0915785A
Other languages
English (en)
Portuguese (pt)
Inventor
Hermann-Josef Middeke
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of BRPI0915785A2 publication Critical patent/BRPI0915785A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/02—Electrophoretic coating characterised by the process with inorganic material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Battery Electrode And Active Subsutance (AREA)
BRPI0915785A 2008-07-15 2009-07-10 método para depositar eletroquimicamente um metal sobre um substrato BRPI0915785A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP08075637A EP2145986B1 (de) 2008-07-15 2008-07-15 Lösung und Verfahren zur elektrochemischen Abscheidung eines Metalls auf ein Substrat
PCT/EP2009/005192 WO2010006800A1 (en) 2008-07-15 2009-07-10 Method for electrochemically depositing a metal on a substrate

Publications (1)

Publication Number Publication Date
BRPI0915785A2 true BRPI0915785A2 (pt) 2015-11-10

Family

ID=40010705

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0915785A BRPI0915785A2 (pt) 2008-07-15 2009-07-10 método para depositar eletroquimicamente um metal sobre um substrato

Country Status (12)

Country Link
US (1) US20110132766A1 (de)
EP (1) EP2145986B1 (de)
JP (1) JP5674655B2 (de)
KR (1) KR20110039438A (de)
CN (1) CN102066622B (de)
AT (1) ATE462025T1 (de)
BR (1) BRPI0915785A2 (de)
CA (1) CA2723827A1 (de)
DE (1) DE602008000878D1 (de)
ES (1) ES2339614T3 (de)
PL (1) PL2145986T3 (de)
WO (1) WO2010006800A1 (de)

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US20110155582A1 (en) 2009-11-18 2011-06-30 Tremmel Robert A Semi-Bright Nickel Plating Bath and Method of Using Same
EP2551375A1 (de) * 2011-07-26 2013-01-30 Atotech Deutschland GmbH Stromlose Vernickelungsbadzusammensetzung
US8871077B2 (en) * 2011-10-14 2014-10-28 GM Global Technology Operations LLC Corrosion-resistant plating system
JP6024714B2 (ja) * 2013-10-03 2016-11-16 トヨタ自動車株式会社 成膜用ニッケル溶液およびこれを用いた成膜方法
DE102014207778B3 (de) * 2014-04-25 2015-05-21 Kiesow Dr. Brinkmann GmbH & Co. KG Verwendung einer Mischung zur Verwendung in einem galvanischen Bad oder eines galvanischen Bades zur Herstellung einer Glanznickelschicht sowie Verfahren zur Herstellung eines Artikels mit einer Glanznickelschicht
CN106471158B (zh) * 2014-06-23 2019-05-31 惠普发展公司有限责任合伙企业 制造多层涂层的方法以及涂覆的基材
CA2963446A1 (en) 2014-10-24 2016-04-28 Basf Se Nonampholytic, quaternizable and water-soluble polymers for modifying the surface charge of solid particles
CN104790004A (zh) * 2015-03-11 2015-07-22 嘉兴敏惠汽车零部件有限公司 镀镍和\或铬部件及其制造方法
JP6524939B2 (ja) * 2016-02-26 2019-06-05 豊田合成株式会社 ニッケルめっき皮膜及びその製造方法
EP3456870A1 (de) * 2017-09-13 2019-03-20 ATOTECH Deutschland GmbH Bad und verfahren zum füllen eines senkrechten verbindungszugangs für ein werkstück mit nickel oder nickellegierung
PL238262B1 (pl) * 2017-12-04 2021-08-02 Zakl Wyrobow Galanteryjnych Spolka Z Ograniczona Odpowiedzialnoscia Sposób elektrochemicznego wytwarzania wielowarstwowych powłok metalicznych, zwłaszcza niklowych, o zwiększonej odporności na korozję
DE102018005348B4 (de) * 2018-07-05 2025-12-04 Dr.-Ing. Max Schlötter GmbH & Co KG Kontaktoberflächen mit Dispersions-Silberschichten
CN108914173B (zh) * 2018-07-13 2021-03-23 中国科学院金属研究所 一种含有二氧化硅颗粒的铁镍复合镀层的制备方法
CN109183131B (zh) * 2018-07-16 2020-06-16 东南大学 一种SiO2基复合超疏水金属表面的制备方法
CN112899741B (zh) * 2021-01-21 2022-03-15 长春理工大学 在金属表面加工二氧化硅-镍复合疏水耐腐蚀涂层的方法
CN113436775B (zh) * 2021-06-23 2022-11-08 中国核动力研究设计院 一种无衬底超薄镍-63放射源的制备方法
CN115012008B (zh) * 2022-03-31 2023-09-19 九牧厨卫股份有限公司 一种提高附着力的环保复合涂镀层及其制备方法
CN118272877B (zh) * 2024-04-07 2024-10-15 深圳御矿新材料有限公司 高强度铝镁合金预镀镍带材及其生成工艺
CN119530910A (zh) * 2024-12-03 2025-02-28 崇辉半导体(江门)有限公司 一种电镀粗镍的工艺

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Also Published As

Publication number Publication date
PL2145986T3 (pl) 2010-09-30
JP5674655B2 (ja) 2015-02-25
CN102066622B (zh) 2013-03-27
ES2339614T3 (es) 2010-05-21
KR20110039438A (ko) 2011-04-18
EP2145986B1 (de) 2010-03-24
US20110132766A1 (en) 2011-06-09
ATE462025T1 (de) 2010-04-15
JP2011528063A (ja) 2011-11-10
WO2010006800A1 (en) 2010-01-21
CN102066622A (zh) 2011-05-18
DE602008000878D1 (de) 2010-05-06
EP2145986A1 (de) 2010-01-20
CA2723827A1 (en) 2010-01-21

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 7A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2376 DE 19-07-2016 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.