EP2868775A3 - Procédé et bain de placage - Google Patents

Procédé et bain de placage Download PDF

Info

Publication number
EP2868775A3
EP2868775A3 EP14191882.1A EP14191882A EP2868775A3 EP 2868775 A3 EP2868775 A3 EP 2868775A3 EP 14191882 A EP14191882 A EP 14191882A EP 2868775 A3 EP2868775 A3 EP 2868775A3
Authority
EP
European Patent Office
Prior art keywords
plating bath
tin
combination
brightening agents
void formation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14191882.1A
Other languages
German (de)
English (en)
Other versions
EP2868775A2 (fr
Inventor
Julia WOERTINK
Yi Qin
Jonathan D. PRANGE
Pedro O. LOPEZ MONTESINOS
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials International LLC
Original Assignee
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials LLC
Publication of EP2868775A2 publication Critical patent/EP2868775A2/fr
Publication of EP2868775A3 publication Critical patent/EP2868775A3/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
EP14191882.1A 2013-11-05 2014-11-05 Procédé et bain de placage Withdrawn EP2868775A3 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/071,677 US20150122661A1 (en) 2013-11-05 2013-11-05 Plating bath and method

Publications (2)

Publication Number Publication Date
EP2868775A2 EP2868775A2 (fr) 2015-05-06
EP2868775A3 true EP2868775A3 (fr) 2015-08-12

Family

ID=51932182

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14191882.1A Withdrawn EP2868775A3 (fr) 2013-11-05 2014-11-05 Procédé et bain de placage

Country Status (6)

Country Link
US (1) US20150122661A1 (fr)
EP (1) EP2868775A3 (fr)
JP (1) JP2015092021A (fr)
KR (1) KR20150051926A (fr)
CN (1) CN104674312A (fr)
TW (1) TW201533278A (fr)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5590259B1 (ja) * 2014-01-28 2014-09-17 千住金属工業株式会社 Ｃｕ核ボール、はんだペーストおよびはんだ継手
US20190256994A1 (en) * 2016-02-16 2019-08-22 Lumishield Technologies Incorporated Electrochemical Deposition of Elements in Aqueous Media
US20170321340A1 (en) * 2016-03-08 2017-11-09 Washington State University Method of electroplating tin films with indium using an alkanesulfonic acid based electrolyte
US10879156B2 (en) 2016-03-08 2020-12-29 Washington State University Mitigation of whisker growth in tin coatings by alloying with indium
KR101757192B1 (ko) * 2016-03-30 2017-07-12 주식회사 호진플라텍 웨이퍼 범프 도금을 위한 주석-은 합금 전기도금액
JP6818520B2 (ja) * 2016-11-11 2021-01-20 ローム・アンド・ハース電子材料株式会社 中性スズめっき液を用いたバレルめっきまたは高速回転めっき方法
WO2019079199A1 (fr) * 2017-10-19 2019-04-25 Lam Research Corporation Placage multibain d'un métal unique
JP6620859B2 (ja) * 2017-10-24 2019-12-18 三菱マテリアル株式会社 錫又は錫合金めっき堆積層の形成方法
US11268203B2 (en) * 2017-10-24 2022-03-08 Mitsubishi Materials Corporation Tin or tin alloy plating solution
US11459665B2 (en) 2017-12-20 2022-10-04 Basf Se Composition for tin or tin alloy electroplating comprising suppressing agent
US20190259722A1 (en) * 2018-02-21 2019-08-22 Rohm And Haas Electronic Materials Llc Copper pillars having improved integrity and methods of making the same
SG11202009106XA (en) * 2018-04-20 2020-11-27 Basf Se Composition for tin or tin alloy electroplating comprising suppressing agent
JP7035821B2 (ja) * 2018-06-05 2022-03-15 トヨタ自動車株式会社 成膜用金属溶液及び金属被膜の成膜方法
KR102634250B1 (ko) * 2018-12-27 2024-02-07 솔브레인 주식회사 도금 조성물 및 솔더 범프 형성 방법
CN114514340B (zh) 2019-07-26 2025-03-21 朗姆研究公司 先进封装应用的差别对比镀覆
US12305307B2 (en) 2020-01-10 2025-05-20 Lam Research Corporation TSV process window and fill performance enhancement by long pulsing and ramping
WO2021193696A1 (fr) * 2020-03-27 2021-09-30 三菱マテリアル株式会社 Solution d'électrodéposition et procédé d'électrodéposition
JP7732205B2 (ja) * 2020-03-27 2025-09-02 三菱マテリアル株式会社 電解めっき液及び電解めっき方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4582576A (en) * 1985-03-26 1986-04-15 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
US5061351A (en) * 1990-07-23 1991-10-29 Enthone-Omi, Inc. Bright tin electrodeposition composition
JP4362568B2 (ja) * 2000-06-02 2009-11-11 奥野製薬工業株式会社 錫−銅合金電気めっき液
US20110189848A1 (en) * 2008-10-21 2011-08-04 Ingo Ewert Method to form solder deposits on substrates

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL151449B (nl) * 1966-09-14 1976-11-15 Philips Nv Werkwijze voor de bereiding van een zuur bad voor het elektrolytisch neerslaan van tin.
US4384930A (en) * 1981-08-21 1983-05-24 Mcgean-Rohco, Inc. Electroplating baths, additives therefor and methods for the electrodeposition of metals
US4871429A (en) 1981-09-11 1989-10-03 Learonal, Inc Limiting tin sludge formation in tin or tin/lead electroplating solutions
JPH0233795B2 (ja) * 1983-05-16 1990-07-30 Matsugiin Rooko Inc Metsukyokusoseibutsu
US5174887A (en) 1987-12-10 1992-12-29 Learonal, Inc. High speed electroplating of tinplate
JP2001181889A (ja) * 1999-12-22 2001-07-03 Nippon Macdermid Kk 光沢錫−銅合金電気めっき浴
US6578754B1 (en) * 2000-04-27 2003-06-17 Advanpack Solutions Pte. Ltd. Pillar connections for semiconductor chips and method of manufacture
US6818545B2 (en) 2001-03-05 2004-11-16 Megic Corporation Low fabrication cost, fine pitch and high reliability solder bump
TWI245402B (en) 2002-01-07 2005-12-11 Megic Corp Rod soldering structure and manufacturing process thereof
TWI240979B (en) 2004-10-28 2005-10-01 Advanced Semiconductor Eng Bumping process
KR100921919B1 (ko) 2007-11-16 2009-10-16 (주)화백엔지니어링 반도체 칩에 형성되는 구리기둥-주석범프 및 그의 형성방법
JP5554718B2 (ja) * 2007-12-11 2014-07-23 エンソン インコーポレイテッド ナノ粒子を含む金属系複合コーティングの電解デポジット
JP5583894B2 (ja) * 2008-06-12 2014-09-03 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 電気錫めっき液および電気錫めっき方法
JP5033979B1 (ja) * 2011-09-29 2012-09-26 ユケン工業株式会社 スズからなるめっき用酸性水系組成物
US8888984B2 (en) * 2012-02-09 2014-11-18 Rohm And Haas Electronic Materials Llc Plating bath and method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4582576A (en) * 1985-03-26 1986-04-15 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
US5061351A (en) * 1990-07-23 1991-10-29 Enthone-Omi, Inc. Bright tin electrodeposition composition
JP4362568B2 (ja) * 2000-06-02 2009-11-11 奥野製薬工業株式会社 錫−銅合金電気めっき液
US20110189848A1 (en) * 2008-10-21 2011-08-04 Ingo Ewert Method to form solder deposits on substrates

Also Published As

Publication number Publication date
CN104674312A (zh) 2015-06-03
US20150122661A1 (en) 2015-05-07
KR20150051926A (ko) 2015-05-13
TW201533278A (zh) 2015-09-01
JP2015092021A (ja) 2015-05-14
EP2868775A2 (fr) 2015-05-06

Similar Documents

Publication Publication Date Title
EP2868775A3 (fr) Procédé et bain de placage
EP2868778A3 (fr) Procédé et bain de placage
EP2626449A3 (fr) Appareil et bain de placage
EP3575439A4 (fr) Bain électrolytique, dispositif d'électrolyse, procédé d'électrolyse et procédé de production d'hydrogène
EP2886683A3 (fr) Bain d'électrodéposition et procédé de production de couches de chrome sombre
SG11201406599RA (en) Copper-nickel alloy electroplating bath and plating method
PT2852698T (pt) Banho de galvanoplastia de níquel ou liga de níquel galvânico para depositar um níquel ou liga de níquel semibrilhante, método para a galvanoplastia e utilização de um tal banho e compostos para o mesmo
PT3356579T (pt) Banho de galvanoplastia para deposição eletroquímica de uma camada de liga de cu-sn-zn-pd, método para a deposição eletroquímica da referida camada de liga, substrato que compreende a referida camada de liga e utilizações do substrato revestido
EP2662478A4 (fr) Bain galvanoplastique électrique de sels fusionnés d'alliage d'aluminium ou d'aluminium, permettant d'obtenir un bon pouvoir de pénétration, procédé de galvanoplastie et procédé de prétraitement utilisant un tel bain
EP3156522A4 (fr) Bain d'électrodéposition d'étain et film de placage d'étain
EP2395131A4 (fr) Bain de placage d'alliage contenant de l'argent et procédé de placage électrolytique utilisant celui-ci
EP2287365A4 (fr) Bain galvanoplastique d'alliage cuivre-zinc et procédé de placage l'utilisant
PT3481976T (pt) Método para a deposição galvânica de camadas de zinco e de ligas de zinco a partir de um banho de revestimento alcalino com degradação reduzida de aditivos orgânicos do banho
PL3015571T3 (pl) Kwasowa kompozycja kąpieli galwanicznej do powlekania cynkiem i stopem cynkowo- niklowym oraz sposób powlekania galwanicznego
EP2683853A4 (fr) Bain de placage de nickel semi-brillant et procédé d'utilisation de ce dernier
PL2675942T3 (pl) Alkaliczna, wodna kąpiel do osadzania galwanicznego stopu cynk-żelazo i sposób jej stosowania
WO2015187402A8 (fr) Bain de dépôt de nickel autocatalytique aqueux et son procédé d'utilisation
EP2791388A4 (fr) Placage électrolytique d'argent sur du graphite
PL3380649T3 (pl) Kompozycja kąpieli galwanicznej i sposób bezprądowego powlekania palladem
PL2730682T3 (pl) Alkaliczny, bezcyjankowy roztwór do galwanizacji stopami złota, sposób galwanizacji i podłoże zawierające błyszczący, wolny od korozji osad stopu złota
SG10201913013PA (en) Electroless nickel-phosphorous plating baths with reduced ion concentration and methods of use
EP2460910A4 (fr) Bain de placage d'alliage contenant de l'étain, procédé d'électroplacage utilisant ce bain et base sur laquelle un matériau est déposé par électroplacage
SG10202005951YA (en) Methods of reducing or eliminating deposits after electrochemical plating in an electroplating processor
PL3415665T3 (pl) Sposób osadzania galwanicznego powłok ze stopu cynku i niklu z alkalicznej kąpieli stopu cynku i niklu z ograniczoną degradacją dodatków
PL3705601T3 (pl) Kąpiel do złocenia bezprądowego

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20141105

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

RIC1 Information provided on ipc code assigned before grant

Ipc: C25D 3/32 20060101AFI20150703BHEP

Ipc: C25D 3/60 20060101ALI20150703BHEP

Ipc: C25D 7/12 20060101ALI20150703BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN

18W Application withdrawn

Effective date: 20151221